This article provides a clear but nonexhaustive description of the general principle of atomic emission, with a particular focus on instrumentation, and summarizes the main characteristics of the inductively coupled plasma optical emission spectrometer technique. Basic atomic theory as well as the instrument characteristics and their influence on the instrument performances are presented. The advantages, drawbacks, and developments of this technique are discussed, and, finally, alternative techniques and examples of applications are provided.

Identification of alloys using quantitative chemical analysis is an essential step during a metallurgical failure analysis process. There are several methods available for quantitative analysis of metal alloys, and the analyst should carefully approach selection of the method used. The choice of appropriate analytical techniques is determined by the specific chemical information required, the condition of the sample, and any limitations imposed by interested parties. This article discusses some of the commonly used quantitative chemical analysis techniques for metals. The discussion covers the operating principles, applications, advantages, and disadvantages of optical emission spectroscopy (OES), inductively coupled plasma optical emission spectroscopy (ICP-OES), X-ray spectroscopy, and ion chromatography (IC). In addition, information on combustion analysis and inert gas fusion analysis is provided.

Inductively coupled plasma atomic emission spectroscopy (ICP-AES) is an analytical technique for elemental determinations in the concentration range of major to trace based on the principles of atomic spectroscopy. This article provides a description of the basic atomic theory, and explains the analytical procedures and various interference effects of ICP, namely, spectral, vaporization-atomization, and ionization. It provides a detailed discussion on the principal components of an analytical ICP system, namely, the sample introduction system; ICP torch and argon gas supplies; radio-frequency generator and associated electronics; spectrometers, such as polychromators and monochromators; detection electronics and interface; and the system computer with appropriate hardware and software. The article also describes the uses of direct-current plasma, and provides examples of the applications of ICP-AES.

This article briefly discusses popular techniques for metals characterization. It begins with a description of the most common techniques for determining chemical composition of metals, namely X-ray fluorescence, optical emission spectroscopy, inductively coupled plasma optical emission spectroscopy, high-temperature combustion, and inert gas fusion. This is followed by a section on techniques for determining the atomic structure of crystals, namely X-ray diffraction, neutron diffraction, and electron diffraction. Types of electron microscopies most commonly used for microstructural analysis of metals, such as scanning electron microscopy, electron probe microanalysis, and transmission electron microscopy, are then reviewed. The article contains tables listing analytical methods used for characterization of metals and alloys and surface analysis techniques. It ends by discussing the objective of metallography.

Sputtering is a nonthermal vaporization process in which the surface atoms are physically ejected from a surface by momentum transfer from an energetic bombarding species of atomic/molecular size. It uses a glow discharge or an ion beam to generate a flux of ions incident on the target surface. This article provides an overview of the advantages and limitations of sputter deposition. It focuses on the most common sputtering techniques, namely, diode sputtering, radio-frequency sputtering, triode sputtering, magnetron sputtering, and unbalanced magnetron sputtering. The article discusses the fundamentals of plasma formation and the interactions on the target surface. A comparison of reactive and nonreactive sputtering is also provided. The article concludes with a discussion on the several methods of process control and the applications of sputtered films.

This article discusses the capabilities and limitations of various material characterization methods that assist in the selection of a proper analytical tool for analyzing particulate materials. Commonly used methods are microanalysis, surface analysis, and bulk analysis. The techniques used for performing microanalysis include scanning electron microscopy and electron probe X-ray microanalysis. The article describes surface analysis techniques, including Auger electron spectroscopy, X-ray photoelectron spectroscopy, and ion-scattering spectroscopy. Bulk analysis techniques, such as X-ray powder diffraction, inductively coupled plasma atomic emission spectroscopy, atomic absorption spectroscopy, and atomic fluorescence spectrometry, are also discussed.

Plasma melting is a material-processing technique in which the heat of thermal plasma is used to melt a material. This article discusses two typical design principles of plasma torches in the transferred mode: the tungsten tip design and the hollow copper electrode design. It describes the sources of atmospheric contamination in plasma melting furnaces and their control measures. The equipment used in plasma melting furnaces are also discussed. The article provides a detailed discussion on various plasma melting processes, such as plasma consolidation, plasma arc remelting, plasma cold hearth melting, and plasma casting.

This article presents a general description of pulsed-laser deposition. It describes the components of pulsed-laser deposition equipment. The article also discusses the effects of angular distribution of materials. Finally, the article reviews the characteristics of high-temperature superconductors and ferroelectric materials.

This article introduces thermal spray coatings and describes the various types of coating processes and coating devices, including the flame spray, electric-arc spray, plasma spray, transferred plasma arc, high-velocity oxyfuel, and detonation gun. It provides information on the surface preparation methods and finishing treatments of coated parts. The article also explains the tests to evaluate the coating quality and the effects of coating structures and mechanical properties on coated parts. It concludes with a discussion on the uses of thermal spray coatings.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

Plasma arc welding (PAW) can be defined as a gas-shielded arc welding process where the coalescence of metals is achieved via the heat transferred by an arc that is created between a tungsten electrode and a workpiece. This article focuses on the operating principles and procedures, current and operating modes, advantages, disadvantages, and applications of PAW. It discusses the personnel and equipment requirements, as well as the joints used in the process. The power source, plasma control console, water cooler, welding torch, and gas supply system for the plasma and shielding gases are also reviewed.

This article presents a summary of the current and new materials and processing techniques for thermal barrier coatings (TBCs) and environmental barrier coatings (EBCs). Different thermal spraying and postspraying processing techniques are required to produce coatings with optimal performance. For TBCs and EBCs, the elastic modulus, mechanical strength, and toughness values are extremely important in predicting failure behavior under stress and strain conditions, mainly for modeling purposes. Sand and/or volcanic ash particles are molten in the hot zones of turbines and deposited over TBCs and EBCs. They form calcium-magnesium-aluminosilicate (CMAS) glassy deposits.

Plasma (ion) nitriding is a method of surface hardening using glow-discharge technology to introduce nascent (elemental) nitrogen to the surface of a metal part for subsequent diffusion into the material. This article describes the procedures and applications of plasma nitriding methods of steel. These methods include direct-current plasma nitriding, pulsed-current plasma nitriding, and active-screen plasma nitriding. The article reviews cold-walled and hot-walled furnaces used for plasma nitriding. It provides information on the importance of controlling three process parameters: atmosphere, pressure, and part temperature. The article includes a discussion on the influence of nitrogen concentration on case structure formation on nitrided steel, and explains the significance of microstructure, hardness, and fatigue strength on nitrided case. It also discusses processing, laboratory studies, and applications of nitrocarburizing of steel.

This article describes the characteristics of continuous cathodic arc sources and filtering process for removing macroparticles from a cathodic arc. It provides information on the types of arc sources and the properties of deposited materials. The advantages, limitations, and applications of arc deposition are also discussed.

This article reviews the use of thermal spray polymer coatings as a replacement for paints. It discusses the applications of the thermal spray forming process. The article also provides information on the applications of thermal spray in metal processing, textile and plastics, and ceramic and glass manufacturing industries.

Plasma arc welding (PAW) can be defined as a gas-shielded arc welding process where the coalescence of metals is achieved via the heat transferred by an arc that is created between a tungsten electrode and a workpiece. This article discusses the melt-in mode and the keyhole mode of the PAW process, as well as the advantages and disadvantages. It describes the components of a basic PAW system, namely the power source, plasma control console, water cooler, welding torch, and gas supply system for the plasma and shielding gases. The article provides information on the applications of the PAW process and discusses the typical components and joints used. It concludes with information on personnel requirements and safety issues.

This article is a detailed account of optical emission spectroscopy (OES) for elemental analysis. It begins with a discussion on the historical background of OES and development trends in OES methods. This is followed by a description of the general principles and optical systems of OES, along with various types of emission sources commonly used for OES. Some of the processes involved in calibration and quantification of OES for direct solids analysis by the ratio method are then described. The article ends with a discussion on the applications of each type of emission sources.

This article describes the structure of coatings produced by plasma spraying, vapor deposition, and electrodeposition processes. The main techniques used for microstructure assessment are introduced. The relationship between the microstructure and property is also discussed. The experimental techniques for microstructural characterization include metallographic technique, X-ray diffraction, electron, microscopies, and porosimetry.

This article begins with a list of the factors that influence the properties of physical vapor deposited films. It describes the steps involved in ion plating, namely, surface preparation, nucleation, interface formation, and film growth. The article discusses the factors influencing the properties of ion-plated films. The sources of potential applied on substrate surface, bombarding species, and depositing species are addressed. The article also provides information on the parameters that influence bombardment. It concludes with a discussion on the advantages, limitations, and applications of ion plating.

This article presents the principles of chemical vapor deposition (CVD) with illustrations. It discusses the types of CVD processes, namely, thermal CVD, plasma CVD, laser CVD, closed-reactor CVD, chemical vapor infiltration, and metal-organic CVD. The article reviews the CVD reactions of materials related to hard, tribological, and high-temperature coatings and to free-standing structures. It concludes by reviewing the advantages, disadvantages, and applications of CVD.