This article discusses the basic principles of inductively coupled plasma mass spectrometry (ICP-MS), covering different instruments used for performing ICP-MS analysis. The instruments covered include the sample-introduction system, ICP ion source, mass analyzer, and ion detector. Emphasis is placed on ICP-MS applications in the semiconductor, photovoltaic, materials science, and other electronics and high-technology areas.

Thermal spray processes involve complete or partial melting of a feedstock material in a high-temperature flame, and propelling and depositing the material as a coating on a substrate. This article describes the properties of sprayed electronic materials, including dielectrics, conductors, and resistors, and discusses their implications and associated limitations for device applications and potential remedial measures. The article presents specific examples of electrical/electronic device applications, including electromagnetic interference/radio-frequency interference shielding, planar microwave devices, waveguide devices, sensing devices, solid oxide fuel cells, heating elements, electrodes for capacitors and other electrochemical devices.

Ultrasonic welding (USW) is effectively used to join both similar and dissimilar metals with lap-joint welds. This article describes procedure considerations for the ultrasonic welding of specific material types. It reviews difficult-to-weld alloys, such as carbon and low-alloy steels, high-strength steels, and stainless steel, and provides information on the applications of weldable alloys such as aluminum alloys and copper alloys. The article concludes with a discussion on welding of dissimilar metal (nonferrous-to-nonferrous) combinations and its applications.

Ultrasonic metal welding is a solid-state welding process that produces coalescence through the simultaneous application of localized high-frequency vibratory energy and moderate clamping forces. This article discusses the parameters to be considered when selecting a suitable welder for ultrasonic metal welding. It details the personnel requirements, advantages, limitations, and applications, namely, wire welds, spot welds, continuous seam welds, and microelectronic welds of ultrasonic metal welding.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article provides a brief account of glow discharge mass spectrometry (GDMS) for direct determination of trace elements in solid samples and for fast depth profiling in a great variety of innovative materials. It begins by describing the general principles of GDMS. This is followed by a discussion on the various components of a GDMS system as well as commercial GDMS instruments. A description of processes involved in specimen preparation and cleaning in GDMS is then presented. Various problems pertinent to multielemental calibrations in GDMS are discussed along with measures to overcome them. The article further provides information on the processes involved in the analytical setup of parameters in GDMS, covering the steps involved in the analysis of GDMS data. It ends with a section on the application and interpretation of GDMS in the metals industry.

Aerosol jet printing (AJP) can digitally fabricate intricate patterns on conformal surfaces with applications that include flexible electronics and antennas on complex geometries. Given the potential performance and economic benefits, aerosol jetting was studied and compared with the well-known and competing inkjet printing (IJP). More than 35 of the most relevant, highly cited articles were reviewed, focusing on applications requiring fine features on complex surfaces. The following performance indicators were considered for the comparison of AJP and IJP, because these aspects were the most commonly mentioned within the included articles and were identified as being the most relevant for a comprehensive performance assessment: printing process, line width, overspray, complex surface compatibility, diversity of printable materials, and deposition rate. This article is an account of the results of this comparison study in terms of printing capabilities, ink requirements, and economic aspects.

Laser has found its applications in cutting, drilling, and shock-peening operations of manufacturing industry because of its accurate, safe, and rapid cutting property. This article provides an account on the fundamental principles of laser cutting (thermal), drilling, and shock-peening processes of which emphasis is placed on thermal laser cutting. It details the principal set-up parameters, such as the laser beam output, nozzle design, focusing optic position and characteristics, assist gases, surface conditions, and cutting speed. A discussion on the types of gas, supply system, purity level, and flow rates of lasing and assist gases is also provided. The article also describes the metallurgies and other key material considerations that impact laser-cutting performances and includes examples of laser cutting of nonmetal materials.

For a wide range of new or better products, solidification processing of metallic materials from the melt is a step of uppermost importance in the industrial production chain. This article discusses the casting and solidification of molten metallic alloy along with the application of low-gravity platforms and facilities for solidification processing. It provides a description of dendritic growth studies and electromagnetic levitation. The article concludes with information on the in situ and real-time monitoring of solidification processing.

The use of renewable energy has grown strongly in all end-use sectors such as power, heat, and transport. This article describes thermal spray applications that improve efficiency, lower maintenance costs, and prolong operational life in the renewable energy technologies, including wind power, hydro power, biomass and biofuels, solar energy, and fuel cells.

This article begins with a discussion on the advantages and limitation of ultrasonic welding (USW). It describes variations of the USW process which can produce different weld geometries. These variations are helpful in producing spot welds, line welds, continuous seam welds, ring welds, and microelectronic welds. The article provides information on the functions of USW personnel and describes the special conditions in USW which include the condition of the surface, the use of an interlayer, and the control of resonance. It concludes with a description on the weld quality, the influencing factors, surface appearance and deformation, and metallographic examination.

Electromagnetic problem solutions are based on the macroscopic theory of the continuous model for the electromagnetic field (EMF). It is described by a system of integral or partial differential equations for five vector quantities, namely, electric field strength, electric flux density, current density, magnetic field strength, and magnetic flux density. This article describes the behavior of the EMF by Maxwell's equations in integral or differential forms. It discusses the definition of potentials; methods of mathematical modeling; boundary conditions; and energy, power density, and electromagnetic forces.

Gallium-base components can be found in a variety of products ranging from compact disk players to advanced military electronic warfare systems, owing to the factor that it can emit light, has a greater resistance to radiation and operates at faster speeds and higher temperatures. This article discusses the uses of gallium in optoelectronic devices and integrated circuits and applications of gallium. The article discusses the properties and grades of gallium arsenide and also provides information on resources of gallium. The article talks about the recovery techniques, including recovery from bauxite, zinc ore and secondary recovery process and purification. The article briefly describes the fabrication process of gallium arsenide crystals. Furthermore, the article gives a short note on world supply and demand of gallium and concludes with research and development on gallium arsenide integrated circuits.

This article endeavors to familiarize the reader with a selection of different ionization designs and instrument components to provide knowledge for sorting the various analytical strategies in the field of solid analysis by mass spectrometry (MS). It begins with a description of the general principles of MS. This is followed by sections providing a basic understanding of instrumentation and discussing the operating requirements as well as practical considerations related to solid sample analysis by MS. Instrumentation discussed include the triple quadrupole mass spectrometer and the time-of-flight mass spectrometer. Inductively coupled plasma and thermal ionization MS provide atomic information, and direct analysis in real-time and matrix-assisted laser-desorption ionization MS are used to analyze molecular compositions. The article describes various factors pertinent to ionization methods, namely glow discharge mass spectrometry and secondary ion mass spectrometry. It concludes with a section on various examples of applications and interpretation of MS for various materials.

Chemical-mechanical planarization (CMP) of metals is described as mechanically accelerated corrosion, erosion corrosion, or metallic corrosion enhanced by wear. This article reviews the history, process, chemistry, electrochemistry, and defect issues for CMP. It provides an overview of CMP through a schematic illustration of CMP process equipment. The applications of CMP to tungsten and copper alloys are of prime interest in the semiconductor industry. The article discusses copper CMP and tungsten CMP in detail and analyzes polishing mechanism during CMP by application of direct current potentiodynamic polarization and alternating current impedance measurements. It concludes with information on chemically induced defects such as pitting corrosion, galvanic corrosion, and chemical etching.

This article introduces the fundamental concepts and the essential components of liquid chromatography (LC). It discusses the different modes of LC, such as liquid-solid chromatography, liquid-liquid chromatography, bonded-phase chromatograph, normal-phase chromatography, reversed-phase chromatography, ion-exchange chromatography, ion-pair chromatography, and size-exclusion chromatography. The article also includes a discussion on the qualitative and quantitative analyses and the applications of LC.

This article provides an overview of the types, properties, and applications of traditional and advanced ceramics and glasses. Principal product areas for traditional ceramics include whitewares, glazes, porcelain enamels, structural clay products, cements, and refractories. Advanced ceramics include electronic ceramics, optical ceramics, magnetic ceramics, and structural ceramics.