This article presents a detailed examination of corrosion at the various production stages of wafer fabrication. The corrosion issues related to batch metal-etch systems and single-wafer metal-etch systems are also discussed. The article provides a case study, which illustrates that the factors outside the normal processing of wafers or tool-specific problems can contribute to metal-line corrosion.

Photochemical machining (PCM), also known as chemical blanking, is a metal-etching process that uses a photoresist to define the locations where the metal will be etched. This article describes the major steps used in the PCM process, namely, the preparation of the phototool, selection of the metal, preparation of the workpiece, masking with photoresists, etching, and stripping and inspection. The article reviews various design considerations for the PCM process. These include dimensional limitations, tolerances, and edge quality. The article also discusses the advantages, disadvantages, and applications of the PCM process.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

The article presents an in-depth discussion on the various additive manufacturing techniques such as binder jetting, directed-energy deposition, material extrusion, material jetting, powder-bed fusion, sheet lamination, and vat polymerization processes. This article then discusses the different critical material aspects of additively manufactured medical devices, beginning with the preprinting phase (material consistency and recycling), the printing phase (build orientation), and the postprinting phase (part evaluation, biocompatibility, and sterilization) with supporting materials.

This article is a comprehensive collection of summary charts that provide data and information that are helpful in considering and selecting applicable processes alternative to the conventional material-removal processes. Process summary charts are provided for electrochemical machining, electrical discharge machining, chemical machining, abrasive jet machining, laser beam machining, electron beam machining, ultrasonic impact grinding, hydrodynamic machining, thermochemical machining, abrasive flow machining, and electrical discharge wire cutting.

This article discusses the basic operating principles, industrial applications, and advantages as well as the parameters influencing the process of laser-induced forward transfer (LIFT) of solid materials, liquid materials, laser-absorbing layers, intact structures, and metallic 3D microstructures in additive manufacturing.

This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform corrosion, galvanic corrosion, pitting corrosion, creep corrosion, dendrite growth, fretting, stress-corrosion cracking, and whisker growth. The article presents effective measures for minimizing the moisture retention in hermetic packages and/or moisture ingress in plastic packages. It concludes with information corrosion tests.

Impact tests are used to study dynamic deformation and failure modes of materials. This article discusses low-velocity impact experiments in single-stage gas guns. It describes surface velocity measurements with laser interferometric techniques. The article details plate impact soft-recovery experiments, pressure-shear friction experiments, and low-velocity penetration experiments. It reviews two types of plate impact soft-recovery experiments: normal plate impact and pressure-shear plate impact experiments. The article provides information on low-velocity penetration experiments, which include the setup for direct penetration experiment (rod-on-plate) and the reverse penetration experiment (plate-on-rod). It also considers high-temperature plate impact testing and impact techniques with in-material stress and velocity measurements.

Gallium-base components can be found in a variety of products ranging from compact disk players to advanced military electronic warfare systems, owing to the factor that it can emit light, has a greater resistance to radiation and operates at faster speeds and higher temperatures. This article discusses the uses of gallium in optoelectronic devices and integrated circuits and applications of gallium. The article discusses the properties and grades of gallium arsenide and also provides information on resources of gallium. The article talks about the recovery techniques, including recovery from bauxite, zinc ore and secondary recovery process and purification. The article briefly describes the fabrication process of gallium arsenide crystals. Furthermore, the article gives a short note on world supply and demand of gallium and concludes with research and development on gallium arsenide integrated circuits.

Electroless, or autocatalytic, metal plating is a nonelectrolytic method of deposition from solution that can be plated uniformly over all surfaces, regardless of size and shape. The plating's ability to plate onto nonconductors is an advantage that contributes to the choice of electroless copper in various applications. This article provides information on the bath chemistry and deposit properties of electroless copper and discusses the applications of electroless copper plating, such as printed wiring boards, decorative plating-on-plastic, electromagnetic interference shielding, and hybrid and other advanced applications. It describes two commercial processes, pretreatment and post-treatment. The article reviews the solutions used, controls and control equipment, and performance criteria of electroless copper plating. It concludes with information on the environmental and safety issues associated with electroless copper plating.

Additive manufacturing (AM), or three-dimensional (3D) printing, is a class of manufacturing processes that create the desired geometries of an object, or an assembly of objects, layer by layer or volumetrically. AM has been used extensively for manufacturing medical devices, due to its versatility to satisfy the specific needs of an intended medical field for the product/device. This article provides a comprehensive review of AM in medical devices by the medical specialty panels of the Food and Drug Administration (FDA) Code of Federal Regulations, Parts 862 to 892, including anesthesiology, ear and nose, general hospital, ophthalmic, plastic surgery, radiology, cardiovascular, orthopedic, dental, neurology, gynecology, obstetrics, physical medicine, urology, toxicology, and pathology. It is classified under these panels, and critical reviews and future outlooks are provided. The application of AM to fabricate medical devices in each panel is reviewed; lastly, a comparison is provided to reveal relevant gaps in each medical field.

This article reviews the applications of traditional glasses in architecture, transportation, construction, houseware, containers, and fibers. It also describes uses of specialty glasses for aerospace and military applications, biomedical and dental applications, chemical-resistant applications, lighting, information display, electronic processing and electronic devices, optical and ophthalmic products, and communications equipment.

The horsepower requirements to cut various metal alloys provide an indication of the relative ease and cost of machining, but several other important factors include cutting tool material, chip formation, cutting fluids, cutting tool wear, surface roughness, and surface integrity. This article reviews these general machining factors as well as specific cutting tool and cutting parameters for the six basic chip-forming processes of turning, shaping, milling, drilling, sawing, and broaching. Best practices for each of the six chip-forming processes are suggested for optimized machining of aluminum alloys. The article lists the inherent disadvantages of machining processes that involve compression/shear chip formation. It discusses the machining of aluminum metal-matrix composites and nontraditional machining of aluminum, such as abrasive jet, waterjet, electrodischarge, plasma arc, electrochemical, and chemical machining.

This article is a compilation of terms related to surface engineering of irons, steels, and nonferrous metals.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article begins with a discussion on the classification of aluminum alloys and the selection of alloy and temper based on machinability. It provides an overview of cutting force and power, tool design and material, and general machining conditions. In addition, the article discusses distortion and dimensional variation and machining problems during the machining of high-silicon aluminum alloy. It also provides information on tool design and material, speed and feed, and the cutting fluid used for various machining processes, namely, turning, boring, planing and shaping, broaching, reaming, tapping, milling, sawing, grinding, honing, and lapping. The article concludes with a discussion on drilling operations in automatic bar and chucking machines and drill presses.

The large majority of the commercially important glasses are processed from a carefully calculated batch of raw materials that is then melted in special furnaces. Providing an introduction to melting practices of glass production, this article focuses on various finishing methods of glass products, including forming, grinding and polishing, and explores the advantages, disadvantages and steps involved in sol-gel process. It also discusses the types, processes and properties of annealed, laminated, and tempered glass, and presents the steps involved in glass decoration. The article gives a detailed account of production, properties and application of fiberglass, optical fibers, glass spheres and ceramic glasses, and describes the forms, classification, compositions and properties of glass/metal and glass-ceramic/metal seals.

This article is intended to provide the reader with a good understanding of the underlying science, technology, and the most common applications of focused ion beam (FIB) instruments. It begins with a survey of the various types of FIB instruments and their configurations, discusses the essential components, and explains their function only to the extent that it helps the operator obtain the desired results. An explanation of how the components of ion optical column shape and steer the ion beam to the desired target locations is then provided. The article also reviews the many diverse accessories and options that enable the instrument to realize its full potential across all of the varied applications. This is followed by a detailed analysis of the physical processes associated with the ion beam interacting with the sample. Finally, a complete survey of the most prominent FIB applications is presented.