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Published: 01 December 2008
Fig. 8 Steps in making a shell mold by the dump-box technique. (a) The pattern is rotated and clamped to the dump box. (b and c) The box is then rotated 180° to make the investment. (d) Pattern and shell are removed from the box. Voids (c) and resulting peelback (d) are disadvantages
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Book: Casting
Series: ASM Handbook
Volume: 15
Publisher: ASM International
Published: 01 December 2008
DOI: 10.31399/asm.hb.v15.a0005252
EISBN: 978-1-62708-187-0
... or core and describes the problems most frequently encountered in shell-mold casting. The problems include mold cracking, soft molds, low hot tensile strength of molds, peelback, and mold shift. The article concludes with information on examples that provide some relative cost comparisons between shell...
Abstract
Shell molding is used for making production quantities of castings that range in weight from a few ounces to approximately 180 kg (400 lb), in both ferrous and nonferrous metals. This article lists the limitations or disadvantages of shell mold casting. It describes the two methods for preparation of resin-sand mixture for shell molding, namely, mixing resin and sand according to conventional dry mixing techniques, and coating the sand with resin. Shaping of shell molds and cores from resin sand mixtures is accomplished in machines. The article discusses the major steps in producing a mold or core and describes the problems most frequently encountered in shell-mold casting. The problems include mold cracking, soft molds, low hot tensile strength of molds, peelback, and mold shift. The article concludes with information on examples that provide some relative cost comparisons between shell molding and green sand molding.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001401
EISBN: 978-1-62708-173-3
... to the packages for adequate wetting of terminations and leads, thereby avoiding solder skips. The interior region of the wave acts as the heat source and solder supply to promote wetting of the substrate features. The exit or peelback region is the point at which the board leaves the wave and is critical...
Abstract
This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information on process parameters, which can be divided into three groups: the fluxing operation, solder wave properties, and process schedule. It provides information on various solder defects.