The electroplating of platinum-group metals (PGMs) from aqueous electrolytes for engineering applications is limited principally to palladium and, to a lesser extent, to platinum, rhodium, and thin layers of ruthenium. This article provides a discussion on the plating operations of these PGMs along with the types of anodes used in the process.

In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article focuses on the key factors contributing to corrosion of electronic components, namely, chemicals (salts containing halides, sulfides, acids, and alkalis), temperature, air (polluted air), moisture, contact between dissimilar metals in a wet condition, applied potential differences, and stress. It discusses the chip corrosion and oxidation of tin and tin-lead alloys (solders) in SIC. The article also addresses the corrosion of the device terminations resulting in lead (termination) tarnishing that are caused by various factors, including galvanic corrosion, chemical residues, base metal migration and plating additives.

Precious metals include gold, silver, and six platinum-group metals, namely, platinum, palladium, ruthenium, rhodium, osmium, and iridium. This article focuses on the consumption, trade practices, properties, product forms, and applications of these metals and their alloys.

Electroless, or autocatalytic, metal plating is a nonelectrolytic method of deposition from solution that can be plated uniformly over all surfaces, regardless of size and shape. The plating's ability to plate onto nonconductors is an advantage that contributes to the choice of electroless copper in various applications. This article provides information on the bath chemistry and deposit properties of electroless copper and discusses the applications of electroless copper plating, such as printed wiring boards, decorative plating-on-plastic, electromagnetic interference shielding, and hybrid and other advanced applications. It describes two commercial processes, pretreatment and post-treatment. The article reviews the solutions used, controls and control equipment, and performance criteria of electroless copper plating. It concludes with information on the environmental and safety issues associated with electroless copper plating.

Electrical contacts are metal devices that make and break electrical circuits. This article provides information on materials selection criteria and failure modes of make-break contacts. It describes the property requirements for make-break arcing contacts, namely, electrical conductivity, mechanical properties, chemical properties, fabrication properties, and thermal properties. The article presents a brief note on brush contact materials and their interdependence factors for sliding contacts. It also describes the type of commercial contact materials for electrical contacts, namely, copper metals, silver metals, gold metals, metals of the platinum group, precious metal overlays, tungsten and molybdenum, aluminum, and composite materials. Finally, the article provides information on composite manufacturing methods, and tabulates the physical, and mechanical properties of electrical contact materials, including copper, silver, gold, platinum, palladium, and composites.

Precious metals are of inestimable value to modern civilization. This article discusses the resources and consumption, trade practices, and special properties of precious metals and its alloys, including ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold, and tabulates the industrial applications of precious metals. It provides information on the commercial forms (wire, rod, sheet, strip, ribbon, and foil) and uses of precious metals, including semifinished products, precious metal powders, industrial uses, coatings, and jewelry.

This guide rates the compatibility of dissimilar structural materials joined together for service in seawater, marine atmosphere, or industrial atmosphere. It contains a table that indicates the material code and most generally effective surface treatment typically used to reduce corrosion of bare metals.

This article discusses the chemical composition, fabrication characteristics, applications, mechanical properties, mass characteristics, thermal properties, electrical properties, optical properties, and chemical properties of precious metals, namely, silver, gold, platinum, and palladium and their corresponding alloys.

This article focuses on the use of noble and precious metals for biomedical applications. These include gold, platinum, palladium, ruthenium, rhodium, iridium, and osmium. The physical and mechanical properties of noble and precious metals are presented in tables. A brief discussion on the ancient history of noble and precious metal use in dentistry is provided. The article discusses the use of direct gold dental filling materials, direct silver dental filling materials, traditional amalgam alloys, high-copper amalgam alloys, and gallium alloys in biomedical applications. It also provides information on gold coatings and iridium oxide coatings for stents.

Electrical contacts are metal devices that make and break electrical circuits. This article describes the property requirements such as electrical conductivity, mechanical properties, chemical properties, fabrication properties, and thermal properties of make-break arcing contacts. The article also focuses on brush contact materials and their interdependence factors for sliding contacts. In addition, the article discusses the properties, manufacturing methods, and applications of electrical contact materials, including wrought materials such as copper metals, silver metals, gold metals, precious metal overlays, tungsten, molybdenum, and aluminum, and composite materials. It concludes by discussing the composite manufacturing methods such as infiltration, press-sinter, press-sinter-repress process, press-sinter-extrude process, internal oxidation, and preoxidized-press-sinter-extrude process, and coprecipitation.

This article discusses the fundamentals of electroplating processes, including pre-electroplating and surface-preparation processes. It illustrates the four layers of a plating system, namely, top or finish coat, undercoat, strike or flash, and base material layers. The article describes various plating methods, such as pulse electroplating, electroless plating, brush plating, and jet plating. It reviews the types of electrodeposited coatings, including hard coatings and soft coatings. The article also details the materials available for electroplating, including electroplated chromium, electroplated nickel, electroless (autocatalytic) nickel, electroless nickel composite coatings, electroplated gold, and platinum group coatings. These are specifically tailored toward plated coatings for friction, lubrication, and wear technology. The article concludes with a discussion on the common issues encountered with electroplating.

This article characterizes the corrosion resistance of precious metals, namely, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold. It provides a discussion on the general fabricability; atomic, structural, physical, and mechanical properties; oxidation and corrosion resistance; and corrosion applications of these precious metals. The article also tabulates the corrosion rates of these precious metals in corrosive environment, namely, acids, salts, and halogens.

Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative and industrial applications of gold plating. The article reviews factors affecting the dragout of gold solution.

Selective plating, also known as brush plating, differs from traditional tank or bath plating in that the workpiece is not immersed in a plating solution (electrolyte). Instead, the electrolyte is brought to the part and applied by a handheld anode or stylus, which incorporates an absorbent wrapping for applying the solution to the workpiece (cathode). This article focuses on the selective plating systems that include a power pack, plating tools, anode covers, specially formulated plating solutions, and any auxiliary equipment required for the particular application. It provides a detailed account of the applications of selective plating, with examples. The article describes the advantages, limitations, key process elements, and health and safety considerations of selective plating. It also includes the most important industrial, government, and military specifications.

Electroless nickel plating is used to deposit nickel without the use of an electric current. This article provides an overview of the solution composition and characteristics of the electroless nickel bath. It focuses on the metallurgical, mechanical and physical properties of electroless nickel-phosphorus coatings and electroless nickel-boron coatings. The effect of electroless nickel coatings on the fatigue strength of steel is also described. The article includes information on the recommended pretreatment procedures for different ferrous alloys, aluminum alloys, and copper alloys. It presents a detailed account of the equipment and various processes—including bulk and barrel plating—involved in electroless nickel plating, and discusses hydrogen relief methods. The article includes a comprehensive table on nickel plating applications, and concludes with information on electroless nickel coatings on composites and plastics.

Metallic nonelectrolytic alloy coatings produced from aqueous solutions are commercially used in several industries, including electronics, aerospace, medical, oil and gas production, chemical processing, and automotive. Nonelectrolytic coating systems use two types of reactions to deposit metal onto a part: electroless and displacement. This article explains the various types of electroless and dispersion alloy coating systems. It provides information on the processing of parts, process control, deposit analysis, and equipment used for coating nonelectrolytic displacement alloys. The article concludes with a discussion on the safety and environmental concerns associated with nonelectrolytic deposition processes.

The process of coating plastics with metals for functional purposes is called metallizing of plastics. This article discusses the metallizing of plastics, provides information on its history, and gives a short note on applications and adhesion properties of metallic coatings. It also discusses the selection of plastics for plating. This article also describes metallizing techniques, including plating (electrolytic or electroplating), vacuum metallizing and thermal spraying, and environmental considerations. The article discusses the quality assurance procedures for metallized plastic parts which include tests that assess the quality of the finish, coating thickness, adhesion, and corrosion resistance, and gives a short note on service performance, which includes service condition classifications.

This article describes dental alloy compositions and its properties. It discusses the safety and efficacy considerations of dental alloy devices. The article defines and compares interstitial fluid and oral fluid environments. Artificial solutions developed for the testing and evaluation of dental materials are summarized. The article examines the effects of restoration contact on electrochemical parameters and reviews the concentration cells developed by dental alloy-environment electrochemical reactions. The composition and characterization of biofilms, corrosion products, and other debris that deposit on dental material surfaces are discussed. The article evaluates the types of alloys available for dental applications, including direct filling alloys, crown and bridge alloys, partial denture alloys, porcelain fused to metal alloys, wrought wire alloys, soldering alloys, and implant alloys. The effects of composition and microstructure on the corrosion of each alloy group are also discussed. The article concludes with information on the tarnishing and corrosion behavior of these alloys.

This article explains how to prepare precious metal test samples for metallographic examination. It discusses cutting, mounting, grinding, polishing, and etching and addresses some of the challenges of working with small, relatively soft specimens. It includes dozens of example micrographs, comparing and contrasting the microstructural features of gold, platinum, iridium, palladium, and ruthenium-base alloys. It examines pure gold, intermetallic gold compounds, gold and platinum jewelry alloys, platinum-containing shape memory alloys, and alloys consisting of platinum, aluminum, and copper.

This article focuses on the electroless gold plating technique, describing the advantages and limitations, applications, and properties of plated deposits. It also reviews process variables of the technique, including gold concentration, reducing agent, agitation, and contaminants.