Search Results for packaging alloys

This datasheet provides information on composition limits, mill product specifications, fabrication characteristics, processing effects on physical and mechanical properties, and applications of packaging and general-construction alloys 5052 and 5252.

In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article focuses on the key factors contributing to corrosion of electronic components, namely, chemicals (salts containing halides, sulfides, acids, and alkalis), temperature, air (polluted air), moisture, contact between dissimilar metals in a wet condition, applied potential differences, and stress. It discusses the chip corrosion and oxidation of tin and tin-lead alloys (solders) in SIC. The article also addresses the corrosion of the device terminations resulting in lead (termination) tarnishing that are caused by various factors, including galvanic corrosion, chemical residues, base metal migration and plating additives.

Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis are also presented. The article introduces several frequently used methods for solder joint failure detection, prevention, and isolation (identification for the failed location).

This article addresses the long-term corrosion behavior of high-level waste (HLW) container materials, more specifically of the outer shell of the containers. It discusses time, environmental, and materials considerations for the emplacement of HLW in geological repositories. Environmental corrosion resistance of materials planned for reducing repositories is also discussed. The article reviews the design and characterization of nuclear waste repository with an oxidizing environment surrounding the waste package.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.

This article presents an overview of advanced composites, namely, polymer matrix composites, metal-matrix composites, ceramic-matrix composites, and carbon-matrix composites. It also provides information on the properties and applications of the composites in thermal management and electronic packaging.

This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information on process parameters, which can be divided into three groups: the fluxing operation, solder wave properties, and process schedule. It provides information on various solder defects.

This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform corrosion, galvanic corrosion, pitting corrosion, creep corrosion, dendrite growth, fretting, stress-corrosion cracking, and whisker growth. The article presents effective measures for minimizing the moisture retention in hermetic packages and/or moisture ingress in plastic packages. It concludes with information corrosion tests.

This article reviews the generator industry experience with stress-corrosion cracking of 18Mn-5Cr alloy retaining rings. It provides a description of corrosion of magnetic retaining rings. The article also discusses the primary repair alternatives to address crevice-corrosion cracking in water-cooled generators.

Copper and copper alloys are used extensively in structural applications in which they are subject to moderately elevated temperatures. At relatively low operating temperatures, these alloys can undergo thermal softening or stress relaxation, which can lead to service failures. This article is a collection of curves and tables that present data on thermal softening and stress-relaxation in copper and copper alloys. Thermal softening occurs over extended periods at temperatures lower than those inducing recrystallization in commercial heat treatments. Stress relaxation occurs because of the transformation of elastic strain in the material to plastic, or permanent strain.

This article demonstrates the depth and breadth of commercial and third-party software packages available to simulate metals processes. It provides a representation of the spectrum of applications from simulation of atomic-level effects to manufacturing optimization. The article tabulates the software name, function or process applications, vendor or developer, and website information.

Nonferrous metals and alloys are widely used to resist corrosion. This article describes the corrosion behavior of the most widely used nonferrous metals, such as aluminum, copper, nickel, and titanium. It also provides information on several specialty nonferrous products that cannot easily be categorized by elemental base.

This article provides a discussion on the design, in-process, storage, and in-field problems and their considerations associated with armament corrosion with examples. Design considerations include geometry, material selection, assembly, pretreatment, coatings, and working and storage environments. In-process corrosion concerns include processing locations, in-process storage of parts, time between processing steps, and quality control of each processing step. The article also discusses the analysis of the in-field corrosion of the finished product, including physical environments, repair of corrosion-protective coatings, general corrosion-protection maintenance, and appropriate fixes and procedures that can be implemented by soldiers in-field to stop continued corrosion of armament equipment.

This article describes the factors considered in the analysis of brazeability and solderability of engineering materials. These are the wetting and spreading behavior, joint mechanical properties, corrosion resistance, metallurgical considerations, and residual stress levels. It discusses the application of brazed and soldered joints in sophisticated mechanical assemblies, such as aerospace equipment, chemical reactors, electronic packaging, nuclear applications, and heat exchangers. The article also provides a detailed discussion on the joining process characteristics of different types of engineering materials considered in the selection of a brazing process. The engineering materials include low-carbon steels, low-alloy steels, and tool steels; cast irons; aluminum alloys; copper and copper alloys; nickel-base alloys; heat-resistant alloys; titanium and titanium alloys; refractory metals; cobalt-base alloys; and ceramic materials.

This article focuses on the isothermal fatigue of solder materials. It discusses the effect of strain range, frequency, hold time, temperature, and environment on isothermal fatigue life. The article provides information on various isothermal fatigue testing methods used to assess solder joint reliability. These include the accelerated thermal cycling test and isothermal mechanical deflection system test.

Aluminum, the second most plentiful metallic element, is an economic competitor in various applications owing to its appearance, light weight, fabricability, physical properties, mechanical properties, and corrosion resistance. This article discusses the primary and secondary production of aluminum and classification system for cast and wrought aluminum alloys. It talks about various manufactured forms of aluminum and its alloys, which are classified into standardized products such as sheet, plate, foil, rod, bar, wire, tube, pipe, and structural forms, and engineered products such as extruded shapes, forgings, impacts, castings, stampings, powder metallurgy parts, machined parts, and metal-matrix composites. The article also reviews important fabrication characteristics in the machining, forming, forging, and joining of aluminum alloys. It concludes with a description of the major industrial applications of aluminum, including building and construction, transportation, consumer durables, electrical, machinery and equipment, containers and packaging, and other applications.

Metal matrix composites (MMCs) can be synthesized by vapor phase, liquid phase, or solid phase processes. This article emphasizes the liquid phase processing where solid reinforcements are incorporated in the molten metal or alloy melt that is allowed to solidify to form a composite. It illustrates the three broad categories of MMCs depending on the aspect ratio of the reinforcing phase. The categories include continuous fiber-reinforced composites, discontinuous or short fiber-reinforced composites, and particle-reinforced composites. The article discusses the two main classes of solidification processing of composites, namely, stir casting and melt infiltration. It describes the effects of reinforcement present in the liquid alloy on solidification. The article examines the automotive, space, and electronic packaging applications of MMCs. It concludes with information on the development of select cast MMCs.

Filiform corrosion has been observed to occur under a wide range of organic coatings and proceeds with the same general characteristics on steel, aluminum, and magnesium. This article describes the standard tests for filiform corrosion, characteristics and mechanisms of filiform corrosion in steels, as well as coated aluminum and magnesium. It concludes with information on the prevention and mitigation of filiform corrosion accomplished through the adjustment of the environment and changes in the substrate and coating systems.