Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis are also presented. The article introduces several frequently used methods for solder joint failure detection, prevention, and isolation (identification for the failed location).

When complex designs, transient loadings, and nonlinear material behavior must be evaluated, computer-based techniques are used. This is where the finite-element analysis (FEA) is most applicable and provides considerable assistance in design analysis as well as failure analysis. This article provides a general view on the applicability of finite-element modeling in conducting analyses of failed components. It highlights the uses of finite-element modeling in the area of failure analysis and design, with emphasis on structural analysis. The discussion covers the general development and both general- and special-purpose applications of FEA. The special-purpose applications of FEA covered are piping and pressure vessel analysis, impact analysis, and microelectronic and microelectromechanical systems analysis. The article provides case histories that involved the use of FEA in failure analysis.

This article provides information on the development of finite element analysis (FEA) and describes the general-purpose applications of FEA software programs in structural and thermal, static and transient, and linear and nonlinear analyses. It discusses special-purpose finite element applications in piping and pressure vessel analysis, impact analysis, and microelectronics. The article describes the steps involved in the design process using the FEA. It concludes with two case histories that involve the use of FEA in failure analysis.

This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.

Composite materials offer amazing opportunities for delivering structures that are optimized to meet design requirements. This article provides a summary of the concepts discussed in the articles under the section “Engineering Mechanics, Analysis, and Design” in ASM Handbook, Volume 21: Composites. The section introduces many of the engineering approaches used in composite industry.

Failure analysis is an investigative process in which the visual observations of features present on a failed component and the surrounding environment are essential in determining the root cause of a failure. This article reviews the basic photographic principles and techniques that are applied to failure analysis, both in the field and in the laboratory. It discusses the processes involved in visual examination, field photographic documentation, and laboratory photographic documentation of failed components. The article describes the operating principles of each part of a professional digital camera. It covers basic photographic principles and manipulation of settings that assist in producing high-quality images. The need for accurate photographic documentation in failure analysis is also presented.

This article begins with a discussion on the criteria for evaluating computer programs for composites structural analysis, including database capabilities, types of engineering calculations supported, interface and operating systems, and technical support. It describes the capabilities of programs, such as CompositePro, ESAComp, and V-Lab that provide a graphical interface, built-in databases, and integrated modules for the different types of analyses. The article reviews the modules of other programs used for composite analysis. The programs include ASCA, CADEC, CoDA, COMPASS, ESDU, LAP, PROMAL, and SACL. The article concludes with information on on-line programs and recourses.

Solder cracking is one of the dominant failure modes of the electronic assembly system. Experience shows that solder joints can fail due to processing defects during solder joint formation or due to excessive loading in various applications. This article introduces major fractography techniques to demonstrate typical solder joint failure and background failure mechanisms. These techniques may be helpful to readers in recognizing failure modes and in preventing further failures during product development and process implementation.

There are two parts to deal with uncertainty in fatigue design: determining the distributions of possible values for all uncertain inputs and calculating the probability of failure due to all the uncertain inputs. This article discusses the sources of uncertainty in a fatigue analysis, such as the material properties, distribution of applied stress levels within a given environment, environments or loading intensities, and modeling or prediction. It presents a probabilistic approach for analyzing the uncertainties and determining the level of reliability (probability of failure).

This article reviews the generator industry experience with stress-corrosion cracking of 18Mn-5Cr alloy retaining rings. It provides a description of corrosion of magnetic retaining rings. The article also discusses the primary repair alternatives to address crevice-corrosion cracking in water-cooled generators.

This article focuses on the isothermal fatigue of solder materials. It discusses the effect of strain range, frequency, hold time, temperature, and environment on isothermal fatigue life. The article provides information on various isothermal fatigue testing methods used to assess solder joint reliability. These include the accelerated thermal cycling test and isothermal mechanical deflection system test.

This article focuses on the various types of corrosion-related failure mechanisms and their effects on passive electrical components. The types include halide-induced corrosion, organic-acid-induced corrosion, electrochemical metal migration, silver tarnish, fretting, and metal whiskers. The passive electrical components include resistors, capacitors, wound components, sensors, transducers, relays, switches, connectors, printed circuit boards, and hardware.

Chemical analysis is a critical part of any failure investigation. With the right planning and proper analytical equipment, a myriad of information can be obtained from a sample. This article presents a high-level introduction to techniques often used for chemical analysis during failure analysis. It describes the general considerations for bulk and microscale chemical analysis in failure analysis, the most effective techniques to use for organic or inorganic materials, and examples of using these techniques. The article discusses the processes involved in the chemical analysis of nonmetallics. Advances in chemical analysis methods for failure analysis are also covered.

The inclusion of damage tolerance design and a systematic review of design procedures allow the U.S. Air Force to design, manufacture, and maintain systems that are structurally safe and economically prudent. After a brief introduction of fracture mechanics, this article describes the particular aspects that relate to damage tolerance in aircraft design. It discusses the use of fracture mechanics as a method of predicting failure, understanding failure mechanisms, and suggesting inspection methods to protect against failure in pressure vessels. Various programs of U.S. Air Force to design aircraft structure, namely, airframe structural integrity programs, engine structural integrity program, and mechanical subsystems structural integrity program are also discussed.

This article discusses the importance of the care and handling of fracture specimens and what to look for during the preliminary field or laboratory observation and collection, the preservation of specimens, and the cleaning and preparation of fracture specimens for additional analyses. The preservation of nonmetallic specimens, medical devices, oversized components, light alloys, nondestructively tested components, and materials that are part of legal proceedings is addressed.

This article provides a discussion on the design, in-process, storage, and in-field problems and their considerations associated with armament corrosion with examples. Design considerations include geometry, material selection, assembly, pretreatment, coatings, and working and storage environments. In-process corrosion concerns include processing locations, in-process storage of parts, time between processing steps, and quality control of each processing step. The article also discusses the analysis of the in-field corrosion of the finished product, including physical environments, repair of corrosion-protective coatings, general corrosion-protection maintenance, and appropriate fixes and procedures that can be implemented by soldiers in-field to stop continued corrosion of armament equipment.

Polymers offer a wide range of choices for medical applications because of their versatility in properties and processing. This article provides an overview of polymeric materials and the characteristics that make them a unique class of materials. It describes the ways to classify polymers, including the polymerization method, how the material deforms, or molecular origin or stability. The article contains tables that list common medical polymers used in medical devices. It explains the medical polymer selection criteria and regulatory aspects of materials selection failure analysis and prevention. Failure analysis and prevention processes to determine the root cause of failures that arise at different stages of the product life cycle are reviewed. The article describes the mechanisms of plastic product failure analysis. It discusses the trends in the use of medical polymers, such as high-performance polymers for implants, tissue engineering, and bioresorbable polymers.

This article reviews analytical techniques that are most often used in plastic component failure analysis. The description of the techniques is intended to familiarize the reader with the general principles and benefits of the methodologies, namely Fourier transform infrared spectroscopy, energy-dispersive x-ray spectroscopy, differential scanning calorimetry, thermogravimetric analysis, and dynamic mechanical analysis. The article describes the methods for molecular weight assessment and mechanical testing to evaluate plastics and polymers. The descriptions of the analytical techniques are supplemented by a series of case studies to illustrate the significance of each method. The case studies also include pertinent visual examination results and the corresponding images that aided in the characterization of the failures.

Nondestructive testing (NDT), also known as nondestructive evaluation (NDE), includes various techniques to characterize materials without damage. This article focuses on the typical NDE techniques that may be considered when conducting a failure investigation. The article begins with discussion about the concept of the probability of detection (POD), on which the statistical reliability of crack detection is based. The coverage includes the various methods of surface inspection, including visual-examination tools, scanning technology in dimensional metrology, and the common methods of detecting surface discontinuities by magnetic-particle inspection, liquid penetrant inspection, and eddy-current testing. The major NDE methods for internal (volumetric) inspection in failure analysis also are described.