Gallium-base components can be found in a variety of products ranging from compact disk players to advanced military electronic warfare systems, owing to the factor that it can emit light, has a greater resistance to radiation and operates at faster speeds and higher temperatures. This article discusses the uses of gallium in optoelectronic devices and integrated circuits and applications of gallium. The article discusses the properties and grades of gallium arsenide and also provides information on resources of gallium. The article talks about the recovery techniques, including recovery from bauxite, zinc ore and secondary recovery process and purification. The article briefly describes the fabrication process of gallium arsenide crystals. Furthermore, the article gives a short note on world supply and demand of gallium and concludes with research and development on gallium arsenide integrated circuits.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article discusses electrospinning as a method for obtaining nanofibers, some of the challenges and limitations of the technique, advancements in the field, and how it may be used in key functional applications. The key drawbacks of traditional electrospinning processes include relatively slow speed of nanofiber production, low product yield, and relatively high cost. The article also addresses novel high-throughput techniques and methods designed for the scalable synthesis of nanofibers and nanofibrous mats that are of reasonable cost.

This article presents an overview of the electric and magnetic parameters and discusses the significance of these parameters for electronic applications. It describes the components of analog and digital electronic circuits. The article reviews the augmenting technologies: magnetic and special technologies such as electrooptical.

Heat treating furnaces require different control systems and integration for achieving optimum technical results and enabling safe operation. This article focuses on atmosphere furnaces, with some coverage on controls for vacuum furnaces. Heat treating operations require reliable monitoring and control of motion and position of various mechanical components with the help of mechanical limit switches, proximity sensors, and distance- and position-measuring devices. Using inputs from both flow meters and sensors, such as thermocouples and oxygen sensors, flow measurement control systems must be able to adjust the flow of gases for process optimization. The operator interface of a furnace-control system displays critical information such as the furnace temperature, atmosphere status, alarms, electronic chart recorders, recipe, and maintenance. A supervisory control and data-acquisition (SCADA) system is used to monitor, collect, and store data from multiple pieces of equipment.

X-ray topography is the general term for a family of x-ray diffraction imaging techniques capable of providing information on the nature and distribution of imperfections. This article provides a detailed account of x-ray topography techniques, providing information on the historical background and development trends in x-ray diffraction topography. The discussion covers the general principles, components of systems, and applications of x-ray topography techniques, namely conventional X-ray topographic techniques and synchrotron x-ray topographic techniques.

This article describes the determination of wear loss by measuring either mass change or dimensional change of lubricants and materials. It discusses the principles, advantages and disadvantages of mass loss measures and dimensional measures of wear. The article details wear measurement at the nanoscale, such as atomic force microscopy (AFM) measurement and scanning electron microscopy measurement. It reviews the techniques of wear measurement at the atomic level, namely, transmission electron microscopy (TEM) measurement and AFM combined with TEM measurement.

This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.

This article presents an overview of advanced composites, namely, polymer matrix composites, metal-matrix composites, ceramic-matrix composites, and carbon-matrix composites. It also provides information on the properties and applications of the composites in thermal management and electronic packaging.

This article addresses the important variables in erosion, such as particle impact velocity; particle impact angle; particle size, shape, and material; and ambient temperature. It describes four erosion test methods: the gas-blast method, a method using a centrifugal accelerator test rig, the wind-tunnel test, and the whirling arm test. The article also details the various test methods used to measure impact velocity of particle and data analysis and interpretation of these four methods.

This article provides a history of electron and laser beam welding, discusses the properties of electrons and photons used for welding, and contrasts electron and laser beam welding. It presents a comparison of the electron and laser beam welding processes. The article also illustrates constant power density boundaries, showing the relationship between the focused beam diameter and the absorbed beam power for approximate regions of keyhole-mode welding, conduction-mode welding, cutting, and drilling.

This article reviews the applications of traditional glasses in architecture, transportation, construction, houseware, containers, and fibers. It also describes uses of specialty glasses for aerospace and military applications, biomedical and dental applications, chemical-resistant applications, lighting, information display, electronic processing and electronic devices, optical and ophthalmic products, and communications equipment.

Field ion microscopy (FIM) can be used to study the three-dimensional structure of materials, such as metals and semiconductors, because successive atom layers can be ionized and removed from the surface by field evaporation. The ions removed from the surface by field evaporation can be analyzed chemically by coupling to the microscope a time-of-flight mass spectrometer of single-particle sensitivity, known as the atom probe (AP). This article describes the principles, sample preparation, and quantitative analysis of FIM. It also provides information on the principles, instrument design and operation, mass spectra and their interpretation, and applications of AP microanalysis.

Sputtering is a nonthermal vaporization process in which the surface atoms are physically ejected from a surface by momentum transfer from an energetic bombarding species of atomic/molecular size. It uses a glow discharge or an ion beam to generate a flux of ions incident on the target surface. This article provides an overview of the advantages and limitations of sputter deposition. It focuses on the most common sputtering techniques, namely, diode sputtering, radio-frequency sputtering, triode sputtering, magnetron sputtering, and unbalanced magnetron sputtering. The article discusses the fundamentals of plasma formation and the interactions on the target surface. A comparison of reactive and nonreactive sputtering is also provided. The article concludes with a discussion on the several methods of process control and the applications of sputtered films.

This article provides detailed information on the instrumentation and principles of the scanning electron microscope (SEM). It begins with a description of the primary components of a conventional SEM instrument. This is followed by a discussion on the advantages and disadvantages of the SEM compared with other common microscopy and microanalysis techniques. The following sections cover the critical issues regarding sample preparation, the physical principles regarding electron beam-sample interaction, and the mechanisms for many types of image contrast. The article also presents the details of SEM-based techniques and specialized SEM instruments. It ends with example applications of various SEM modes.

Polymer materials are key building blocks of the modern world, commonly used in packaging, automobiles, building materials, electronics, telecommunications, and many other industries. These commercial applications of polymeric materials would not be possible without the use of additives. This article is divided into five sections: mechanical property modifiers, physical property modifiers, biological function modifiers, processing aids, and colorants. It describes three classes of additives that are used to inhibit biological activity, six classes of mechanical property modifiers, three classes of physical property modifiers, and two classes of both colorants and processing aids.

This article describes the types, mechanism, and typical test methods along with their configurations for the evaluation of hydrogen embrittlement, stress-corrosion cracking, and corrosion fatigue with an emphasis on fracture mechanics methodologies for metals. An overview on the environmentally assisted crack growth of polymers is also included. The article details the evaluation of nanoscale environmental effects and indentation-induced cohesive cracking. It also provides information on scanning probe microscopy.

The large majority of the commercially important glasses are processed from a carefully calculated batch of raw materials that is then melted in special furnaces. Providing an introduction to melting practices of glass production, this article focuses on various finishing methods of glass products, including forming, grinding and polishing, and explores the advantages, disadvantages and steps involved in sol-gel process. It also discusses the types, processes and properties of annealed, laminated, and tempered glass, and presents the steps involved in glass decoration. The article gives a detailed account of production, properties and application of fiberglass, optical fibers, glass spheres and ceramic glasses, and describes the forms, classification, compositions and properties of glass/metal and glass-ceramic/metal seals.