Search Results for noneutectic fusible alloys

Fusible alloys, eutectic and noneutectic, include a group of binary, ternary, quaternary, and quinary alloys containing bismuth, lead, tin, cadmium, and indium that melt at relatively low temperatures. This article describes the composition and mechanical properties of these alloys and lists the values of their composition and melting temperatures.

This article focuses on the use of indium and bismuth in low-melting-temperature solders and fusible alloys. It describes how the two elements typically occur in nature and how they are recovered and processed for commercial use. It also provides information on designations, classification, composition, properties (including temperatures ranges), and some of the other ways in which indium and bismuth alloys are used.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.