This article focuses on the use of noble and precious metals for biomedical applications. These include gold, platinum, palladium, ruthenium, rhodium, iridium, and osmium. The physical and mechanical properties of noble and precious metals are presented in tables. A brief discussion on the ancient history of noble and precious metal use in dentistry is provided. The article discusses the use of direct gold dental filling materials, direct silver dental filling materials, traditional amalgam alloys, high-copper amalgam alloys, and gallium alloys in biomedical applications. It also provides information on gold coatings and iridium oxide coatings for stents.

This article describes the principal cladding processes and methods for calculating properties of clad metals. It reviews the designing processes of clad metals to achieve specific requirements. The article discusses six categories of clad metal systems designed for corrosion control: noble metal clad systems, corrosion barrier systems, sacrificial metal systems, transition metal systems, complex multilayer systems, and clad diffusion alloys.

Hydrochloric acid (HCl) may contain traces of impurities that will change the aggressiveness of the solution. This article discusses the effects of impurities such as fluorides, ferric salts, cupric salts, chlorine, and organic solvents, in HCl. It describes the corrosion resistance of various metals and alloys in HCl, including carbon and alloy steels, austenitic stainless steels, standard ferritic stainless steels, nickel and nickel alloys, copper and copper alloys, corrosion-resistant cast iron, zirconium, titanium and titanium alloys, tantalum and its alloys, and noble metals. The article illustrates the effect of HCl on nonmetallic materials such as natural rubber, neoprene, thermoplastics, and reinforced thermoset plastics. It also tabulates the corrosion of various metals in dry hydrogen chloride.

Thermocouple devices are the most widely used devices for measurement of temperature in the metals industry. Favorable characteristics of these devices include good accuracy, suitability over a wide temperature range, fast thermal response, ruggedness, high reliability, low cost, and great versatility of application. Thermocouples are grouped into two broad categories, namely, standard thermocouples, including five base-metal thermocouples and three noble-metal thermocouples that have been given letter designations, and nonstandard thermocouples, including iridium-rhodium, platinum-molybdenum, platinel, and tungsten-rhenium thermocouples. This article discusses the basic principles, classification, and properties of thermocouples, and the techniques for insulating and protecting thermocouple wires from the operating environment.

Dealloying is a corrosion process in which one or more elements are selectively dissolved, leaving behind a porous residue of the remaining elements. This article describes the dealloying in various systems, namely, dezincification, graphitic corrosion, dealuminification, and noble metal alloys dealloying. The current-potential behavior of a binary alloy undergoing selective dissolution is reviewed. The article highlights the four mechanisms required for the formation of porous metals: ionization-redeposition, surface diffusion, volume diffusion, and percolation model of selective dissolution.

This article describes the various factors that affect the extent of corrosion resulting from galvanic coupling. The factors include galvanic series, polarization behavior, and geometric relationship of metals and alloys. The article briefly discusses the various modes of attack that lead to galvanic corrosion of anodic members. It also explains the three electrochemical techniques of screening tests for predicting galvanic corrosion. The electrochemical techniques comprise of potential measurements, current measurements, and polarization measurements. The article provides a detailed discussion on the performance of alloy groupings. It concludes with information on various control methods that reduce or eliminate galvanic-corrosion effects.

This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform corrosion, galvanic corrosion, pitting corrosion, creep corrosion, dendrite growth, fretting, stress-corrosion cracking, and whisker growth. The article presents effective measures for minimizing the moisture retention in hermetic packages and/or moisture ingress in plastic packages. It concludes with information corrosion tests.

This article focuses on the electroless gold plating technique, describing the advantages and limitations, applications, and properties of plated deposits. It also reviews process variables of the technique, including gold concentration, reducing agent, agitation, and contaminants.

This article discusses corrosion resistance of titanium and titanium alloys to different types of corrosion, including galvanic corrosion, crevice corrosion, stress-corrosion cracking (SCC), erosion-corrosion, cavitation, hot salt corrosion, accelerated crack propagation, and solid and liquid metal embrittlement. A short section discusses the addition of alloys that can improve the corrosion resistance of titanium.