Laser beam machining removes, melts, or thermally modifies a material by focusing a coherent beam of monochromatic light on the workpiece. This article describes the principal lasers used in metal processing: neodymium-glass, carbon dioxide, and neodymium-doped yttrium aluminum garnet lasers. It discusses the operating parameters of concern in percussion drilling and trepanning. The process variables in surface treatment and laser cutting, as well as the operating parameters of concern in laser welding are reviewed. The article also explains the various categories of surface treatment: heat treating, cladding, surfacing, glazing, and marking.

Measuring the thickness of thin films can be accomplished in many ways. This article focuses on the optical method of single-wavelength ellipsometry, two multiple-wavelength methods of reflectometry and spectroscopic ellipsometry for measuring the thickness of thin films. The general capabilities, principles and applications of ellipsometry and reflectometry are discussed in terms of nondestructive methods.

Most surfaces have regular and irregular spacings that tend to form a pattern or texture on the surface. This article provides information on the general background of surface topography and discusses the different methods for measuring surface topography, namely, contact and noncontact techniques, and the focus-follow method. Examples of different types of parameters obtained and how they are applied can best be described by discussing the various types of surfaces generated by finishing methods. The surfaces include ground, turned, and milled machined surfaces; surfaces subjected to stress; bearing surfaces; plateau honed and tapped surfaces; and reflective, painted, elastic, and wear-resistant surfaces.

This article introduces the concepts of electron and light microscopy with some general features of imaging systems and the ideas of magnification, resolution, depth of field, depth of focus, and lens aberrations as they apply to simple and familiar light-optical systems. In addition, it describes the differences between electron and light in the context of their respective microscopy techniques.

This article reviews photographic principles, namely, visual examination, field photographic documentation, and laboratory photographic documentation, as applied to failure analysis and the specific techniques employed in both the field and laboratory. It provides information on the photographic equipment used in failure analysis and on film and digital photography. The article describes the basics of photography and the uses of different types of lighting in photography of a fractured surface. The article also addresses the techniques involved in macrophotography and microscopic photography as well as other special techniques.

Optical testing of plastics includes characterization of materials and analysis of optical components. This article focuses on procedures for testing various characteristics of optical components, including transmission and haze, yellowness, refractive index, birefringence, as well as surface irregularity, contamination, gloss, and color. It provides a short note on ad hoc testing, which is beneficial for practical applications in which lenses, prisms, and light pipes are being used and tested, as other test instruments are often not available.

Optical testing of plastics includes the characterization of materials and the analysis of optical components. If a material is tested for transmission, haze, yellowness, and refractive index, the knowledge of its optical properties is nearly complete. For optical components, surface irregularity, birefringence, and internal contamination must also be considered. These characteristics are a function of the material and the fabrication method. Gloss and color also are affected by the base material and measured as optical properties.

Failure analysis is an investigative process that uses visual observations of features present on a failed component fracture surface combined with component and environmental conditions to determine the root cause of a failure. The primary means of recording the conditions and features observed during a failure analysis investigation is photography. Failure analysis photographic imaging is a combination of both science and art; experience and proper imaging techniques are required to produce an accurate and meaningful fracture surface photograph. This article reviews photographic principles and techniques as applied to failure analysis, both in the field and in the laboratory. The discussion covers the processes involved in field and laboratory photographic documentations, provides a description of professional digital cameras, and gives information on photographic lighting and microscopic photography. Special techniques can be employed to deal with highly reflective conditions and are also described in this article.

This article is a compilation of terms and definitions related to materials characterization.

This article is an overview of the division Surface Analysis of this volume. The division covers various developed surface-analysis techniques, such as scanning probe and atomic force microscopy. The division focuses on the analysis of surface layers that are less than 100 nm. A quick reference summary of surface-analysis methods is presented in this article.

Particle size and size distribution have a significant effect on the behavior of metal powders during their processing. This article provides an overview of the sample preparation process for particle size measurement, which is a key step in the measurement of particle size distributions. Common particle size measuring techniques discussed in this article include sieve analysis, quantitative image analysis, laser diffraction, sedimentation methods, aerodynamic time-of-flight method, electrical zone sensing, and photon correlation spectroscopy. The advantages and disadvantages of these methods are reviewed.

This article describes the methods of X-ray diffraction analysis, the types of information that can be obtained, and its interpretation. The discussion covers the basic theories of X-rays and various types of diffraction experiments, namely single-crystal methods for polychromatic and monochromatic beams, powder diffraction methods, and the Rietveld method.

This article is a compilation of definitions of terms related to materials characterization techniques.

Failure analysis is an investigative process in which the visual observations of features present on a failed component and the surrounding environment are essential in determining the root cause of a failure. This article reviews the basic photographic principles and techniques that are applied to failure analysis, both in the field and in the laboratory. It discusses the processes involved in visual examination, field photographic documentation, and laboratory photographic documentation of failed components. The article describes the operating principles of each part of a professional digital camera. It covers basic photographic principles and manipulation of settings that assist in producing high-quality images. The need for accurate photographic documentation in failure analysis is also presented.

X-ray diffraction techniques are useful for characterizing crystalline materials, such as metals, intermetallics, ceramics, minerals, polymers, plastics, and other inorganic or organic compounds. This article discusses the theory of x-rays and how they are generated and detected. It also describes the crystalline nature of certain materials and how the geometry of a unit cell, and hence crystal lattice, affects the direction and intensity of diffracted x-ray beams. The article concludes with several application examples involving measurements on single and polycrystalline materials.

This article describes the methods and equipments involved in the preparation of specimens for examination by light optical microscopy, scanning electron microscopy, electron microprobe analysis for microindentation hardness testing, and for quantification of microstructural parameters, either manually or by the use of image analyzers. Preparation of metallographic specimens generally requires five major operations: sectioning, mounting, grinding, chemical polishing, and etching. The article provides information on the principles of technique selection in mechanical polishing, and describes the procedures, advantages, and disadvantages of electrolytic and chemical polishing. It also provides a detailed account of procedures, precautions, and composition for preparation and handling of etchants.

This article focuses on the principles and applications of X-ray photoelectron spectroscopy (XPS) for the analysis of elemental and chemical composition. The discussion covers the nomenclature, instruments, and specimen preparation process of XPS. Some of the factors pertinent to the calibration of materials for accurate measurements using XPS are provided, along with some aspects of the accuracy in quantitative analysis by XPS. In addition, the article presents examples of how XPS data can be used to solve problems with surface interactions.

Metallographic examination is a critical step in the assessment of thermal spray coating characteristics. This article discusses the major steps involved in metallographic examination: sectioning, mounting, grinding, polishing, optical microscopy, and image analysis. It provides a discussion on etching to reveal grain structure. The article also provides recommendations for metallographic examination of some standard coatings.