Microjoining methods are commonly used to fabricate medical components and devices. This article describes key challenges involved during microjoining of medical device components. The primary mechanisms used in microjoining for medical device applications include microresistance spot welding (MRSW) and laser welding. The article illustrates the fundamental principles involved in MRSW and laser welding. Most multicomponent medical devices implement microjoining techniques to join various forms of materials and geometries. The article presents examples of various microjoining methods used in medical device applications, including pacemaker and nitinol microscopic forceps.

This article briefly introduces the concepts of failure analysis, including root-cause analysis (RCA), and the role of failure analysis as a general engineering tool for enhancing product quality and failure prevention. It initially provides definitions of failure on several different levels, followed by a discussion on the role of failure analysis and the appreciation of quality assurance and user expectations. Systematic analysis of equipment failures reveals physical root causes that fall into one of four fundamental categories: design, manufacturing/installation, service, and material, which are discussed in the following sections along with examples. The tools available for failure analysis are then covered. Further, the article describes the categories of mode of failure: distortion or undesired deformation, fracture, corrosion, and wear. It provides information on the processes involved in RCA and the charting methods that may be useful in RCA and ends with a description of various factors associated with failure prevention.