Electromagnetic signals at microwave and millimeter-wave frequencies are well suited for inspecting dielectric materials and composite structures in many critical applications. This article presents a partial list of reported nondestructive testing (NDT) application areas for microwaves. It discusses the advantages and limitations of inspection with microwaves. The article discusses the physical principles, including reflection and refraction, absorption and dispersion, scattering, and standing waves. It provides a discussion on terahertz (THz) imaging for nondestructive evaluation (NDE). The article concludes with information on ground-penetration radar (GPR) that uses electromagnetic radiation and detects the reflected signals from subsurface structures.

Microwaves (or radar waves) are a form of electromagnetic radiation with wavelengths between 1000 cm and 1 mm in free space. One of the first important uses of microwaves in nondestructive evaluation was for components such as waveguides, attenuators, cavities, antennas, and antenna covers (radomes). This article focuses on the microwave inspection methods that were subsequently developed for evaluation of moisture content in dielectric materials; thickness measurements of thin metallic coatings on dielectric substrates; and detection of voids, delaminations, macroporosity, inclusions, and other flaws in plastic or ceramic materials. It also discusses the advantages and disadvantages and the general approaches that have been used in the development of microwave nondestructive inspection.

This article discusses the attempts made by the industry to create sensing approaches for modeling a process, part, and chemistry and kinetics. It reviews microwave curing of thick-section composites and the resin cure sensors that are used for resin cure monitoring. These include dielectric cure sensors, fiberoptics-based resin cure sensors, ultrasonics-based resin cure sensors, and dosimetry-based resin cure sensors. The article provides information on the resin cure control flow sensing, flow modeling, flow mapping, and resin flow. It addresses some practical issues in sensing resin cure and flow.

This article discusses two major sintering methods: pressureless and pressure-assisted sintering. Pressureless sintering techniques include vacuum and partial-pressure, hydrogen, and microwave sintering. Pressure-assisted consolidation techniques include overpressure sintering, sintering followed by postsinter hot isostatic pressing, hot pressing, and several rapid hot consolidation techniques. The article describes nitrogen sintering and the sintering of cermets. It reviews the furnaces used for sintering and presents the lubrication removal techniques. The article also outlines the need to control carbon and oxygen to obtain optimal properties and explains microstructure development and grain size control.

This article provides an overview of the types, properties, and applications of traditional and advanced ceramics and glasses. Principal product areas for traditional ceramics include whitewares, glazes, porcelain enamels, structural clay products, cements, and refractories. Advanced ceramics include electronic ceramics, optical ceramics, magnetic ceramics, and structural ceramics.

This article presents a detailed account of the processes involved in vat-photopolymerization-based fabrication of ceramics, namely bioceramics, structural ceramics, piezoelectric ceramics, optical ceramics, and polymer-derived ceramics. Information and methods of material preparation, curing characteristics, green-part fabrication, property identification, process design and planning, and quality control and optimization are introduced. The article also provides information on postprocessing techniques, namely debinding and sintering, as well as on the phenomenon of shrinkage and compensation.

This article presents the principles of chemical vapor deposition (CVD) with illustrations. It discusses the types of CVD processes, namely, thermal CVD, plasma CVD, laser CVD, closed-reactor CVD, chemical vapor infiltration, and metal-organic CVD. The article reviews the CVD reactions of materials related to hard, tribological, and high-temperature coatings and to free-standing structures. It concludes by reviewing the advantages, disadvantages, and applications of CVD.

This article describes the chemical composition, physical properties, thermal properties, mechanical properties, electrical properties, optical properties, magnetic properties, and chemical properties of glasses, glass-matrix composites, and glass-ceramics.

Gallium-base components can be found in a variety of products ranging from compact disk players to advanced military electronic warfare systems, owing to the factor that it can emit light, has a greater resistance to radiation and operates at faster speeds and higher temperatures. This article discusses the uses of gallium in optoelectronic devices and integrated circuits and applications of gallium. The article discusses the properties and grades of gallium arsenide and also provides information on resources of gallium. The article talks about the recovery techniques, including recovery from bauxite, zinc ore and secondary recovery process and purification. The article briefly describes the fabrication process of gallium arsenide crystals. Furthermore, the article gives a short note on world supply and demand of gallium and concludes with research and development on gallium arsenide integrated circuits.

Chemical vapor deposition (CVD) involves the formation of a coating by the reaction of the coating substance with the substrate. Serving as an introduction to CVD, the article provides information on metals, ceramics, and diamond films formed by the CVD process. It further discusses the characteristics of different pack cementation processes, including aluminizing, siliconizing, chromizing, boronizing, and multicomponent coating.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

This article reviews the applications of traditional glasses in architecture, transportation, construction, houseware, containers, and fibers. It also describes uses of specialty glasses for aerospace and military applications, biomedical and dental applications, chemical-resistant applications, lighting, information display, electronic processing and electronic devices, optical and ophthalmic products, and communications equipment.

This article is a compilation of definitions of terms related to materials characterization techniques.

Ceramic materials serve important insulative, capacitive, conductive, resistive, sensor, electrooptic, and magnetic functions in a wide variety of electrical and electronic circuitry. This article focuses on various applications of advanced ceramics in both electric power and electronics industry, namely, dielectric, piezoelectric, ferroelectric, sensing, magnetic and superconducting devices.

This article provides practical information and data on property development in engineering plastics. It discusses the effects of composition on submolecular and higher-order structure and the influence of plasticizers, additives, and blowing agents. It examines stress-strain curves corresponding to soft-and-weak, soft-and-tough, hard-and-brittle, and hard-and-tough plastics and temperature-modulus plots representative of polymers with different degrees of crystallinity, cross-linking, and polarity. It explains how viscosity varies with shear rate in polymer melts and how processes align with various regions of the viscosity curve. It discusses the concept of shear sensitivity, the nature of viscoelastic properties, and the electrical, chemical, and optical properties of different plastics. It also reviews plastic processing operations, including extrusion, injection molding, and thermoforming, and addresses related considerations such as melt viscosity and melt strength, crystallization, orientation, die swell, melt fracture, shrinkage, molded-in stress, and polymer degradation.

This article discusses the most fundamental building-block level, atomic level, molecular considerations, intermolecular structures, and supermolecular issues. It contains a table that shows the structures and lists the properties of selected commodity and engineering plastics. The article describes the effects of structure on thermal and mechanical properties. It reviews the chemical, optical, and electrical properties of engineering plastics and commodity plastics. An explanation of important physical properties, many of which are unique to polymers, is also included. The factors that must be considered when processing engineering thermoplastics are discussed. These include melt viscosity and melt strength; crystallization; orientation, die swell, shrinkage, and molded-in stress; polymer degradation; and polymer blends.

This article is a compilation of terms and definitions related to materials characterization.

Metallographic contrasting methods include various electrochemical, optical, and physical etching techniques, which in turn are enhanced by the formation of a thin transparent film on the specimen surface. This article primarily discusses etching in conjunction with light microscopy and describes several methods for film formation, namely, heat tinting, color etching, anodizing, potentiostatic etching, vapor deposition, and film deposition by sputtering. It provides information on the general procedures and precautions for etchants and reagents used in metallographic microetching, macroetching, electropolishing, chemical polishing, and other similar operations.

This article discusses the advantages, disadvantages, applications, and selection criteria of various technologies and transduction modalities that can generate and detect ultrasonic waves. These include piezoelectric transducers, electromagnetic acoustic transducers (EMATs), laser ultrasound phased array transducers, magnetostriction transducers, and couplants. The article discusses four basic types of search units with piezoelectric transducers. These include the straight-beam contact type, the angle-beam contact type, the dual-element contact type, and the immersion type. The article concludes with information on immersion or contact type focused search units.