Analytical transmission electron microscopy (ATEM) is unique among materials characterization techniques as it enables essentially the simultaneous examination of microstructural features through high-resolution imaging and the acquisition of chemical and crystallographic information from small regions of the specimen. This article illustrates the effectiveness of the technique in solving materials problems. The first section of the article provides information on analytical electron microscope (AEM) and its basic operational characteristics as well as on electron optics, electron beam/specimen interactions and the generation of a signal, signal detectors, electron diffraction, imaging, x-ray microanalysis, electron energy loss spectroscopy, and sample preparation. The second section consists of 12 examples, each illustrating a specific type of materials problem that can be solved, at least in part, with AEM.

Field ion microscopy (FIM) can be used to study the three-dimensional structure of materials, such as metals and semiconductors, because successive atom layers can be ionized and removed from the surface by field evaporation. The ions removed from the surface by field evaporation can be analyzed chemically by coupling to the microscope a time-of-flight mass spectrometer of single-particle sensitivity, known as the atom probe (AP). This article describes the principles, sample preparation, and quantitative analysis of FIM. It also provides information on the principles, instrument design and operation, mass spectra and their interpretation, and applications of AP microanalysis.

Scanning electron microscopy (SEM) has shown various significant improvements since it first became available in 1965. These improvements include enhanced resolution, dependability, ease of operation, and reduction in size and cost. This article provides a detailed account of the instrumentation and principles of SEM, broadly explaining its capabilities in resolution and depth of field imaging. It describes three additional functions of SEM, including the use of channeling patterns to evaluate the crystallographic orientation of micron-sized regions; use of backscattered detectors to reveal grain boundaries on unetched samples and domain boundaries in ferromagnetic alloys; and the use of voltage contrast, electron beam-induced currents, and cathodoluminescence for the characterization and failure analysis of semiconductor devices. The article compares the features of SEM with that of scanning Auger microscopes, and lists the applications and limitations of SEM.

Scanning electron microscopy (SEM) has unique capabilities for analyzing fracture surfaces. This article discusses the basic principles and practice of SEM, with an emphasis on its applications in fractography. The topics include an introduction to SEM instrumentation, imaging and analytical capabilities, specimen preparation, and the interpretation of fracture features. SEM can be subdivided into four systems, namely, illuminating/imaging, information, display, and vacuum systems. The article also describes the major criteria and techniques of SEM specimen preparation, and the general features of ductile and brittle fracture modes.

The application of transmission electron microscope to the study of fracture surfaces and related phenomena has made it possible to obtain magnifications and depths of field much greater than those possible with light (optical) microscopes. This article reviews the methods for preparing single-stage, double-stage, and extraction replicas of fracture surfaces. It discusses the types of artifacts and their effects on these replicas, and provides information on shadowing of replicas. The article concludes with a comparison of the transmission electron and scanning electron fractographs with illustrations.

This article presents examples of the visual fracture examination that illustrate the procedure as it applies to failure analysis and quality determination. It describes the techniques and procedures for the visual and light microscopic examination of fracture surfaces with illustrations. The article also describes microscopic and macroscopic features of the different fracture mechanisms with illustrations with emphasis on visual and light microscopy examination. The types of fractures considered include ductile fractures, tensile-test fractures, brittle fractures, fatigue fractures, and high-temperature fractures.

The scanning electron microscope (SEM) is one of the most versatile instruments for investigating the microscopic features of most solid materials. The SEM provides the user with an unparalleled ability to observe and quantify the surface of a sample. This article discusses the development of SEM technology and operating principles of basic systems of SEM. The basic systems covered include the electron optical column, signal detection and display equipment, and the vacuum system. The processes involved in the preparation of samples for observation using an SEM are described, and the application of SEM in fractography is discussed. The article covers the failure mechanisms of ductile failure, brittle failure, mixed-mode failure, and fatigue failure. Lastly, image dependence on microscope type and operating parameters is also discussed.

This article illustrates the polymer matrices used for composite materials. It describes the use of prepeg materials in manufacturing high-performance composites. The article discusses the various infusion processes for the development of fiber-reinforced composites, namely, resin transfer molding, vacuum-assisted resin transfer molding, and resin film infusion. It explains the composite- and matrix-toughening methods for fiber-reinforced composites, such as dispersed-phase toughening and interlayer toughening. The article concludes with information on optical microscopy, which provides an insight into the micro- and macrostructure of fiber-reinforced composites.

This article outlines the beam/sample interactions and the basic instrumental design of a scanning electron microscopy (SEM), which include the electron gun, probeforming column (consisting of magnetic electron lenses, apertures, and scanning coils), electron detectors, and vacuum system. It discusses the contrasts mechanisms used for imaging and analyzing materials in the SEM. These include the topographic contrast, compositional contrast, and electron channeling pattern and orientation contrast. Special instrumentation and accessory equipment used at elevated pressures and during the X-ray microanalysis are reviewed. The article also provides information on the sample preparation procedure and the materials applications of the SEM.

The analysis of composite materials using optical microscopy is a process that can be made easy and efficient with only a few contrast methods and preparation techniques. This article is intended to provide information that will help an investigator select the appropriate microscopy technique for the specific analysis objectives with a given composite material. The article opens with a discussion of macrophotography and microscope alignment, and then goes on to describe various illumination techniques that are useful for specific analysis requirements. These techniques include bright-field illumination, dark-field illumination, polarized-light microscopy, interference and contrast microscopy, and fluorescence microscopy. The article also provides a discussion of sample preparation materials such as dyes, etchants, and stains for the analysis of composite materials using optical microscopy.

This article describes the various aspects relating to the selection and preparation of ultrathin-section specimens of fiber-reinforced polymeric composites for examination by transmitted light microscopy. It provides information on the contrast-enhancement methods used by transmitted-light microscopy and optimization of microscope conditions. Examples of composite ultrathin sections analyzed using transmitted-light microscopy contrast methods are also presented.

Three-dimensional microscopy can be used to reveal the shape, distribution, and connectivity of three-dimensional (3D) features that lie buried within an opaque material. This article discusses several experimental techniques that can be used to generate 3D images. These include serial sectioning, focused ion beam tomography, atom probe tomography, and X-ray microtomography. Nine case studies are presented that represent the work of the various research groups currently working on 3D microscopy using serial sectioning and illustrate the variants of the basic experimental techniques. The article also discusses the techniques for reconstruction and visualization of 3D microstructures with advanced computer software and hardware.

This article introduces the concepts of electron and light microscopy with some general features of imaging systems and the ideas of magnification, resolution, depth of field, depth of focus, and lens aberrations as they apply to simple and familiar light-optical systems. In addition, it describes the differences between electron and light in the context of their respective microscopy techniques.

This article provides information on the basic components of a light microscope, including the illumination system, collector lens, and optical and mechanical components. It describes optical performance in terms of image aberrations, resolution, and depth of field. The article discusses the examination of specimen surfaces using polarized light, phase contrast, oblique illumination, dark-field illumination, bright-field illumination, interference-contrast illumination, and phase contrast illumination. Special techniques and devices that may be used with the optical microscope, to obtain additional information, are also described. The article concludes with information on photomicroscopy and macrophotography.

This article provides detailed information on the instrumentation and principles of the scanning electron microscope (SEM). It begins with a description of the primary components of a conventional SEM instrument. This is followed by a discussion on the advantages and disadvantages of the SEM compared with other common microscopy and microanalysis techniques. The following sections cover the critical issues regarding sample preparation, the physical principles regarding electron beam-sample interaction, and the mechanisms for many types of image contrast. The article also presents the details of SEM-based techniques and specialized SEM instruments. It ends with example applications of various SEM modes.

Transmission electron microscopy (TEM) approach enables essentially simultaneous examination of microstructural features through imaging from lower magnifications to atomic resolution and the acquisition of chemical and crystallographic information from small regions of the thin specimen. This article discusses fundamentals of the technique, especially for solving materials problems. Background information is provided to help understand basic operations and principles, including instrumentation, the physics of signal generation and detection, image formation, electron diffraction, and spectrometry techniques with data analysis.

This article provides an overview of scanning probe microscopes (scanning tunneling microscope and atomic force microscope (AFM)), covering the various operating modes and probes used in these instruments and providing information on AFM instrumentation, applications, and analyses.

This article focuses on laboratory atomic force microscopes (AFMs) used in ambient air and liquid environments. It begins with a discussion on the origin of AFM and development trends occurring in AFM. This is followed by a section on the general principles of AFM and a comprehensive list of AFM scanning modes. There is a brief description of how each mode works and what types of applications can be made with each mode. Some of the processes involved in preparation of samples (bulk materials and those placed on a substrate) scanned in an AFM are then presented. The article provides information on the factors applicable to the accuracy and precision of AFM measurements. It ends by discussing the applications for AFMs in the fields of science, technology, and engineering.

Microscopy is a valuable tool in materials investigations related to problem solving, failure analysis, advanced materials development, and quality control. This article describes the sample preparation techniques of composite materials. These techniques include mounting, rough grinding, and polishing. The preparation techniques of ultrathin sections are also summarized. The article explains the illumination methods used by reflected light microscopy to view a specimen. These consist of epi-bright-field illumination, epi-dark-field illumination, epi-polarized light, and epi-fluorescence. The article also provides information on transmitted light microscopy.