Search Results for microscopic process

This article focuses on the various technology drivers for finishing methods, namely, tolerance, consistency, surface quality, and productivity. Every finishing method may be viewed as a manufacturing system consisting of four input categories: machine tool, processing tool, work material, and operational factors. The article provides a classification of finishing as a surface generation process and addresses the characteristics of the generated surfaces and the methods used to measure them. It describes the thermomechanical interactions occurring between the processing tool and the work material in the presence of machine tool and operational factors.

Coextrusion is defined as the simultaneous extrusion of two or more metals to form an integral product that can be carried out using conventional extrusion or drawing equipment at a temperature appropriate to the metal system being formed. This article discusses the applications, billet configurations, and metal flow modes of coextrusion. It presents the analytical studies of coextrusion: deformation energy methods, lower-bound (slab) analyses, upper-bound analyses, and finite-element analyses. These studies are used to identify the regime of material properties and process variables for which sound extrusions can be obtained. The article concludes with a discussion on the state-of-the-art of coextrusion that assists in developing process models, which accurately describe both the macroscopic and microscopic aspects of a process.

The scanning electron microscope (SEM) is one of the most versatile instruments for investigating the microscopic features of most solid materials. The SEM provides the user with an unparalleled ability to observe and quantify the surface of a sample. This article discusses the development of SEM technology and operating principles of basic systems of SEM. The basic systems covered include the electron optical column, signal detection and display equipment, and the vacuum system. The processes involved in the preparation of samples for observation using an SEM are described, and the application of SEM in fractography is discussed. The article covers the failure mechanisms of ductile failure, brittle failure, mixed-mode failure, and fatigue failure. Lastly, image dependence on microscope type and operating parameters is also discussed.

This article provides a discussion on the following photographic equipment: point-and-shoot cameras, digital single-reflex cameras, stand-mounted digital zoom cameras, and digital microscope cameras. It presents two principal types of optical microscopes that are appropriate for visual examination of fractured parts: the stereomicroscope and the single-light-path digital microscope. The common features present on fracture surfaces are each considered separately, both in their significance and as photographic challenges. The article also presents a short note on low-magnification scanning electron microscopy and postcapture image processing.

This article provides an overview of fractography and explains how it is used in failure analysis. It reviews the basic types of fracture processes, namely, ductile, brittle, fatigue, and creep, principally in terms of fracture appearances, such as microstructure. The article also describes the general features of fatigue fractures in terms of crack initiation and fatigue crack propagation.

Particle image analysis of metal powders can be easily performed with optical macroscopes and microscopes. This article provides examples of the particle image analysis on powders used in the powder metallurgy industry.

This article commences with a summary of fatigue processes and mechanisms. It focuses on fractography of fatigue. Characteristic fatigue fracture features that can be discerned visually or under low magnification are described. Typical microscopic features observed on structural metals are presented subsequently, followed by a brief discussion of fatigue in nonmetals. The article reviews the various macroscopic and microscopic features to characterize the history and growth rate of fatigue in metals. It concludes with a description of fatigue of polymers and composites.

Engineering component and structure failures manifest through many mechanisms but are most often associated with fracture in one or more forms. This article introduces the subject of fractography and aspects of how it is used in failure analysis. The basic types of fracture processes (ductile, brittle, fatigue, and creep) are described briefly, principally in terms of fracture appearances. A description of the surface, structure, and behavior of each fracture process is also included. The article provides a framework from which a prospective analyst can begin to study the fracture of a component of interest in a failure investigation. Details on the mechanisms of deformation, brittle transgranular fracture, intergranular fracture, fatigue fracture, and environmentally affected fracture are also provided.

Failure analysis is an investigative process that uses visual observations of features present on a failed component fracture surface combined with component and environmental conditions to determine the root cause of a failure. The primary means of recording the conditions and features observed during a failure analysis investigation is photography. Failure analysis photographic imaging is a combination of both science and art; experience and proper imaging techniques are required to produce an accurate and meaningful fracture surface photograph. This article reviews photographic principles and techniques as applied to failure analysis, both in the field and in the laboratory. The discussion covers the processes involved in field and laboratory photographic documentations, provides a description of professional digital cameras, and gives information on photographic lighting and microscopic photography. Special techniques can be employed to deal with highly reflective conditions and are also described in this article.

This article presents a basic overview of technology-driven advances in the imaging of primarily metallic fracture surfaces. It describes various types of microscopes, including scanning electron, dual-beam, ion source, and transmission electron microscopes, and their capabilities. It also covers other useful hardware, such as computer-aided tomography (CAT) and micro-computer-aided tomography (micro-CAT) instruments. The article introduces some of the fracture image postprocessing methods and software, including image registration or alignment, focus stacking, Z-stacking, focal plane merging, and image stitching.

This article focuses on laboratory atomic force microscopes (AFMs) used in ambient air and liquid environments. It begins with a discussion on the origin of AFM and development trends occurring in AFM. This is followed by a section on the general principles of AFM and a comprehensive list of AFM scanning modes. There is a brief description of how each mode works and what types of applications can be made with each mode. Some of the processes involved in preparation of samples (bulk materials and those placed on a substrate) scanned in an AFM are then presented. The article provides information on the factors applicable to the accuracy and precision of AFM measurements. It ends by discussing the applications for AFMs in the fields of science, technology, and engineering.

Electron probe microanalysis (EPMA) makes it possible to combine structural and compositional analysis in one operation. This article describes the basic concepts of microanalysis and the processing of EPMA that involves the measurement of the characteristic X-rays emitted from a microscopic part of a solid specimen bombarded by a beam of accelerated electrons. It provides information on the various aspects of energy-dispersive spectrometry (EDS) and wavelength-dispersive spectrometry (WDS), and elucidates the qualitative analysis of the major constituents of EDS and WDS. The article includes information on the analog and digital compositional mapping of elemental distribution, and describes the strengths and weaknesses of WDS and EDS spectrometers in X-ray mapping. It also outlines the application of EPMA for solving various problems in materials science.

This article commences with a discussion on the characteristics of stress-corrosion cracking (SCC) and describes crack initiation and propagation during SCC. It reviews the various mechanisms of SCC and addresses electrochemical and stress-sorption theories. The article explains the SCC, which occurs due to welding, metalworking process, and stress concentration, including options for investigation and corrective measures. It describes the sources of stresses in service and the effect of composition and metal structure on the susceptibility of SCC. The article provides information on specific ions and substances, service environments, and preservice environments responsible for SCC. It details the analysis of SCC failures, which include on-site examination, sampling, observation of fracture surface characteristics, macroscopic examination, microscopic examination, chemical analysis, metallographic analysis, and simulated-service tests. It provides case studies for the analysis of SCC service failures and their occurrence in steels, stainless steels, and commercial alloys of aluminum, copper, magnesium, and titanium.

The analysis of composite materials using optical microscopy is a process that can be made easy and efficient with only a few contrast methods and preparation techniques. This article is intended to provide information that will help an investigator select the appropriate microscopy technique for the specific analysis objectives with a given composite material. The article opens with a discussion of macrophotography and microscope alignment, and then goes on to describe various illumination techniques that are useful for specific analysis requirements. These techniques include bright-field illumination, dark-field illumination, polarized-light microscopy, interference and contrast microscopy, and fluorescence microscopy. The article also provides a discussion of sample preparation materials such as dyes, etchants, and stains for the analysis of composite materials using optical microscopy.

Physical vapor deposition (PVD) coatings are harder than any metal and are used in applications that cannot tolerate even microscopic wear losses. This article describes the three most common PVD processes: thermal evaporation, sputtering, and ion plating. It also discusses ion implantation in the context of research and development applications.

X-ray spectroscopy is generally accepted as the most useful ancillary technique that can be added to any scanning electron microscope (SEM), even to the point of being considered a necessity by most operators. While “stand-alone” x-ray detection systems are used less frequently in failure analysis than the more exact instrumentation employed in SEMs, the technology is advancing and is worthy of note due to its capability for nondestructive analysis and application in the field. This article begins with information on the basis of the x-ray signal. This is followed by information on the operating principles and applications of detectors for x-ray spectroscopy, namely energy-dispersive spectrometers, wavelength-dispersive spectrometers, and handheld x-ray fluorescence systems. The processes involved in x-ray analysis in the SEM and handheld x-ray fluorescence analysis are then covered. The article ends with a discussion on the applications of x-ray spectroscopy in failure analysis.

Fatigue failure of engineering components and structures results from progressive fracture caused by cyclic or fluctuating loads. Fatigue is an important potential cause of mechanical failure, because most engineering components or structures are or can be subjected to cyclic loads during their lifetime. This article focuses on fractography of fatigue. It provides an abbreviated summary of fatigue processes and mechanisms: fatigue crack initiation, fatigue crack propagation, and final fracture,. Characteristic fatigue fracture features that can be discerned visually or under low magnification are then described. Typical microscopic features observed on structural metals are presented subsequently, followed by a brief discussion on fatigue in polymers and polymer-matrix composites.

The electron backscatter diffraction (EBSD) technique has proven to be very useful in the measurement of crystallographic textures, orientation relationships between phases, and both plastic and elastic strains. This article focuses on backscatter diffraction in a scanning electron microscope and describes transmission Kikuchi diffraction. It begins with a discussion on the origins of EBSD and the collection of EBSD patterns. This is followed by sections providing information on EBSD spatial resolution and system operation of EBSD. Various factors pertinent to perform an EBSD experiment are then covered. The article further describes the processes involved in sample preparation that are critical to the success or usefulness of an EBSD experiment. It also discusses the applications of EBSD to bulk samples and the development of EBSD indexing methods.

This article discusses the numerical simulation of the forming of aluminum alloy sheet metals. The macroscopic and microscopic aspects of the plastic behavior of aluminum alloys are reviewed. The article presents constitutive equations suitable for the description of aluminum alloy sheets. It explains testing procedures and analysis methods that are used to measure the relevant data needed to identify the material coefficients. The article describes the various formulations of finite element methods used in sheet metal forming process simulations. Stress-integration procedures for both continuum and crystal-plasticity mechanics are also discussed. The article also provides various examples that illustrate the simulation of aluminum sheet forming.