The analysis of composite materials using optical microscopy is a process that can be made easy and efficient with only a few contrast methods and preparation techniques. This article is intended to provide information that will help an investigator select the appropriate microscopy technique for the specific analysis objectives with a given composite material. The article opens with a discussion of macrophotography and microscope alignment, and then goes on to describe various illumination techniques that are useful for specific analysis requirements. These techniques include bright-field illumination, dark-field illumination, polarized-light microscopy, interference and contrast microscopy, and fluorescence microscopy. The article also provides a discussion of sample preparation materials such as dyes, etchants, and stains for the analysis of composite materials using optical microscopy.

The microstructure in the longitudinal direction of conventional high-alloy tool steels (HATS) depends very much on the degree of hot working. Comparing different processes, the highest processing temperature proves to be decisive for coarseness of the microstructure. This article provides a discussion on the microstructure of conventional HATS and hot isostatically pressed high-speed steel. The effects of the processing in cold worked HATS are illustrated.

Visual inspection is a nondestructive testing technique that provides a means to detect and examine a variety of surface flaws, such as corrosion, contamination, surface finish, and surface discontinuities. This article discusses the equipment used to aid visual inspection, including borescopes (rigid and flexible), optical sensors, and magnifying systems. The article discusses the special features of borescopes, the factors that influence the choice of a flexible or rigid borescope for use in a specific application, and some of the image sensors used in visual inspection.

This article is a compilation of definitions of terms related to metallography and microstructures.

Microstructural analysis of specialized types of magnetic materials is centered on the examination of optical, electron, and scanning probe metallographic techniques unique to magnetic materials. This article provides a comprehensive overview of magnetic materials, their characteristics and sample preparation procedures. It reviews the methods pertaining to the microstructural examination of bulk magnetic materials, including microscopy techniques specified to magnetic materials characterization, with specific examples. The techniques used in the study of magnetic domain structures (microstructure) include the magneto-optical Kerr method, the Faraday method, the Bitter technique, scanning electron microscopy (magnetic contrast Types I and II), scanning electron microscopy with polarization analysis, Lorentz transmission electron microscopy, and magnetic force microscopy. The article also illustrates the microstructure of different types of soft magnetic material and permanent magnets.

This article provides an overview of the origin of metallography. It presents information on how to select a section from a specimen and prepare it for macroscopic analysis. The article describes the macroscopic analysis of steel fracture surfaces with emphasis on ductile, brittle, and fatigue fracture with illustrations. It discusses microanalysis with a focus on the method of light microscopy and includes information of scanning electron microscope in fractography. The article also explains the characteristics of solidification, transformation, deformation structures, and discontinuities that are present in a microstructure. It concludes with information on image analysis.

Scanning electron microscopy (SEM) has unique capabilities for analyzing fracture surfaces. This article discusses the basic principles and practice of SEM, with an emphasis on its applications in fractography. The topics include an introduction to SEM instrumentation, imaging and analytical capabilities, specimen preparation, and the interpretation of fracture features. SEM can be subdivided into four systems, namely, illuminating/imaging, information, display, and vacuum systems. The article also describes the major criteria and techniques of SEM specimen preparation, and the general features of ductile and brittle fracture modes.

This article provides information on the basic components of a light microscope, including the illumination system, collector lens, and optical and mechanical components. It describes optical performance in terms of image aberrations, resolution, and depth of field. The article discusses the examination of specimen surfaces using polarized light, phase contrast, oblique illumination, dark-field illumination, bright-field illumination, interference-contrast illumination, and phase contrast illumination. Special techniques and devices that may be used with the optical microscope, to obtain additional information, are also described. The article concludes with information on photomicroscopy and macrophotography.

This article reviews the characterization methods for producing 3-D microstructural data sets. The methods include serial sectioning by mechanical material removal method and focused ion beam tomography method. The article describes how these data sets are used in realistic 3-D simulations of microstructural evolution during materials processing and materials response. It also explains how the 3-D experimental data are actually input and used in the simulations using phase-field modeling and finite-element modeling.

Scanning electron microscopy (SEM) has shown various significant improvements since it first became available in 1965. These improvements include enhanced resolution, dependability, ease of operation, and reduction in size and cost. This article provides a detailed account of the instrumentation and principles of SEM, broadly explaining its capabilities in resolution and depth of field imaging. It describes three additional functions of SEM, including the use of channeling patterns to evaluate the crystallographic orientation of micron-sized regions; use of backscattered detectors to reveal grain boundaries on unetched samples and domain boundaries in ferromagnetic alloys; and the use of voltage contrast, electron beam-induced currents, and cathodoluminescence for the characterization and failure analysis of semiconductor devices. The article compares the features of SEM with that of scanning Auger microscopes, and lists the applications and limitations of SEM.

Failure analysis is a process of acquiring specified information regarding the appropriateness of the design of a part, the competence with which the various steps of its manufacture have been performed, any abuse suffered by it in packing and transportation, or the severity of service under which failure has occurred. Beginning with a discussion of the various stages of failure analysis of glass and ceramic materials, this article focuses on descriptive and quantitative fracture surface analysis techniques that are used in the examination of glass and surfaces created by fracture and the interpretation of the fracture markings seen on these surfaces. Details are provided for the procedures for locating fracture origins, determining direction of crack propagation, learning the sequence of crack propagation, deducing the stress state at the time of fracture, and observing interactions between crack fronts and inclusions, etc. A separate fractography terminology is provided in this article.

This article is intended to provide the reader with a good understanding of the underlying science, technology, and the most common applications of focused ion beam (FIB) instruments. It begins with a survey of the various types of FIB instruments and their configurations, discusses the essential components, and explains their function only to the extent that it helps the operator obtain the desired results. An explanation of how the components of ion optical column shape and steer the ion beam to the desired target locations is then provided. The article also reviews the many diverse accessories and options that enable the instrument to realize its full potential across all of the varied applications. This is followed by a detailed analysis of the physical processes associated with the ion beam interacting with the sample. Finally, a complete survey of the most prominent FIB applications is presented.

Three-dimensional microscopy can be used to reveal the shape, distribution, and connectivity of three-dimensional (3D) features that lie buried within an opaque material. This article discusses several experimental techniques that can be used to generate 3D images. These include serial sectioning, focused ion beam tomography, atom probe tomography, and X-ray microtomography. Nine case studies are presented that represent the work of the various research groups currently working on 3D microscopy using serial sectioning and illustrate the variants of the basic experimental techniques. The article also discusses the techniques for reconstruction and visualization of 3D microstructures with advanced computer software and hardware.

Fractography is the means and methods for characterizing a fractured specimen or component. This includes the examination of fracture-exposed surfaces and the interpretation of the fracture markings as well as the examination and interpretation of crack patterns. This article describes the former of these two parts of fractography. It presents the techniques of fractography and explains fracture markings using glass and ceramic examples. The article also discusses the fracture modes in ceramics and provides examples of fracture origins.

The electron backscatter diffraction (EBSD) technique has proven to be very useful in the measurement of crystallographic textures, orientation relationships between phases, and both plastic and elastic strains. This article focuses on backscatter diffraction in a scanning electron microscope and describes transmission Kikuchi diffraction. It begins with a discussion on the origins of EBSD and the collection of EBSD patterns. This is followed by sections providing information on EBSD spatial resolution and system operation of EBSD. Various factors pertinent to perform an EBSD experiment are then covered. The article further describes the processes involved in sample preparation that are critical to the success or usefulness of an EBSD experiment. It also discusses the applications of EBSD to bulk samples and the development of EBSD indexing methods.

This article describes the six fundamental factors that decide a tool's performance. These are mechanical design, grade of tool steel, machining procedure, heat treatment, grinding, and handling. A deficiency in any one of the factors can lead to a tool and die failure. The article presents a seven-step procedure to be followed when looking for the reason for a failure. A review of the results of the seven-point investigation may lead directly to the source of failure or narrow the field of investigation to permit the use of special tests.