Search Results for microelectronics

This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform corrosion, galvanic corrosion, pitting corrosion, creep corrosion, dendrite growth, fretting, stress-corrosion cracking, and whisker growth. The article presents effective measures for minimizing the moisture retention in hermetic packages and/or moisture ingress in plastic packages. It concludes with information corrosion tests.

This article provides information on the development of finite element analysis (FEA) and describes the general-purpose applications of FEA software programs in structural and thermal, static and transient, and linear and nonlinear analyses. It discusses special-purpose finite element applications in piping and pressure vessel analysis, impact analysis, and microelectronics. The article describes the steps involved in the design process using the FEA. It concludes with two case histories that involve the use of FEA in failure analysis.

This article provides a summary of the concepts discussed in the Section “Corrosion in Specific Industries” in the ASM Handbook, Volume 13C:Corrosion: Environments and Industries. This Section applies the fundamental understanding of corrosion and knowledge of materials of construction to practical applications. The industries addressed are nuclear power, fossil and alternative fuel, land transportation, air transportation, microelectronics, chemical processing, pulp and paper, food and beverage, pharmaceutical and medical technology, petroleum and petrochemical, building, and mining and metal processing.

Ultrasonic metal welding is a solid-state welding process that produces coalescence through the simultaneous application of localized high-frequency vibratory energy and moderate clamping forces. This article discusses the parameters to be considered when selecting a suitable welder for ultrasonic metal welding. It details the personnel requirements, advantages, limitations, and applications, namely, wire welds, spot welds, continuous seam welds, and microelectronic welds of ultrasonic metal welding.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

This article begins with a discussion on the advantages and limitation of ultrasonic welding (USW). It describes variations of the USW process which can produce different weld geometries. These variations are helpful in producing spot welds, line welds, continuous seam welds, ring welds, and microelectronic welds. The article provides information on the functions of USW personnel and describes the special conditions in USW which include the condition of the surface, the use of an interlayer, and the control of resonance. It concludes with a description on the weld quality, the influencing factors, surface appearance and deformation, and metallographic examination.

When complex designs, transient loadings, and nonlinear material behavior must be evaluated, computer-based techniques are used. This is where the finite-element analysis (FEA) is most applicable and provides considerable assistance in design analysis as well as failure analysis. This article provides a general view on the applicability of finite-element modeling in conducting analyses of failed components. It highlights the uses of finite-element modeling in the area of failure analysis and design, with emphasis on structural analysis. The discussion covers the general development and both general- and special-purpose applications of FEA. The special-purpose applications of FEA covered are piping and pressure vessel analysis, impact analysis, and microelectronic and microelectromechanical systems analysis. The article provides case histories that involved the use of FEA in failure analysis.

This article is a detailed account of the advantages, disadvantages, and applications of microdispensing processes used in electronics manufacturing industries. The discussion covers various approaches to control material flow, namely time pressure, auger, positive displacement, and progressive cavity pump dispensing. The concept of valving to control starting and stopping is also discussed. The applications include printing solders in microelectronic packaging, printing to pads, printing conductive patterns for antennas, printing active circuits, printing on flexible surfaces, and structural printing.

This article presents an overview of advanced composites, namely, polymer matrix composites, metal-matrix composites, ceramic-matrix composites, and carbon-matrix composites. It also provides information on the properties and applications of the composites in thermal management and electronic packaging.

This article provides an overview of the implementation of wire embedding with ultrasonic energy and thermal embedding for polymer additive manufacturing, discussing the applications and advantages of the technique. The mechanical and electrical performance of the embedded wires is compared with that of other conductive ink processes in terms of electrical conductivity and mechanical strength.

Microstructural analysis is the combined characterization of the morphology, elemental composition, and crystallography of microstructural features through the use of a microscope. This article reviews three types of the most commonly used electron microscopies in metallurgical studies, namely scanning electron microscopy, electron probe microanalysis, and transmission electron microscopy. It briefly describes the operating principles, instrumentation which includes energy dispersive X-ray detectors, spatial resolution, typical use of the techniques, elemental analysis detection threshold and precision, limitations, sample requirements, and the capabilities of related techniques.

This article focuses on the isothermal fatigue of solder materials. It discusses the effect of strain range, frequency, hold time, temperature, and environment on isothermal fatigue life. The article provides information on various isothermal fatigue testing methods used to assess solder joint reliability. These include the accelerated thermal cycling test and isothermal mechanical deflection system test.

Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis are also presented. The article introduces several frequently used methods for solder joint failure detection, prevention, and isolation (identification for the failed location).