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Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004170
EISBN: 978-1-62708-184-9
... Abstract This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform...
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Published: 01 January 2006
Fig. 2 Common sources of corrosion in microelectronics More
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Published: 15 December 2019
Fig. 3 Example microelectronics interconnect geometry, utilizing laterally patterned stacks of various insulating and conducting layers on the surface of a semiconductor More
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Published: 15 December 2019
Fig. 4 A few methods for cross-sectioning microelectronics device architecture for analysis of buried layers More
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Published: 31 October 2011
Fig. 2 Solid-state microelectronic devices, beginning at the silicon chip level, involve assembly, including by chemical (e.g., deposition and reaction), welding (e.g., die bonding and soldering), and mechanical (e.g., pressure contact) means. Here an assembled electrically erasable More
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Published: 01 January 1993
Fig. 4 Ultrasonic wire welder used to bond wires for microelectronic applications More
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006554
EISBN: 978-1-62708-290-7
..., and progressive cavity pump dispensing. The concept of valving to control starting and stopping is also discussed. The applications include printing solders in microelectronic packaging, printing to pads, printing conductive patterns for antennas, printing active circuits, printing on flexible surfaces...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001285
EISBN: 978-1-62708-170-2
... Abstract This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004144
EISBN: 978-1-62708-184-9
... to practical applications. The industries addressed are nuclear power, fossil and alternative fuel, land transportation, air transportation, microelectronics, chemical processing, pulp and paper, food and beverage, pharmaceutical and medical technology, petroleum and petrochemical, building, and mining...
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005607
EISBN: 978-1-62708-174-0
... for ultrasonic metal welding. It details the personnel requirements, advantages, limitations, and applications, namely, wire welds, spot welds, continuous seam welds, and microelectronic welds of ultrasonic metal welding. clamping force coalescence continuous seam welds high-frequency vibratory energy...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003526
EISBN: 978-1-62708-180-1
... applications in piping and pressure vessel analysis, impact analysis, and microelectronics. The article describes the steps involved in the design process using the FEA. It concludes with two case histories that involve the use of FEA in failure analysis. failure analysis finite element analysis impact...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001384
EISBN: 978-1-62708-173-3
... welds, and microelectronic welds. The article provides information on the functions of USW personnel and describes the special conditions in USW which include the condition of the surface, the use of an interlayer, and the control of resonance. It concludes with a description on the weld quality...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006773
EISBN: 978-1-62708-295-2
... and both general- and special-purpose applications of FEA. The special-purpose applications of FEA covered are piping and pressure vessel analysis, impact analysis, and microelectronic and microelectromechanical systems analysis. The article provides case histories that involved the use of FEA in failure...
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Published: 31 October 2011
Fig. 1 Microelectromechanical systems, such as the one shown here, also must be assembled, typically by mechanical interlocking. Such devices are typically made using techniques first developed for use in microelectronics; i.e., photoetching and deposition. More
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... and electronic (also called microelectronic) packaging are available now. Their advantages include: Extremely high thermal conductivities (over twice that of copper) Low, tailorable coefficients of thermal expansion (CTE) Weight savings up to 80% Size reductions up to 65% Extremely high...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006558
EISBN: 978-1-62708-290-7
... of Aerosol-Jet-Printed Electrolyte-Gated Transistors Based on Poly(3-hexylthiophene) , ACS Appl. Mater. Interfaces , Vol 5 , 2013 , p 6580 – 6585 10.1021/am401200y 3. Zhang Y. , Liu C. , and Whalley D. , Direct-Write Techniques for Maskless Production of Microelectronics...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003252
EISBN: 978-1-62708-199-3
...) Typical Uses Characterizing fracture surface micro-appearance and determining the nature of the fracture process (dimple rupture, cleavage, fatigue, intergranular environmentally enhanced fracture, etc.) Quality assurance examination of microelectronic devices, interconnections, bonds, etc...
Series: ASM Handbook
Volume: 19
Publisher: ASM International
Published: 01 January 1996
DOI: 10.31399/asm.hb.v19.a0002413
EISBN: 978-1-62708-193-1
.... , Fatigue and Thermal Fatigue Testing of Pb-Sn Solder Joints , Proc. Third Annual Electronic Packaging and Corrosion in Microelectronics Conf. , Nicholson M.E. , Ed., ASM International , 1987 , p 269 – 274 9. Frear D. , Grivas D. , McCormack M. , Tribula D...
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
.... References References 1. Puttlitz K.J. and Stalter K.A. , Handbook of Lead-Free Solder Technology for Microelectronic Assemblies , CRC Press , 2004 10.1201/9780203021484 2. Ma H. and Suhling J.C. , A Review of Mechanical Properties of Lead-Free Solders for Electronic...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004173
EISBN: 978-1-62708-184-9
... International , Nov 1994 , p 181 – 187 5. Axtell S. , Failure Analysis of Thick-Film Resistors in Sulfur-Containing Environments , Microelectronic Failure Analysis Desk Reference, 2002 Supplement , Kane T. , Ed., Electronic Device Failure Analysis Society, affiliate of ASM...