Search Results for microelectronic systems

When complex designs, transient loadings, and nonlinear material behavior must be evaluated, computer-based techniques are used. This is where the finite-element analysis (FEA) is most applicable and provides considerable assistance in design analysis as well as failure analysis. This article provides a general view on the applicability of finite-element modeling in conducting analyses of failed components. It highlights the uses of finite-element modeling in the area of failure analysis and design, with emphasis on structural analysis. The discussion covers the general development and both general- and special-purpose applications of FEA. The special-purpose applications of FEA covered are piping and pressure vessel analysis, impact analysis, and microelectronic and microelectromechanical systems analysis. The article provides case histories that involved the use of FEA in failure analysis.

This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform corrosion, galvanic corrosion, pitting corrosion, creep corrosion, dendrite growth, fretting, stress-corrosion cracking, and whisker growth. The article presents effective measures for minimizing the moisture retention in hermetic packages and/or moisture ingress in plastic packages. It concludes with information corrosion tests.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

This article begins with a discussion on the advantages and limitation of ultrasonic welding (USW). It describes variations of the USW process which can produce different weld geometries. These variations are helpful in producing spot welds, line welds, continuous seam welds, ring welds, and microelectronic welds. The article provides information on the functions of USW personnel and describes the special conditions in USW which include the condition of the surface, the use of an interlayer, and the control of resonance. It concludes with a description on the weld quality, the influencing factors, surface appearance and deformation, and metallographic examination.

This article is a detailed account of the advantages, disadvantages, and applications of microdispensing processes used in electronics manufacturing industries. The discussion covers various approaches to control material flow, namely time pressure, auger, positive displacement, and progressive cavity pump dispensing. The concept of valving to control starting and stopping is also discussed. The applications include printing solders in microelectronic packaging, printing to pads, printing conductive patterns for antennas, printing active circuits, printing on flexible surfaces, and structural printing.

This article provides a summary of the concepts discussed in the Section “Corrosion in Specific Industries” in the ASM Handbook, Volume 13C:Corrosion: Environments and Industries. This Section applies the fundamental understanding of corrosion and knowledge of materials of construction to practical applications. The industries addressed are nuclear power, fossil and alternative fuel, land transportation, air transportation, microelectronics, chemical processing, pulp and paper, food and beverage, pharmaceutical and medical technology, petroleum and petrochemical, building, and mining and metal processing.

Ultrasonic metal welding is a solid-state welding process that produces coalescence through the simultaneous application of localized high-frequency vibratory energy and moderate clamping forces. This article discusses the parameters to be considered when selecting a suitable welder for ultrasonic metal welding. It details the personnel requirements, advantages, limitations, and applications, namely, wire welds, spot welds, continuous seam welds, and microelectronic welds of ultrasonic metal welding.

This article presents an overview of advanced composites, namely, polymer matrix composites, metal-matrix composites, ceramic-matrix composites, and carbon-matrix composites. It also provides information on the properties and applications of the composites in thermal management and electronic packaging.

This article provides information on the development of finite element analysis (FEA) and describes the general-purpose applications of FEA software programs in structural and thermal, static and transient, and linear and nonlinear analyses. It discusses special-purpose finite element applications in piping and pressure vessel analysis, impact analysis, and microelectronics. The article describes the steps involved in the design process using the FEA. It concludes with two case histories that involve the use of FEA in failure analysis.

This article provides an overview of the implementation of wire embedding with ultrasonic energy and thermal embedding for polymer additive manufacturing, discussing the applications and advantages of the technique. The mechanical and electrical performance of the embedded wires is compared with that of other conductive ink processes in terms of electrical conductivity and mechanical strength.

Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis are also presented. The article introduces several frequently used methods for solder joint failure detection, prevention, and isolation (identification for the failed location).

This article focuses on the isothermal fatigue of solder materials. It discusses the effect of strain range, frequency, hold time, temperature, and environment on isothermal fatigue life. The article provides information on various isothermal fatigue testing methods used to assess solder joint reliability. These include the accelerated thermal cycling test and isothermal mechanical deflection system test.

Aerosol jet printing (AJP) can digitally fabricate intricate patterns on conformal surfaces with applications that include flexible electronics and antennas on complex geometries. Given the potential performance and economic benefits, aerosol jetting was studied and compared with the well-known and competing inkjet printing (IJP). More than 35 of the most relevant, highly cited articles were reviewed, focusing on applications requiring fine features on complex surfaces. The following performance indicators were considered for the comparison of AJP and IJP, because these aspects were the most commonly mentioned within the included articles and were identified as being the most relevant for a comprehensive performance assessment: printing process, line width, overspray, complex surface compatibility, diversity of printable materials, and deposition rate. This article is an account of the results of this comparison study in terms of printing capabilities, ink requirements, and economic aspects.

This article provides a summary of the concepts discussed in the articles under the Section “Fundamentals of Corrosion” in ASM Handbook, Volume 13A: Corrosion: Fundamentals, Testing, and Protection. In this section, the thermodynamic aspects of corrosion are descried first followed by a group of articles discussing the fundamentals of aqueous corrosion kinetics. The fundamentals of gaseous corrosion are addressed next. The fundamental electrochemical reactions of corrosion and their uses are finally described.

Laser-ultrasonics is a particular implementation of ultrasonic nondestructive inspection in which ultrasound is generated and detected by lasers. This article discusses the various mechanisms that ensure ultrasound generation and explains the possibility to get the equivalent of phase-array by numerical processing of an array of previously acquired laser-ultrasonic signals. The article describes the ultrasound generation by thermoelastic mechanism and ablation or vaporization. It illustrates the principle of optical detection of ultrasound with confocal Fabry-Perot interferometer and photorefractive two-wave mixing interferometer. The article concludes with information on the industrial applications of laser-ultrasonics, including thickness measurement, flaw detection, and material characterization.

Machine vision, also referred to as computer vision or intelligent vision, is a means of simulating the image recognition and analysis capabilities of the human eye and brain system with digital techniques. The machine vision functionality is extremely useful in inspection, supervision, and quality control applications. This article presents a variety of machine vision functions for different purposes and provides a comparison of machine and human vision capabilities in a table. It discusses the processes of a machine vision system: image acquisition, image preprocessing, image analysis, and image interpretation. The article provides information on the uses of machine vision systems in three categories of manufacturing applications: visual inspection, identification of parts, and guidance and control applications.

Sputtering is a nonthermal vaporization process in which the surface atoms are physically ejected from a surface by momentum transfer from an energetic bombarding species of atomic/molecular size. It uses a glow discharge or an ion beam to generate a flux of ions incident on the target surface. This article provides an overview of the advantages and limitations of sputter deposition. It focuses on the most common sputtering techniques, namely, diode sputtering, radio-frequency sputtering, triode sputtering, magnetron sputtering, and unbalanced magnetron sputtering. The article discusses the fundamentals of plasma formation and the interactions on the target surface. A comparison of reactive and nonreactive sputtering is also provided. The article concludes with a discussion on the several methods of process control and the applications of sputtered films.

Metallic nonelectrolytic alloy coatings produced from aqueous solutions are commercially used in several industries, including electronics, aerospace, medical, oil and gas production, chemical processing, and automotive. Nonelectrolytic coating systems use two types of reactions to deposit metal onto a part: electroless and displacement. This article explains the various types of electroless and dispersion alloy coating systems. It provides information on the processing of parts, process control, deposit analysis, and equipment used for coating nonelectrolytic displacement alloys. The article concludes with a discussion on the safety and environmental concerns associated with nonelectrolytic deposition processes.

This article provides a discussion on the design, in-process, storage, and in-field problems and their considerations associated with armament corrosion with examples. Design considerations include geometry, material selection, assembly, pretreatment, coatings, and working and storage environments. In-process corrosion concerns include processing locations, in-process storage of parts, time between processing steps, and quality control of each processing step. The article also discusses the analysis of the in-field corrosion of the finished product, including physical environments, repair of corrosion-protective coatings, general corrosion-protection maintenance, and appropriate fixes and procedures that can be implemented by soldiers in-field to stop continued corrosion of armament equipment.