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microelectronic device fabrication

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Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001285
EISBN: 978-1-62708-170-2
... Abstract This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004170
EISBN: 978-1-62708-184-9
... materials tests and environmental tests are performed on microelectronic packages to detect flaws or defects that may lead to device failures during fabrication or field operation. Various electrochemical techniques based on direct current (dc) and alternating current (ac) are discussed in Corrosion...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006670
EISBN: 978-1-62708-213-6
... Impurity C solid /C liquid B 0.8 Al 0.002 P 0.35 As 0.3 C 0.07 Fe 8 × 10 −6 O 1.25 Fig. 4 A few methods for cross-sectioning microelectronics device architecture for analysis of buried layers Fig. 5 Molecular structures of some conjugated polymers...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006547
EISBN: 978-1-62708-290-7
... for Flexible Electronic Devices , IEEE Trans. Compon., Packag., Manuf. Technol. , Vol 8 , 2018 , p 1838 – 1844 , 10.1109/TCPMT.2018.2869977 31. Rahman T. , Renaud L. , Heo D. , Renn M. , and Panat R. , Aerosol Based Direct-Write Micro-additive Fabrication Method for Sub-mm...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006558
EISBN: 978-1-62708-290-7
...-and-Conductive Ink 3D Printing Technique for Fabrication of Microwave Devices , 2013 IEEE MTT-S International Microwave Symposium Digest (MTT) , IEEE , 2013 , p 1 – 3 10.1109/MWSYM.2013.6697669 49. Adams J.J. , Duoss E.B. , Malkowski T.F. , Motala M.J. , Ahn B.Y. , Nuzzo...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006554
EISBN: 978-1-62708-290-7
... and stopping is also discussed. The applications include printing solders in microelectronic packaging, printing to pads, printing conductive patterns for antennas, printing active circuits, printing on flexible surfaces, and structural printing. References References 1. Sluch M.I. , Taylor...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002475
EISBN: 978-1-62708-194-8
... & Sons , 1994 , Fig. 19.20 10. Kasap S.O. , Principles of Electrical Engineering Materials and Devices , McGraw-Hill , 1997 11. Tummala R. , Rymaszewski E.J. , and Klopfenstein A.G. , Ed., Microelectronics Packaging Handbook , Part 2, Semiconductor Packaging , 2nd...
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005551
EISBN: 978-1-62708-174-0
... of a device in which the components and the device are created simultaneously, but still involving joining, is solid-state microelectronic devices, such as transistors on silicon chips ( Fig. 2 ). Fig. 1 Microelectromechanical systems, such as the one shown here, also must be assembled, typically...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001297
EISBN: 978-1-62708-170-2
..., the stress-strain relation of the material can be readily calculated from the load-deflection data determined during bending. In this technique, very small cantilever-beam specimens are used, which are produced by microelectronic fabrication methods. In such test, a Nanoindenter device can be employed...
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005607
EISBN: 978-1-62708-174-0
... requirements, advantages, limitations, and applications, namely, wire welds, spot welds, continuous seam welds, and microelectronic welds of ultrasonic metal welding. References References 1. Specification IPC/WHMA-A-620, Wire Harness Manufacturers Association 2. U.S. National Institute...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001384
EISBN: 978-1-62708-173-3
..., ring welds, and microelectronic welds. The article provides information on the functions of USW personnel and describes the special conditions in USW which include the condition of the surface, the use of an interlayer, and the control of resonance. It concludes with a description on the weld quality...
Series: ASM Handbook
Volume: 5A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v05a.a0005736
EISBN: 978-1-62708-171-9
... Waveguide Devices for Microwave Applications Sensing Devices Photovoltaic (Solar Cell) Applications Solid Oxide Fuel Cells Heating Elements Electrodes for Capacitors and Other Electrochemical Devices Substrates (Insulators) and Conductors for Hybrid Microelectronics Indirect...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... Packaging Components , Electronic Packaging and Production , Aug 1987 , p 27 – 29 6. Thaw C. , Zemany J. , and Zweben C. , “Metal Matrix Composite Hybrid Microelectronic Package Components,” presented at National Electronic Packaging Conf., - NEPCON East '87 ( Boston ), Reed...
Series: ASM Handbook
Volume: 23
Publisher: ASM International
Published: 01 June 2012
DOI: 10.31399/asm.hb.v23.a0005680
EISBN: 978-1-62708-198-6
...Abstract Abstract Microjoining methods are commonly used to fabricate medical components and devices. This article describes key challenges involved during microjoining of medical device components. The primary mechanisms used in microjoining for medical device applications include...
Series: ASM Handbook
Volume: 19
Publisher: ASM International
Published: 01 January 1996
DOI: 10.31399/asm.hb.v19.a0002413
EISBN: 978-1-62708-193-1
.... Zubelewicz A. et al. , Mechanical Deflection System—An Innovative Test Method for SMT Assemblies , INTERPAC-95 (Lahaina, HI), 26 – 30 March 1995 , Vol 2 , ASME , p 1167 – 1178 2. Shine M.C. and Fox L.R. , Fatigue of Solder Joints in Surface Mount Devices , Low Cycle...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
... 11. Shukla A.A. , Dishongh T.J. , Pecht M. , Jennings D. , Hollow Fibers in Woven Laminates , Printed Circuit Fabrication , Vol 20 ( No. 1 ), Jan 1997 , p 30 – 32 12. Ambrose J. , Barradas R.G. , and Smith D.W. , Electroanal. Chem...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004171
EISBN: 978-1-62708-184-9
... illustrates that the factors outside the normal processing of wafers or tool-specific problems can contribute to metal-line corrosion. corrosion semiconductor wafer fabrication batch metal-etch systems single-wafer metal-etch systems metal-line corrosion THE MICROELECTRONICS INDUSTRY is one...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003062
EISBN: 978-1-62708-200-6
... and various active devices. Glass insulators, ceramic heater substrates for microelectronics packaging, are all primarily used in this mode. Often, however, the ceramic material must exhibit other important characteristics, including temperature, corrosion and environmental stability, high mechanical strength...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001301
EISBN: 978-1-62708-170-2
... sections of this article. A lateral resolution in SAM of about 0.1 μm can be routinely obtained. Modern instruments with field emission cathodes provide primary beam diameters of 15 nm at 1 nA beam current, suitable for the analysis of microelectronics devices. Limitations in quantification...
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006466
EISBN: 978-1-62708-190-0
... 1 , Electronic Materials Handbook , ASM International , 1989 23. Semmens J.E. and Kessler L.W. , Nondestructive Evaluation of TAB Bonds by Acoustic Microscopy , Proceedings of the ISHM Conference ( Seattle, WA ), International Society for Hybrid Microelectronics, 1988 , p...