1-20 of 49 Search Results for

microelectronic circuit failure analysis

Sort by
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004173
EISBN: 978-1-62708-184-9
... International , Nov 1994 , p 181 – 187 5. Axtell S. , Failure Analysis of Thick-Film Resistors in Sulfur-Containing Environments , Microelectronic Failure Analysis Desk Reference, 2002 Supplement , Kane T. , Ed., Electronic Device Failure Analysis Society, affiliate of ASM...
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
... and modules ( Ref 42 ). Fig. 23 Electrochemical migration defect Failure Analysis Techniques for Solder Joint Failures Failure analysis techniques are the key approach in identifying solder cracks in the circuit. For modern electronic design with high integration density, thousands of solder...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003526
EISBN: 978-1-62708-180-1
... applications in piping and pressure vessel analysis, impact analysis, and microelectronics. The article describes the steps involved in the design process using the FEA. It concludes with two case histories that involve the use of FEA in failure analysis. failure analysis finite element analysis impact...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006773
EISBN: 978-1-62708-295-2
... and both general- and special-purpose applications of FEA. The special-purpose applications of FEA covered are piping and pressure vessel analysis, impact analysis, and microelectronic and microelectromechanical systems analysis. The article provides case histories that involved the use of FEA in failure...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004144
EISBN: 978-1-62708-184-9
... composite materials and increased amounts of titanium. These more corrosion-resistant materials are expected to significantly reduce maintenance costs. Corrosion in the Microelectronics Industry Corrosion in electronic components manifests itself in several ways. Computers, integrated circuits...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
... such as chlorides. The resulting corrosion product, which is usually nonconductive, can cause electrical failure due to open or intermittently open contact. An example of gold-plated connector corrosion from a device exposed to field conditions is shown in Fig. 2 . The energy-dispersive x-ray analysis (EDX...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003252
EISBN: 978-1-62708-199-3
... the dark sigma phase identified by the Kikuchi patterns. (b) Backscattered electron Kikuchi pattern. (c) Computer solution of Kikuchi pattern. Courtesy of Joe Michael, Sandia National Laboratories Voltage Contrast and Analysis of Microelectronic Devices Additional types of specialized imaging can...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.9781627082952
EISBN: 978-1-62708-295-2
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006466
EISBN: 978-1-62708-190-0
... in materials. These instruments often are used for process and quality control, although a significant percentage of the devices are placed in analytical and failure analysis laboratories. The most popular application of SAM uses its very high-magnification mode and is employed as a counterpart to conventional...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... combinations of properties that cannot be achieved any other way. Perhaps the best example is printed circuit boards (PCBs) for which dielectric properties are critical. The most common PCB material, E-glass fiber-reinforced epoxy, was first developed over a half century ago. In addition to microelectronic...
Series: ASM Handbook
Volume: 19
Publisher: ASM International
Published: 01 January 1996
DOI: 10.31399/asm.hb.v19.a0002411
EISBN: 978-1-62708-193-1
...: Heat-Treatable and Heat-Treated Alloys Fatigue data shown here for beryllium copper alloys are represented by a band, the lower bound determined by the lowest stress to cause failure and the upper bound determined by regression analysis of failure data from four or more commercial lots...
Series: ASM Handbook
Volume: 19
Publisher: ASM International
Published: 01 January 1996
DOI: 10.31399/asm.hb.v19.a0002413
EISBN: 978-1-62708-193-1
... reliability solders AN UNDERSTANDING of the mechanical and fatigue properties of solders used in electronic packaging is a requirement for better design of solder joints and the development of accelerated tests and improved solders. Fatigue failures of a solder joint in an electronic device result from...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001265
EISBN: 978-1-62708-170-2
... byproducts such as cuprous oxide, which can lead to bath decomposition unless suitable stabilizers are present. Once the bath begins to be used, copper, caustic, and formaldehyde are consumed and must be replenished. This is typically carried out by routine analysis, either manually or electronically...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004172
EISBN: 978-1-62708-184-9
... Abstract In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article...
Series: ASM Handbook Archive
Volume: 10
Publisher: ASM International
Published: 01 January 1986
DOI: 10.31399/asm.hb.v10.a0001770
EISBN: 978-1-62708-178-8
... to be less than 1 μm thick) often require determination of physical and mechanical properties coupled with chemical characterization for product development, quality assurance, or failure analysis. Auger electron spectroscopy can be applied to obtain compositional information at selected areas of the surface...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004131
EISBN: 978-1-62708-184-9
... of failure analysis and life-predictive tools for such problems as fatigue damage, corrosion, and stress-corrosion cracking Taking into account that a uniform in-service life for all equipment components in an aged system is not achievable, it is therefore very important to record in-service...
Series: ASM Handbook
Volume: 11B
Publisher: ASM International
Published: 15 May 2022
DOI: 10.31399/asm.hb.v11B.a0006943
EISBN: 978-1-62708-395-9
... research and routine testing. The scanning electron microscope is one of the most powerful tools in characterization and examination of materials, particularly in failure analysis. The high resolution and depth of field of SEM is necessary to reveal the surface features on the microscopic scale...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001297
EISBN: 978-1-62708-170-2
.... This is particularly true of microelectronic circuits in which metallizations, such as aluminum, are deposited on silicon or silicon oxide. In these cases, the metal films are separated from the substrate by exposure to a stream of fluorine in an inert carrier gas. The silicon is removed in the form of gaseous silicon...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006670
EISBN: 978-1-62708-213-6
... be difficult to control and perform repeatably. Mechanical cross sectioning similar to that used for metallographic analysis (see Fig. 4 , Polishing) is frequently employed for imaging the macroscopic details of a semiconductor device such as the solder bonds to the printed circuit board or the overall...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006677
EISBN: 978-1-62708-213-6
... in the 1970s ( Ref 6 , 7 ) and established itself as a workhorse for specific applications, such as TEM lamella preparation ( Ref 8 – 10 ), semiconductor circuit edit ( Ref 11 ) and failure analysis ( Ref 2 ), mask repair for lithography applications, and various other material-removal tasks. At present...