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microelectromechanical systems
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Image
Published: 31 October 2011
Fig. 13 Sealing patch on microelectromechanical systems-type peristaltic pump etch holes produced by focused ion beam deposition on silicon from a platinum-containing organometallic gas. Source: Ref 46
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Image
Published: 31 October 2011
Fig. 1 Microelectromechanical systems, such as the one shown here, also must be assembled, typically by mechanical interlocking. Such devices are typically made using techniques first developed for use in microelectronics; i.e., photoetching and deposition.
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Image
Published: 31 December 2017
Fig. 7 Fully fledged electrostatically actuated microelectromechanical system adhesion sensor/actuator. Courtesy of W.M. van Spengen
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Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006379
EISBN: 978-1-62708-192-4
... roughness, with AFM, can provide a precise picture of surface roughness and can be used as input for contact mechanics computer models. The article also describes microscale adhesion and adhesion measurement methods using microelectromechanical systems technologies. It reviews certain considerations used...
Abstract
This article first describes surface forces, and the methods of measuring them, followed by a discussion on adhesion. It discusses the instrumental requirements and techniques, including Atomic Force Microscopy (AFM), used for the measurement of surface forces. Measurements of surface roughness, with AFM, can provide a precise picture of surface roughness and can be used as input for contact mechanics computer models. The article also describes microscale adhesion and adhesion measurement methods using microelectromechanical systems technologies. It reviews certain considerations used for the measurement of adhesion, such as fundamental adhesion measurements, history dependence and sample preparation, and practical adhesion measurements. The article describes various arrangements that can be employed in adhesion tests.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006773
EISBN: 978-1-62708-295-2
... and both general- and special-purpose applications of FEA. The special-purpose applications of FEA covered are piping and pressure vessel analysis, impact analysis, and microelectronic and microelectromechanical systems analysis. The article provides case histories that involved the use of FEA in failure...
Abstract
When complex designs, transient loadings, and nonlinear material behavior must be evaluated, computer-based techniques are used. This is where the finite-element analysis (FEA) is most applicable and provides considerable assistance in design analysis as well as failure analysis. This article provides a general view on the applicability of finite-element modeling in conducting analyses of failed components. It highlights the uses of finite-element modeling in the area of failure analysis and design, with emphasis on structural analysis. The discussion covers the general development and both general- and special-purpose applications of FEA. The special-purpose applications of FEA covered are piping and pressure vessel analysis, impact analysis, and microelectronic and microelectromechanical systems analysis. The article provides case histories that involved the use of FEA in failure analysis.
Image
in Introduction to Tribology and Tribological Parameters
> Friction, Lubrication, and Wear Technology
Published: 31 December 2017
Fig. 3 Dimensions of tribological systems and triboprocesses. MEMS, microelectromechanical systems
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Image
Published: 15 December 2019
Fig. 24 Atomic force microscopy image of a gear fabricated with microelectromechanical systems technology. The image is 50 × 50 μm and was measured in vibrating mode.
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in Online Monitoring and Control of Polymer Additive Manufacturing Processes
> Additive Manufacturing Design and Applications
Published: 30 June 2023
Fig. 2 Thermocouple installed on a fused filament fabrication machine to monitor the extruder temperature. MEMS, microelectromechanical system. Reprinted from Ref 24 with permission of the American Society of Mechanical Engineers (ASME)
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Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006387
EISBN: 978-1-62708-192-4
... methods of resolving these problems. The premise is that the wear must be characterized qualitatively and quantitatively. Contact and wear occur at the nanoscale, even at the atomic level, for example, in the applications of microelectromechanical systems (MEMS) and controllable atomic removal...
Abstract
This article describes the determination of wear loss by measuring either mass change or dimensional change of lubricants and materials. It discusses the principles, advantages and disadvantages of mass loss measures and dimensional measures of wear. The article details wear measurement at the nanoscale, such as atomic force microscopy (AFM) measurement and scanning electron microscopy measurement. It reviews the techniques of wear measurement at the atomic level, namely, transmission electron microscopy (TEM) measurement and AFM combined with TEM measurement.
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003526
EISBN: 978-1-62708-180-1
...-purpose finite element applications are available in the areas of piping and pressure vessel analysis, impact analysis, and, most recently, microelectronic and microelectromechanical systems (MEMS) analysis. Pipe Stress and Pressure Vessel Analysis Piping and pressure vessel design is an area where...
Abstract
This article provides information on the development of finite element analysis (FEA) and describes the general-purpose applications of FEA software programs in structural and thermal, static and transient, and linear and nonlinear analyses. It discusses special-purpose finite element applications in piping and pressure vessel analysis, impact analysis, and microelectronics. The article describes the steps involved in the design process using the FEA. It concludes with two case histories that involve the use of FEA in failure analysis.
Series: ASM Handbook
Volume: 23A
Publisher: ASM International
Published: 12 September 2022
DOI: 10.31399/asm.hb.v23A.a0006901
EISBN: 978-1-62708-392-8
... on the membrane. The projectors in DLP printers are comparable to a theater projector. The essential part of these projectors is the digital micromirror device (DMD), an optical microelectromechanical system made of an array of highly re ective aluminum micromirrors. Each mirror corresponds with a pixel...
Abstract
This article provides an overview of the adoption of additively manufactured materials in dentistry. It discusses the practical workflows of a three-dimensional printing technology, vat photopolymerization. Three subgroups of the vat photopolymerization process are laser beam or classic stereolithography apparatus (SLA), direct light processing, and liquid-crystal-display-masked SLA. The article covers two subgroups of 3D printing resins-based appliances, namely intraoral and extraoral appliances. Information on various types of dental appliances and the fabrication of in-office appliances is provided. The article also reviews fourth-dimension printing and discusses the applications of the personalized care model in medicine and dentistry.
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006403
EISBN: 978-1-62708-192-4
... be considered, as illustrated in a simplified manner in Fig. 3 , with tribological processes occurring on various scales. Fig. 3 Dimensions of tribological systems and triboprocesses. MEMS, microelectromechanical systems In the diagnosis of friction and wear test data, it also must be noted...
Abstract
Tribology is the science and technology of interacting surfaces in relative motion. This article describes in detail the basic structural, operational, and interaction parameters of a tribosystem. The interaction parameters, which characterize the action of the operational parameters on the structural components in the system, consist of three important aspects: contact parameters, friction parameters, and wear parameters. These three aspects embody the complex mechanisms and relationships between the constituents of a tribosystem. The article concludes with information on the selection criteria of a material for wear applications.
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005551
EISBN: 978-1-62708-174-0
... the materials comprising components are created at the same time the assembly or structure—typically known as a device—is created. In both cases, joining remains a key process to enable the creation of the device. Examples of very small assemblies employing joining are microelectromechanical systems ( Fig. 1...
Abstract
Joining is key to the manufacture of large or complex devices or assemblies; construction of large and complex structures; and repair of parts, assemblies, or structures in service. This article describes the three forces for joining: physical, chemical, and mechanical. It provides an overview of the joining processes, namely, mechanical fastening, integral attachment, adhesive bonding, welding, brazing, and soldering. The article concludes with information on the various aspects of joint design and location that determine the selection of a suitable joining method.
Series: ASM Handbook
Volume: 22B
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.hb.v22b.a0005544
EISBN: 978-1-62708-197-9
... include alternating/direct current, microelectromechanical systems, radio frequency, Optimization Lab, acoustics, heat transfer, structural mechanics, computer-aided design import, chemical engineering, COMSOL Reaction Engineering Lab, and Materials Library. COMSOL AB www.comsol.com DANTE DANTE...
Abstract
This article demonstrates the depth and breadth of commercial and third-party software packages available to simulate metals processes. It provides a representation of the spectrum of applications from simulation of atomic-level effects to manufacturing optimization. The article tabulates the software name, function or process applications, vendor or developer, and website information.
Book: Composites
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... packaging, composites are well suited for other packaging applications, such as optoelectronic components and microelectromechanical systems (MEMS). Both are important growth areas. Application Requirements Electronic packaging provides a number of primary functions: it provides power, transfers...
Abstract
This article presents an overview of advanced composites, namely, polymer matrix composites, metal-matrix composites, ceramic-matrix composites, and carbon-matrix composites. It also provides information on the properties and applications of the composites in thermal management and electronic packaging.
Series: ASM Handbook
Volume: 8
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.hb.v08.a0003281
EISBN: 978-1-62708-176-4
..., such as those described in Table 1 . Fine- scale friction test results can relate to such applications as thin films on computer hard disks, read-write heads, and microelectromechanical systems (MEMS). They can provide information on the behavior of monolayers of lubricating films, but they tend not to be able...
Abstract
This article describes the techniques for measuring friction, namely, inclined-plane method; friction test methods using weights and pulleys; friction tests of shafts and capstans; other types of friction tests, including standards; microscale friction tests; and friction testing under well-lubricated conditions. The procedural considerations that should be addressed to ensure that valid data are derived from a friction test are discussed. The article explains friction testing geometries, the major considerations implicit in their use as well as friction test parameters, such as speed and load. It also demonstrates how to report friction data and how these data can be entered into a database.
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005639
EISBN: 978-1-62708-174-0
... mirrors to provide beam scanning across an area, but because these are relatively high-momentum devices, they will no doubt give way to microelectromechanical systems (MEMS) or entirely solid-state methods in the future. Some examples of rapid-scan scenarios are given in a later section...
Abstract
Microjoining with high energy density beams is a new subject in the sense that the progress of miniaturization in industry has made the desire to make microjoints rapidly and reliably a current and exciting topic. This article summarizes the current state of microjoining with both electron and laser beams. It considers the elementary physical processes such as heat and fluid flow to introduce the reader to the phenomena that affect melting, coalescence, and solidification needed for a successful microweld. The various forces driving (and resisting) fluid flow are analyzed. The article discusses the equipment suitable for microjoining and the metallurgical consequences and postweld metrology of the process. It also provides examples of developmental welds employing laser and electron beam microwelding techniques.
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006658
EISBN: 978-1-62708-213-6
.... These include crystals, microelectromechanical systems (MEMS) self-actuating cantilevers, and the light lever. Because 99% of force sensors used in AFMs are light levers, this article discusses light lever AFMs. History The origin of the AFM can be found in surface profilers first developed by precision...
Abstract
This article focuses on laboratory atomic force microscopes (AFMs) used in ambient air and liquid environments. It begins with a discussion on the origin of AFM and development trends occurring in AFM. This is followed by a section on the general principles of AFM and a comprehensive list of AFM scanning modes. There is a brief description of how each mode works and what types of applications can be made with each mode. Some of the processes involved in preparation of samples (bulk materials and those placed on a substrate) scanned in an AFM are then presented. The article provides information on the factors applicable to the accuracy and precision of AFM measurements. It ends by discussing the applications for AFMs in the fields of science, technology, and engineering.
Series: ASM Handbook
Volume: 22B
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.hb.v22b.a0005522
EISBN: 978-1-62708-197-9
... materials, more energy is transferred to the ball and less to the player's hands, giving a “soft” feel.) Also, metallic glasses are used in high-tech applications such as microelectromechanical systems technology ( Ref 26 ). It is worth noting that samples from California Institute of Technology processed...
Abstract
For a wide range of new or better products, solidification processing of metallic materials from the melt is a step of uppermost importance in the industrial production chain. This article discusses the casting and solidification of molten metallic alloy along with the application of low-gravity platforms and facilities for solidification processing. It provides a description of dendritic growth studies and electromagnetic levitation. The article concludes with information on the in situ and real-time monitoring of solidification processing.
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006451
EISBN: 978-1-62708-190-0
... radiation is required to increase its temperature and the more sensitive the microbolometer. These small-scale structures are often referred to as microelectromechanical systems (MEMS). Microbolometer performance can depend on many factors. The sensitivity of the microbolometer will depend on the change...
Abstract
Thermoelastic stress analysis (TSA) an increasingly popular infrared (IR)-based technique for measuring stress on the surface of a part subjected to time-varying loads. This article begins by providing a theoretical and historical background of thermoelastic stress analysis. It then describes infrared detectors, such as quantum detectors and thermal/nonquantum detectors, for thermoelastic stress analysis. The article discusses the theoretical aspects for producing thermoelastic stress analysis data and the applications amenable to thermoelastic stress analysis. It concludes with information on the qualitative applications of thermoelastic stress analysis.
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