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microelectromechanical systems

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Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006379
EISBN: 978-1-62708-192-4
... fledged electrostatically actuated microelectromechanical system adhesion sensor/actuator. Courtesy of W.M. van Spengen Abstract Abstract This article first describes surface forces, and the methods of measuring them, followed by a discussion on adhesion. It discusses the instrumental...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006773
EISBN: 978-1-62708-295-2
... development and both general- and special-purpose applications of FEA. The special-purpose applications of FEA covered are piping and pressure vessel analysis, impact analysis, and microelectronic and microelectromechanical systems analysis. The article provides case histories that involved the use of FEA...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006387
EISBN: 978-1-62708-192-4
... mechanism and to develop new methods of resolving these problems. The premise is that the wear must be characterized qualitatively and quantitatively. Contact and wear occur at the nanoscale, even at the atomic level, for example, in the applications of microelectromechanical systems (MEMS...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003526
EISBN: 978-1-62708-180-1
..., resulting in refinements and the development of special-purpose applications. Special-purpose finite element applications are available in the areas of piping and pressure vessel analysis, impact analysis, and, most recently, microelectronic and microelectromechanical systems (MEMS) analysis. Dynamic...
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005551
EISBN: 978-1-62708-174-0
... components are created at the same time the assembly or structure—typically known as a device—is created. In both cases, joining remains a key process to enable the creation of the device. Examples of very small assemblies employing joining are microelectromechanical systems ( Fig. 1 ). An example...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006658
EISBN: 978-1-62708-213-6
... Fig. 24 Atomic force microscopy image of a gear fabricated with microelectromechanical systems technology. The image is 50 × 50 μm and was measured in vibrating mode. Fig. 2 Images of polystyrene (PS)/polymethyl methacrylate (PMMA) block copolymer, a sample used to gage the performance...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006403
EISBN: 978-1-62708-192-4
... of events leading to wear Fig. 1 Groups of basic tribological parameters Fig. 3 Dimensions of tribological systems and triboprocesses. MEMS, microelectromechanical systems Fig. 8 Effect of oxygen on the friction of pure iron Fig. 9 Overview of the basic mechanisms...
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005639
EISBN: 978-1-62708-174-0
...-diameter focusing capability, such that nanometer-sized structures can be created. An example of such a deposit used to seal over etch holes left in a MEMS device is given in Fig. 13 ( Ref 46 ). Fig. 13 Sealing patch on microelectromechanical systems-type peristaltic pump etch holes produced...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... for other packaging applications, such as optoelectronic components and microelectromechanical systems (MEMS). Both are important growth areas. In this section, the three key classes of composite materials used in thermal management and electronic packaging at this time, PMCs, MMCs, and CCCs...
Series: ASM Handbook
Volume: 22B
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.hb.v22b.a0005544
EISBN: 978-1-62708-197-9
... include alternating/direct current, microelectromechanical systems, radio frequency, Optimization Lab, acoustics, heat transfer, structural mechanics, computer-aided design import, chemical engineering, COMSOL Reaction Engineering Lab, and Materials Library. COMSOL AB www.comsol.com DANTE DANTE...
Series: ASM Handbook
Volume: 22B
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.hb.v22b.a0005522
EISBN: 978-1-62708-197-9
... energy is transferred to the ball and less to the player's hands, giving a “soft” feel.) Also, metallic glasses are used in high-tech applications such as microelectromechanical systems technology ( Ref 26 ). It is worth noting that samples from California Institute of Technology processed on the space...
Series: ASM Handbook
Volume: 8
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.hb.v08.a0003281
EISBN: 978-1-62708-176-4
... heads, and microelectromechanical systems (MEMS). They can provide information on the behavior of monolayers of lubricating films, but they tend not to be able to address issues such as particulate contamination and embedment effects, microstructural inhomogeneity, thick film behavior, and surfaces...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006373
EISBN: 978-1-62708-192-4
... constituting the copolymers are changed. The wear resistance of the coatings was tested under conditions of contact with a steel ball and local pressures comparable with those of conventional microelectromechanical systems (MEMS) operating conditions. Test data are shown for the surface structures...
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006451
EISBN: 978-1-62708-190-0
... the microbolometer. These small-scale structures are often referred to as microelectromechanical systems (MEMS). Microbolometer performance can depend on many factors. The sensitivity of the microbolometer will depend on the change in resistance or other electrical properties as a function of temperature, which...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006578
EISBN: 978-1-62708-290-7
..., and complex 3D shapes with submicrometer features can be directly printed using TPP ( Ref 35 ). Due to its unique capability, TPP has been applied to many applications, such as micro/nanophotonics, microelectromechanical systems, microfluidics, biomedical implants, and microscale devices ( Ref 34...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006366
EISBN: 978-1-62708-192-4
... Additives , Langmuir , Vol 30 ( No. 44 ), 2014 , p 13301 – 13311 10.1021/la5032366 59. Jiang D. , Hu L. , and Feng D. , Crown-Type Ionic Liquids as Lubricants for Steel-on-Steel System , Tribol. Lett. , Vol 41 ( No. 2 ), 2011 , p 417 – 424 10.1007/s11249-010-9726-x...
Series: ASM Handbook
Volume: 4A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v04a.a0005808
EISBN: 978-1-62708-165-8
... penetration Poor control to avoid melting Laser Minimal distortion Selective localized hardening Quenchant-free Case depth controllable Limited postmachining High capital cost Multiple passes give local tempering Comparison of high-power laser systems Table 9 Comparison of high-power laser...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003436
EISBN: 978-1-62708-195-5
... 0.0025 0.061 0.0024 Advantages and limitations of automated system water-coupling methods Table 4 Advantages and limitations of automated system water-coupling methods Method Advantages Limitations Immersion systems Excellent signal quality, no moving water, very clean...
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006478
EISBN: 978-1-62708-190-0
...-to-point test Poor; need for couplant Low if manual testing; high if automated X-radiography Inclusions, fiber alignment, fiber distribution, cracks, voids Good Good for inclusions, translaminar Good Poor; need for screening, etc. Modest for basic system; high for more flexible systems...
Series: ASM Handbook
Volume: 8
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.hb.v08.a0003309
EISBN: 978-1-62708-176-4
... both refer to the same underlying degradation phenomenon. However, not all aspects of environmentally assisted crack advance are identical in all cracking systems. Therefore, phenomenological categories are still useful divisions in the evaluation of environmentally assisted crack growth...