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microelectromechanical systems

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Published: 31 October 2011
Fig. 13 Sealing patch on microelectromechanical systems-type peristaltic pump etch holes produced by focused ion beam deposition on silicon from a platinum-containing organometallic gas. Source: Ref 46 More
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Published: 31 October 2011
Fig. 1 Microelectromechanical systems, such as the one shown here, also must be assembled, typically by mechanical interlocking. Such devices are typically made using techniques first developed for use in microelectronics; i.e., photoetching and deposition. More
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Published: 31 December 2017
Fig. 7 Fully fledged electrostatically actuated microelectromechanical system adhesion sensor/actuator. Courtesy of W.M. van Spengen More
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006379
EISBN: 978-1-62708-192-4
... roughness, with AFM, can provide a precise picture of surface roughness and can be used as input for contact mechanics computer models. The article also describes microscale adhesion and adhesion measurement methods using microelectromechanical systems technologies. It reviews certain considerations used...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006773
EISBN: 978-1-62708-295-2
... and both general- and special-purpose applications of FEA. The special-purpose applications of FEA covered are piping and pressure vessel analysis, impact analysis, and microelectronic and microelectromechanical systems analysis. The article provides case histories that involved the use of FEA in failure...
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Published: 31 December 2017
Fig. 3 Dimensions of tribological systems and triboprocesses. MEMS, microelectromechanical systems More
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Published: 15 December 2019
Fig. 24 Atomic force microscopy image of a gear fabricated with microelectromechanical systems technology. The image is 50 × 50 μm and was measured in vibrating mode. More
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Published: 30 June 2023
Fig. 2 Thermocouple installed on a fused filament fabrication machine to monitor the extruder temperature. MEMS, microelectromechanical system. Reprinted from Ref 24 with permission of the American Society of Mechanical Engineers (ASME) More
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006387
EISBN: 978-1-62708-192-4
... methods of resolving these problems. The premise is that the wear must be characterized qualitatively and quantitatively. Contact and wear occur at the nanoscale, even at the atomic level, for example, in the applications of microelectromechanical systems (MEMS) and controllable atomic removal...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003526
EISBN: 978-1-62708-180-1
...-purpose finite element applications are available in the areas of piping and pressure vessel analysis, impact analysis, and, most recently, microelectronic and microelectromechanical systems (MEMS) analysis. Pipe Stress and Pressure Vessel Analysis Piping and pressure vessel design is an area where...
Series: ASM Handbook
Volume: 23A
Publisher: ASM International
Published: 12 September 2022
DOI: 10.31399/asm.hb.v23A.a0006901
EISBN: 978-1-62708-392-8
... on the membrane. The projectors in DLP printers are comparable to a theater projector. The essential part of these projectors is the digital micromirror device (DMD), an optical microelectromechanical system made of an array of highly re ective aluminum micromirrors. Each mirror corresponds with a pixel...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006403
EISBN: 978-1-62708-192-4
... be considered, as illustrated in a simplified manner in Fig. 3 , with tribological processes occurring on various scales. Fig. 3 Dimensions of tribological systems and triboprocesses. MEMS, microelectromechanical systems In the diagnosis of friction and wear test data, it also must be noted...
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005551
EISBN: 978-1-62708-174-0
... the materials comprising components are created at the same time the assembly or structure—typically known as a device—is created. In both cases, joining remains a key process to enable the creation of the device. Examples of very small assemblies employing joining are microelectromechanical systems ( Fig. 1...
Series: ASM Handbook
Volume: 22B
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.hb.v22b.a0005544
EISBN: 978-1-62708-197-9
... include alternating/direct current, microelectromechanical systems, radio frequency, Optimization Lab, acoustics, heat transfer, structural mechanics, computer-aided design import, chemical engineering, COMSOL Reaction Engineering Lab, and Materials Library. COMSOL AB www.comsol.com DANTE DANTE...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... packaging, composites are well suited for other packaging applications, such as optoelectronic components and microelectromechanical systems (MEMS). Both are important growth areas. Application Requirements Electronic packaging provides a number of primary functions: it provides power, transfers...
Series: ASM Handbook
Volume: 8
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.hb.v08.a0003281
EISBN: 978-1-62708-176-4
..., such as those described in Table 1 . Fine- scale friction test results can relate to such applications as thin films on computer hard disks, read-write heads, and microelectromechanical systems (MEMS). They can provide information on the behavior of monolayers of lubricating films, but they tend not to be able...
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005639
EISBN: 978-1-62708-174-0
... mirrors to provide beam scanning across an area, but because these are relatively high-momentum devices, they will no doubt give way to microelectromechanical systems (MEMS) or entirely solid-state methods in the future. Some examples of rapid-scan scenarios are given in a later section...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006658
EISBN: 978-1-62708-213-6
.... These include crystals, microelectromechanical systems (MEMS) self-actuating cantilevers, and the light lever. Because 99% of force sensors used in AFMs are light levers, this article discusses light lever AFMs. History The origin of the AFM can be found in surface profilers first developed by precision...
Series: ASM Handbook
Volume: 22B
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.hb.v22b.a0005522
EISBN: 978-1-62708-197-9
... materials, more energy is transferred to the ball and less to the player's hands, giving a “soft” feel.) Also, metallic glasses are used in high-tech applications such as microelectromechanical systems technology ( Ref 26 ). It is worth noting that samples from California Institute of Technology processed...
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006451
EISBN: 978-1-62708-190-0
... radiation is required to increase its temperature and the more sensitive the microbolometer. These small-scale structures are often referred to as microelectromechanical systems (MEMS). Microbolometer performance can depend on many factors. The sensitivity of the microbolometer will depend on the change...