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microdispensing
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Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006554
EISBN: 978-1-62708-290-7
... Abstract This article is a detailed account of the advantages, disadvantages, and applications of microdispensing processes used in electronics manufacturing industries. The discussion covers various approaches to control material flow, namely time pressure, auger, positive displacement...
Abstract
This article is a detailed account of the advantages, disadvantages, and applications of microdispensing processes used in electronics manufacturing industries. The discussion covers various approaches to control material flow, namely time pressure, auger, positive displacement, and progressive cavity pump dispensing. The concept of valving to control starting and stopping is also discussed. The applications include printing solders in microelectronic packaging, printing to pads, printing conductive patterns for antennas, printing active circuits, printing on flexible surfaces, and structural printing.
Image
Published: 15 June 2020
Fig. 2 EFD and nScrypt nTip pen tips are used in microdispensing of diverse materials. nTip orifice openings range from 12.5 μm to hundreds of microns in diameter.
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Published: 15 June 2020
Fig. 10 Direct print to bare die using microdispensing. Bond pads are 100 μm. Photo by nScrypt
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Published: 15 June 2020
Fig. 12 Microdispensing breakout patterns for circuitry. Line widths are as small as 50 μm. Photo by nScrypt
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Published: 15 June 2020
Fig. 13 Antenna printed using microdispensing. The inner diameter of the pen tip was 100 μm, and line widths spread to 125 μm. Bends, angles, and starts and stops are critical to ensure a proper working antenna. Photo by nScrypt
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Published: 15 June 2020
Fig. 14 Laser direct structuring (LDS) versus microdispensed antenna comparison. Their performance is identical.
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Published: 15 June 2020
Fig. 1 75 μm dots of epoxy microdispensed. Consistent dot sizes with tight tolerances in volume are possible even at sub-100 μm size geometries. Photo by nScrypt
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Book Chapter
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006558
EISBN: 978-1-62708-290-7
... generally been relegated to flat, planar surfaces. Aerosol jetting and microdispensing have been the dominant processes used to selectively deposit inks onto a variety of surfaces. These inks can have functions including behaving as conductors, dielectrics, or even semiconductors ( Ref 2 , 3...
Abstract
This article provides an overview of the implementation of wire embedding with ultrasonic energy and thermal embedding for polymer additive manufacturing, discussing the applications and advantages of the technique. The mechanical and electrical performance of the embedded wires is compared with that of other conductive ink processes in terms of electrical conductivity and mechanical strength.
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006583
EISBN: 978-1-62708-290-7
... of high-density WC-Co particles in a slurry is a challenge. This technology, including proper control of the droplet microdispensing system, is still in the early stages of development. References References 1. Faidel D. , Jons D. , Natour G. , and Behr W. , Investigation...
Abstract
Tungsten, molybdenum, and cemented carbide parts can be produced using several additive manufacturing technologies. This article classifies the most relevant technologies into two groups based on the raw materials used: powder-bed methods, such as selective laser melting, electron beam melting, and binder jet three-dimensional (3-D) printing, and feedstock methods, such as fused-filament fabrication and thermoplastic 3-D printing. It discusses the characteristics, processing steps, properties, advantages, limitations, and applications of these technologies.
Series: ASM Handbook
Volume: 23A
Publisher: ASM International
Published: 12 September 2022
DOI: 10.31399/asm.hb.v23A.a0006893
EISBN: 978-1-62708-392-8
... and the diameter of the nozzle needle, the cell viability of extruded bioprinting ranges from 40 to 86%. Bovine aortic endothelial cells (BAECs) suspended in soluble collagen type I were extruded via microdispensing pen delivery onto the hydrophilic side of flat sheets of polyethylene terephthalate. After...
Abstract
This article focuses on the pneumatic extrusion-based system for biomaterials. It provides an overview of additive manufacturing (AM) processes, followed by sections covering steps and major approaches for the 3D bioprinting process. Then, the article discusses the types, processes, advantages, limitations, and applications of AM technology and extrusion-based approaches. Next, it provides information on the research on extrusion-based printing. Finally, the article provides a comparison of the extrusion-based approach with other approaches.
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006562
EISBN: 978-1-62708-290-7
... a thin nozzle as a nearly endless filament (similar to FDM and robocasting) or it can be dispensed as droplets by microdispensing technology, which enables producing fine structures with higher dimensional resolution. The heated suspension is printed layer by layer. The suspension solidifies upon...
Abstract
This article is a review of the material extrusion-based ceramic additive manufacturing (MECAM) processes. The discussion begins with details of extrusion with filament and paste, covering the most popular variants of paste extrusion-based MECAM techniques that can be differentiated based on paste type and the method of shape retention of the deposited layer: extrusion freeforming, robocasting ceramic on-demand extrusion, and freeze-form extrusion fabrication. The article then focuses on post-processing considerations and the mechanical properties of sintered ceramic parts. It concludes with information on innovation opportunities in ceramic additive manufacturing, such as incorporating UV-curing and gelation in the process and producing geometrically complex structures from shapeable green bodies.
Series: ASM Handbook
Volume: 23A
Publisher: ASM International
Published: 12 September 2022
DOI: 10.31399/asm.hb.v23A.9781627083928
EISBN: 978-1-62708-392-8