This article reviews the performance of power electronics components, namely, power rectifiers, insulated-gate bipolar transistors, metal-oxide semiconductor field-effect transistors, diodes, and silicon-controlled rectifiers. It provides information on induction heating power supplies with multiple heat stations, such as switching units and multiple (zone) outputs. The article describes power supply operational control and power supply protection circuits. It details duty cycle, power factor, and harmonics of power supplies. The article also describes system parameters, software analysis-calculations, human analysis-decisions, multiple system arrangements, and zone control systems for power supply selection. It provides information on the maintenance of induction power supplies, detailing the safety precautions to be taken and the need for routine inspection and servicing.

This article provides a brief description of load conditions for single-shot heat treating, vertical scanning, and brazing and soldering. It discusses the various power components used in power supplies. These include capacitors, integrated power module, transformers, and various switching devices, namely, silicon-controlled rectifiers, insulated-gate bipolar transistors, and metal-oxide semiconductor field-effect transistors. The article also provides information on frequency-multiplication harmonic-induction power supplies, namely, push-pull and half-bridge inverters and full-bridge inverters. Series resonant and parallel resonant circuits and their tuning calculations associated with output networks are also discussed. The article describes the frequency range of simultaneous dual-frequency induction heating power supply, and discusses the advantages, applications, and technical background of independently controlled frequency and power (IFP) induction heating power supply. It concludes with a description of the developments in control systems for modern induction power supplies.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

Power sources are apparatuses that are used to supply current and voltages that are suitable for particular welding processes. This article describes power sources for arc welding, resistance welding, and electron-beam welding. The more-common welding processes that use constant-current and constant-voltage power sources are listed in a table. The article describes the open-circuit voltage characteristics and power source control methods. The control methods employ either pulse width modulation (PWM) or frequency modulation (FM).

Germanium is a semiconducting metalloid element found in Group IV A. Germanium is used in the field of electronics, infrared optics, and in the fields of gamma ray spectroscopy, catalysis, and fiber optics. This article discusses the sources, manufacturing, and processing of germanium, and focuses on the chemical properties of various germanium compounds, including germanium halides, germanates, germanides, germanes, inorganic, and organogermanium compounds. It also tabulates the physical, thermal, electronic, and optical properties of germanium, and explains the economical aspects and specifications of germanium. The article describes the analytical and test methods of germanium, including gravimetric method, titrimetric method, and spectral method. It provides a short note on toxicology, and concludes with the uses of germanium in different fields.

Ceramic materials serve important insulative, capacitive, conductive, resistive, sensor, electrooptic, and magnetic functions in a wide variety of electrical and electronic circuitry. This article focuses on various applications of advanced ceramics in both electric power and electronics industry, namely, dielectric, piezoelectric, ferroelectric, sensing, magnetic and superconducting devices.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

Gallium-base components can be found in a variety of products ranging from compact disk players to advanced military electronic warfare systems, owing to the factor that it can emit light, has a greater resistance to radiation and operates at faster speeds and higher temperatures. This article discusses the uses of gallium in optoelectronic devices and integrated circuits and applications of gallium. The article discusses the properties and grades of gallium arsenide and also provides information on resources of gallium. The article talks about the recovery techniques, including recovery from bauxite, zinc ore and secondary recovery process and purification. The article briefly describes the fabrication process of gallium arsenide crystals. Furthermore, the article gives a short note on world supply and demand of gallium and concludes with research and development on gallium arsenide integrated circuits.

This article focuses on the use of indium and bismuth in low-melting-temperature solders and fusible alloys. It describes how the two elements typically occur in nature and how they are recovered and processed for commercial use. It also provides information on designations, classification, composition, properties (including temperatures ranges), and some of the other ways in which indium and bismuth alloys are used.

In the metal producing and processing industries, induction melting and holding has found wide acceptance. This article provides a detailed account of the physical principles of induction melting processes. It discusses the fundamental principles and components of induction furnaces such as induction crucible furnaces, channel induction furnaces, and induction furnaces with cold crucible. The article describes the advantages, applications, and fundamental principles of induction skull melting. It also provides information on the various specific application-designed induction melting installations.

This article outlines the beam/sample interactions and the basic instrumental design of a scanning electron microscopy (SEM), which include the electron gun, probeforming column (consisting of magnetic electron lenses, apertures, and scanning coils), electron detectors, and vacuum system. It discusses the contrasts mechanisms used for imaging and analyzing materials in the SEM. These include the topographic contrast, compositional contrast, and electron channeling pattern and orientation contrast. Special instrumentation and accessory equipment used at elevated pressures and during the X-ray microanalysis are reviewed. The article also provides information on the sample preparation procedure and the materials applications of the SEM.

This article provides an overview of the models of two induction heating devices, namely, induction crucible furnace (ICF) and induction furnace with slits, or segmented and water-cooled induction furnace with cold crucible (IFCC). These devices are used for melting with skull formation of low-conductivity materials such as glasses and oxides. The article presents the governing equations and boundary conditions for ICF and IFCC modeling. It includes a discussion on three electromagnetic field models in IFCC, namely, two-dimensional (2-D), quasi-three-dimensional, and three-dimensional (3-D) models. The article provides information on the simulation of skull formation in IFCC, and elucidates the transient axisymmetrical 2-D model and the transient 3-D model, including the primary results achieved for both glasses and skull formation.

Nontraditional finishing processes include electrochemical machining (ECM), electrodischarge machining (EDM), and laser beam machining. These processes belong to nonabrasive finishing methods where surface generation occurs with an insignificant amount of mechanical interaction between the processing tool and the workpiece surfaces. This article provides information on the equipment used, applications, process capabilities, and limitations of ECM and EDM.

Additive manufacturing (AM) has been adopted as one of the most versatile and rapid design-to-manufacturing approaches for printing a wide range of two- and three-dimensional parts, devices, and complex geometries layer by layer. This article provides insights into the current progress, challenges, and future needs of AM of electronics from the space, defense, biomedical, energy, and industry perspectives.

This article is a detailed account of the advantages, disadvantages, and applications of microdispensing processes used in electronics manufacturing industries. The discussion covers various approaches to control material flow, namely time pressure, auger, positive displacement, and progressive cavity pump dispensing. The concept of valving to control starting and stopping is also discussed. The applications include printing solders in microelectronic packaging, printing to pads, printing conductive patterns for antennas, printing active circuits, printing on flexible surfaces, and structural printing.

This article provides a detailed discussion on the components of a high-performance induction crucible furnace system, namely, furnace body, power supply, and peripheral components. The furnace body contains refractory lining, coil and transformer yokes, and tilting frame and furnace cover. The power supply consists of the following: transformers, frequency converters, capacitor banks, and power cables and furnace coils. The peripheral components comprise recooling device, charging system, and skimming devices. The article also presents a three-dimensional representation of the induction crucible furnace system.