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metal-organic chemical vapor deposition

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Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001284
EISBN: 978-1-62708-170-2
...Abstract Abstract This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001283
EISBN: 978-1-62708-170-2
...Abstract Abstract This article presents the principles of chemical vapor deposition (CVD) with illustrations. It discusses the types of CVD processes, namely, thermal CVD, plasma CVD, laser CVD, closed-reactor CVD, chemical vapor infiltration, and metal-organic CVD. The article reviews the CVD...
Series: ASM Handbook
Volume: 5A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v05a.a0005749
EISBN: 978-1-62708-171-9
... MMC metal-matrix composite MMI man-machining interface mo month MOCVD metal-organic chemical vapor deposition mPa millipascal MPa megapascal mpg miles per gallon mph miles per hour MPIF Metal Powder Industries Federation ms millisecond MSA...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0005586
EISBN: 978-1-62708-170-2
..., or kg × 10 3 ) MID molded interconnect device MIG metal inert gas (welding) min minute; minimum mL milliliter mm millimeter MMC metal-matrix composite MOCVD metal-organic chemical vapor deposition mp microporous (chromium electroplate...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001091
EISBN: 978-1-62708-162-7
... is another means of creating electronically active regions on the GaAs substrate. There are four principal methods for growing epitaxial layers: liquid-phase epitaxy (LPE), vapor-phase epitaxy (VPE), metal-organic chemical vapor deposition (MOCVD), and molecular beam epitaxy (MBE). Liquid-phase epitaxy...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006670
EISBN: 978-1-62708-213-6
... chloride gas or a metal organic liquid precursor vapor and group V hydride gases in the case of vapor phase epitaxy and metal organic chemical vapor deposition. A discussion of semiconductor processing would be incomplete without reference to how these materials are used to form electronic devices...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001275
EISBN: 978-1-62708-170-2
... the corrosion resistance of the substrate. Laser-irradiated chromium and molybdenum films on pure aluminum have been found to be very resistant to pitting by chloride ion ( Ref 64 ). Metal organic chemical vapor deposition (MOCVD) can also be used to deposit corrosion-resistant oxides onto low-melting metal...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004143
EISBN: 978-1-62708-184-9
... deposits, organolignins, other hard organic residues 3% sodium hydroxide+2% potassium permanganate solution (AP) for thin deposits, followed by acid 82–95 180–205 Soft metals. (Oxalic acid in the rinse between stages prevents chlorine gas generation from HCl+MnO 2 .) Heavy hydrocarbons: tars...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002494
EISBN: 978-1-62708-194-8
..., chemical vapor deposition; PVD, physical vapor deposition; RVD, reactive vapor deposition Fabrication Processes Some methods of fabrication such as the forging, extrusion, molding, and casting of metals and ceramics can lead to surface defects that must be removed by subsequent surface-finishing...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003022
EISBN: 978-1-62708-200-6
... with the requirements for metallizing in mind. Electroless Plating Electroless (autocatalytic) plating is the deposition of a metallic coating (usually nickel or copper) by a controlled chemical reduction that is catalyzed by the metal or alloy being deposited. For plastics, it is deposited on a previously...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003421
EISBN: 978-1-62708-195-5
... in polymer or metal processing. Processing at such high temperatures can lead to deleterious chemical reactions between the reinforcement and the matrix. Thermal expansion mismatch between the reinforcement and the matrix, the rather large temperature interval between the processing temperature and room...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003169
EISBN: 978-1-62708-199-3
..., titanium, nickel, chromium, magnesium, zinc, and others) are either an oxide or a sulfide deposit. Several of the oxides or sulfides are present together in a chemically combined form in the deposit. While the oxide or sulfide of a particular metal (usually the highest weight percent) is the primary...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.9781627081702
EISBN: 978-1-62708-170-2
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003372
EISBN: 978-1-62708-195-5
... discusses the use of a ceramic, preceramic, or metal phase as a fluid or vapor phase reactant to form the matrix. Emphasis is placed on microstructural features that influence ultimate composite properties. ceramic-matrix composites pressure-assisted densification chemical vapor infiltration melt...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001285
EISBN: 978-1-62708-170-2
... was observed. Fig. 5 Reactor for plasma-enhanced chemical vapor deposition of epitaxial silicon films. QMS, quadruple mass spectrometer. Source: Ref 48 Conductive Films The deposition of refractory metals and their silicides with the PECVD process has been a subject of investigation by many...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001287
EISBN: 978-1-62708-170-2
... good thermal contact between the hot surface and the material being vaporized. Wetted sources are also useful for depositing downward, sideways, or from nonplanar surfaces. Metallic stranded wire, coils, and baskets are relatively cheap and can be used in many applications. Wires for evaporation...
Series: ASM Handbook
Volume: 5B
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v05b.a0006012
EISBN: 978-1-62708-172-6
... oxides and metal salts. Nanoceramic particles can be fabricated by physical methods, including milling ( Ref 15 ), flame deposition ( Ref 16 ), and physical vapor deposition, or chemical methods, including oxidation of metal nanoparticles, chemical vapor deposition ( Ref 17 ), electrochemical methods...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.9781627081825
EISBN: 978-1-62708-182-5
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001318
EISBN: 978-1-62708-170-2
..., it is usually found that deposited ceramic coatings exhibit microcracking and that the crack pattern depends on the coating thickness and deposition temperature. Iridium metal deposited by electron-beam physical vapor deposition techniques can have low thermal mismatch stresses upon cooling. However...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003212
EISBN: 978-1-62708-199-3