This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.

This article presents the principles of chemical vapor deposition (CVD) with illustrations. It discusses the types of CVD processes, namely, thermal CVD, plasma CVD, laser CVD, closed-reactor CVD, chemical vapor infiltration, and metal-organic CVD. The article reviews the CVD reactions of materials related to hard, tribological, and high-temperature coatings and to free-standing structures. It concludes by reviewing the advantages, disadvantages, and applications of CVD.

Gallium-base components can be found in a variety of products ranging from compact disk players to advanced military electronic warfare systems, owing to the factor that it can emit light, has a greater resistance to radiation and operates at faster speeds and higher temperatures. This article discusses the uses of gallium in optoelectronic devices and integrated circuits and applications of gallium. The article discusses the properties and grades of gallium arsenide and also provides information on resources of gallium. The article talks about the recovery techniques, including recovery from bauxite, zinc ore and secondary recovery process and purification. The article briefly describes the fabrication process of gallium arsenide crystals. Furthermore, the article gives a short note on world supply and demand of gallium and concludes with research and development on gallium arsenide integrated circuits.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article briefly describes the basic attributes of chromate conversion coatings and the processes for applying them. It provides information on the influence of substrate microstructure on the performance of coating deposits and on the mechanism of substrate protection supplied by chromate coatings. The article also discusses the development of replacement technologies in response to environmental constraints that have developed around the use of chromium-base compounds.

This article describes the eight chemical cleaning methods, namely, circulation, fill and soak, cascade, foam, vapor-phase organic, steam-injected, on-line chemical, and mechanical cleaning. It presents information on deposit types, solvents used to remove them, and construction material incompatibilities in a table. The article summarizes the uses of chemical cleaning solutions, including hydrochloric acid, phosphoric acid, and sulfamic acid, as well as the additives used to neutralize their impact on corrosion. It discusses the chemical cleaning procedures, including selection of cleaning method and solvent, documentation of cleaning, and corrosion monitoring in chemical cleaning.

This article presents general design principles for different types of surface-finishing processes, such as cleaning, organic coatings, and inorganic coatings applied by a variety of techniques. It discusses the factors that influence the selection of surface-finishing processes. These include fabrication processes, size, weight, functional requirements, and design features. The article discusses the design as an integral part of manufacturing. It contains tables that summarize the design limitations for selected surface-preparation, organic finishing, and inorganic finishing processes.

The process of coating plastics with metals for functional purposes is called metallizing of plastics. This article discusses the metallizing of plastics, provides information on its history, and gives a short note on applications and adhesion properties of metallic coatings. It also discusses the selection of plastics for plating. This article also describes metallizing techniques, including plating (electrolytic or electroplating), vacuum metallizing and thermal spraying, and environmental considerations. The article discusses the quality assurance procedures for metallized plastic parts which include tests that assess the quality of the finish, coating thickness, adhesion, and corrosion resistance, and gives a short note on service performance, which includes service condition classifications.

Ceramic-matrix composites (CMCs) have ability to withstand high temperatures and have superior damage tolerance over monolithic ceramics. This article describes important processing techniques for CMCs: cold pressing, sintering, hot pressing, reaction-bonding, directed oxidation, in situ chemical reaction techniques, sol-gel techniques, pyrolysis, polymer infiltration, self-propagating high-temperature synthesis, and electrophoretic deposition. The advantages and disadvantages of each technique are highlighted to provide a comprehensive understanding of the achievements and challenges that remain in this area.

Ores, which consist of the primary valuable mineral, predominant gangue content, valuable by-products, and detrimental impurities, are extracted and directed to mineral processing. This article describes the mineral processing facilities, such as crushers, grinders, concentrators, separators, and flotation devices that are used for particle size reduction, separation of particles according to their settling rates in fluids and dewatering of concentrate particles. It explains the basic principles, flow diagrams, ore concentrate preparation methods, and equipment of major types of metallurgical processes, including pyrometallurgical, hydrometallurgical, and electrometallurgical processes.

This article focuses on the process methods and matrix chemistries of ceramic-matrix composites. These methods include pressure-assisted densification, chemical vapor infiltration, melt infiltration, polymer infiltration and pyrolysis, and sol-gel processing. The article discusses the use of a ceramic, preceramic, or metal phase as a fluid or vapor phase reactant to form the matrix. Emphasis is placed on microstructural features that influence ultimate composite properties.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

This article discusses the fundamentals of thermal vaporization and condensation and provides information on the various vaporization sources and methods of vacuum deposition. It offers an overview of reactive evaporation and its deposition techniques. The article also explains the advantages, limitations, and applications of vacuum deposition processes. Finally, it provides information on the gas evaporation process, its processing chamber, and related systems.

Nanotechnology and smart-coating technologies have been reported to show great promise for improved performance in critical areas such as corrosion resistance, durability, and conductivity. This article exemplifies nanofilms and nanomaterials used in coatings applications, including carbon nanotubes, silica, metals/metal oxides, ceramics, clays, buckyballs, graphene, polymers, titanium dioxide, and waxes. These can be produced by a variety of methods, including chemical vapor deposition, plasma arcing, electrodeposition, sol-gel synthesis, and ball milling. The application of nanotechnology and the development of smart coatings have been dependent largely on the availability of analytical and imaging techniques such as Raman spectroscopy, scanning and transmission electron microscopy, atomic force microscopy, and scanning tunneling microscopy.

Carbon-carbon is a unique composite material in which a nonstructural carbonaceous matrix is reinforced by carbon fibers to create a heat-resistant structural material that finds application in the aerospace and defense industries. This article provides a detailed account of the fundamentals of protecting carbon-carbon composites and explains the various coating deposition techniques, namely, pack cementation, chemical vapor deposition, and slurry coatings. It includes information on the practical limitations of coatings for the carbon-carbon composites.