Search Results for metal-organic chemical vapor deposition

This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.

This article presents the principles of chemical vapor deposition (CVD) with illustrations. It discusses the types of CVD processes, namely, thermal CVD, plasma CVD, laser CVD, closed-reactor CVD, chemical vapor infiltration, and metal-organic CVD. The article reviews the CVD reactions of materials related to hard, tribological, and high-temperature coatings and to free-standing structures. It concludes by reviewing the advantages, disadvantages, and applications of CVD.

This article describes the eight chemical cleaning methods, namely, circulation, fill and soak, cascade, foam, vapor-phase organic, steam-injected, on-line chemical, and mechanical cleaning. It presents information on deposit types, solvents used to remove them, and construction material incompatibilities in a table. The article summarizes the uses of chemical cleaning solutions, including hydrochloric acid, phosphoric acid, and sulfamic acid, as well as the additives used to neutralize their impact on corrosion. It discusses the chemical cleaning procedures, including selection of cleaning method and solvent, documentation of cleaning, and corrosion monitoring in chemical cleaning.

This article briefly describes the basic attributes of chromate conversion coatings and the processes for applying them. It provides information on the influence of substrate microstructure on the performance of coating deposits and on the mechanism of substrate protection supplied by chromate coatings. The article also discusses the development of replacement technologies in response to environmental constraints that have developed around the use of chromium-base compounds.

This article discusses the factors affecting corrosion behavior. It describes galvanic corrosion and its protection methods. The article also provides information on coatings and inhibitors, which are used in corrosion protection.

This article is a general introduction to surface engineering of engineering components, providing an overview of the applications of surface treatments and the environmental protection regulations directly or indirectly related to surface engineering processes.

Gallium-base components can be found in a variety of products ranging from compact disk players to advanced military electronic warfare systems, owing to the factor that it can emit light, has a greater resistance to radiation and operates at faster speeds and higher temperatures. This article discusses the uses of gallium in optoelectronic devices and integrated circuits and applications of gallium. The article discusses the properties and grades of gallium arsenide and also provides information on resources of gallium. The article talks about the recovery techniques, including recovery from bauxite, zinc ore and secondary recovery process and purification. The article briefly describes the fabrication process of gallium arsenide crystals. Furthermore, the article gives a short note on world supply and demand of gallium and concludes with research and development on gallium arsenide integrated circuits.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

The process of coating plastics with metals for functional purposes is called metallizing of plastics. This article discusses the metallizing of plastics, provides information on its history, and gives a short note on applications and adhesion properties of metallic coatings. It also discusses the selection of plastics for plating. This article also describes metallizing techniques, including plating (electrolytic or electroplating), vacuum metallizing and thermal spraying, and environmental considerations. The article discusses the quality assurance procedures for metallized plastic parts which include tests that assess the quality of the finish, coating thickness, adhesion, and corrosion resistance, and gives a short note on service performance, which includes service condition classifications.

This article presents general design principles for different types of surface-finishing processes, such as cleaning, organic coatings, and inorganic coatings applied by a variety of techniques. It discusses the factors that influence the selection of surface-finishing processes. These include fabrication processes, size, weight, functional requirements, and design features. The article discusses the design as an integral part of manufacturing. It contains tables that summarize the design limitations for selected surface-preparation, organic finishing, and inorganic finishing processes.

This article focuses on the process methods and matrix chemistries of ceramic-matrix composites. These methods include pressure-assisted densification, chemical vapor infiltration, melt infiltration, polymer infiltration and pyrolysis, and sol-gel processing. The article discusses the use of a ceramic, preceramic, or metal phase as a fluid or vapor phase reactant to form the matrix. Emphasis is placed on microstructural features that influence ultimate composite properties.

This article provides an overview of the environmental performance of the most commonly used nonmetallic materials, including elastomers, plastics, thermosetting resins, resin-matrix composites, organic coatings, concrete, refractories, and ceramics. It also discusses the applications and uses of these materials.

This article discusses the definitions, classifications, structural features, vapor pressure values, corrosion inhibition mechanisms, and methods of evaluation of vapor-phase-corrosion inhibitors or volatile corrosion inhibitors (VCIs). Practical methods of using VCIs for corrosion protection of aluminum, ferrous, and nonferrous alloys are discussed with specific examples. The article contains tables that summarize the applications of different VCIs used for protecting ferrous metals, copper and its alloys, and silver.