Ion implantation involves the bombardment of a solid material with medium-to-high-energy ionized atoms and offers the ability to alloy virtually any elemental species into the near-surface region of any substrate. This article describes the fundamentals of the ion implantation process and discusses the advantages, limitations, and applications of ion implantation. It also reviews a typical medium current semiconductor implanter adapted for implantation of metals with the aid of illustrations.

This article discusses the general principles, optical systems, and emission sources of optical emission spectroscopy for elemental analysis. Changes in the energy of the valence or outer shell electrons result in the atomic lines used in emission spectroscopy. Each possible combination of electron configurations produces a spectroscopic term that describes the state of the atom. Atomic emission is analytically useful only to the extent that the emission from one atomic species can be measured and its intensity recorded independent of emission from other sources. Emission sources are often designed to minimize molecular emission. Each of the four types of emission sources; arcs, high-voltage sparks, glow discharges, and flames; has a set of physical characteristics with accompanying analytical assets and liabilities. The article also discusses the applications of each type of emission source.

This article is a detailed account of optical emission spectroscopy (OES) for elemental analysis. It begins with a discussion on the historical background of OES and development trends in OES methods. This is followed by a description of the general principles and optical systems of OES, along with various types of emission sources commonly used for OES. Some of the processes involved in calibration and quantification of OES for direct solids analysis by the ratio method are then described. The article ends with a discussion on the applications of each type of emission sources.

The raw materials used in thermal spray processes are a critical parameter in the finished coating because the variations in their size, morphology, chemistry, and phase composition can significantly impact coating properties. Therefore, it is important to test and characterize the raw materials. This article discusses various characterization methods for powders. Topics discussed include: methods for determining particle size and/or size distribution; powder and coating stoichiometry; particle chemistry; and phase analysis by x-ray diffraction. This article discusses the characterization of thermal spray powders which involves the determination of particle size and/or size distribution and phase analysis by x-ray diffraction. It provides information on preferential volatilization and rapid solidification that influence compositional differences. Wet chemical methods, spectographic analysis, and atomic absorption spectrometry are also discussed.

Physical vapor deposition (PVD) coatings are harder than any metal and are used in applications that cannot tolerate even microscopic wear losses. This article describes the three most common PVD processes: thermal evaporation, sputtering, and ion plating. It also discusses ion implantation in the context of research and development applications.

This article is a compilation of terms and definitions related to materials characterization.

The shielding gas used in a welding process has a significant influence on the overall performance of the welding system. This article discusses the basic properties of a shielding gas in terms of ionization potential, thermal conductivity, dissociation and recombination, reactivity/oxidation potential, surface tension, gas purity, and gas density. It describes the characteristics of the components of a shielding gas blend. The article discusses the selection of shielding gas for gas-metal arc welding (GMAW), gas-tungsten arc welding (GTAW), and plasma arc welding (PAW), as well as the influence of shielding gas on weld mechanical properties. It concludes with a discussion on flux-cored arc welding.

The shielding gas used in an arc welding process has a significant influence on the overall performance of the welding system. These gases are argon, helium, oxygen, hydrogen, nitrogen, and carbon dioxide. This article discusses the shielding gas selection criteria for plasma arc welding, gas metal arc welding, and flux cored arc welding. It describes the basic properties of shielding gases, namely, dissociation, recombination, reactivity potential, oxidation potential, and gas purity. The article also provides information on the influence of the shielding gas on weld mechanical properties and self-shielded flux cored arc welding.

This article discusses the basic principles of inductively coupled plasma mass spectrometry (ICP-MS), covering different instruments used for performing ICP-MS analysis. The instruments covered include the sample-introduction system, ICP ion source, mass analyzer, and ion detector. Emphasis is placed on ICP-MS applications in the semiconductor, photovoltaic, materials science, and other electronics and high-technology areas.

Fusion-based additive manufacturing (AM) processes rely on the formation of a metallurgical bond between a substrate and a feedstock material. Energy sources employed in the fusion AM process include conventional arcs, lasers, and electron beams. Each of these sources is discussed, with an emphasis on their principles of operation, key processing variables, and the influence of each source on the transfer of heat and material. Common energy sources used for metals AM processes, particularly powder-bed fusion and directed-energy deposition, are also discussed. Brief sections at the end of the article discuss the factors dictating the choice of each of these energy sources and provide information on alternative sources of AM.

Radiography is a nondestructive-inspection method that is based on the differential absorption of penetrating radiation by the part or test piece (object) being inspected. This article discusses the fundamentals and general applications of radiography, and describes the sources of radiation in radiographic inspection, including X-rays and gamma rays. It deals with the characteristics that differentiate neutron radiography from X-ray or gamma-ray radiography. The geometric principles of shadow formation, image conversion, variation of attenuation with test-piece thickness, and many other factors that govern the exposure and processing of a neutron radiograph are similar to those for radiography using X-rays or gamma rays.

This article is a compilation of definitions of terms related to materials characterization techniques.

Sputtering is a nonthermal vaporization process in which atoms are ejected from the surface of a solid by momentum transfer from energetic particles of atomic or molecular size. Ionized gases in plasma nitriding chambers often possess enough energy to sputter atoms from workload, fixturing, and racking surfaces that are then redeposited to the benefit or detriment of the nitriding process. This article explains how and why sputtering occurs during plasma nitriding and how to recognize and control its effects. It reviews the factors that influence the intensity of sputtering and its effects, whether positive or negative, on treated parts. It also provides recommendations for improving outcomes when nitriding titanium alloys, ferrous metals, particularly stainless steels, and components with complex geometries.

Inductively coupled plasma atomic emission spectroscopy (ICP-AES) is an analytical technique for elemental determinations in the concentration range of major to trace based on the principles of atomic spectroscopy. This article provides a description of the basic atomic theory, and explains the analytical procedures and various interference effects of ICP, namely, spectral, vaporization-atomization, and ionization. It provides a detailed discussion on the principal components of an analytical ICP system, namely, the sample introduction system; ICP torch and argon gas supplies; radio-frequency generator and associated electronics; spectrometers, such as polychromators and monochromators; detection electronics and interface; and the system computer with appropriate hardware and software. The article also describes the uses of direct-current plasma, and provides examples of the applications of ICP-AES.

This article provides a clear but nonexhaustive description of the general principle of atomic emission, with a particular focus on instrumentation, and summarizes the main characteristics of the inductively coupled plasma optical emission spectrometer technique. Basic atomic theory as well as the instrument characteristics and their influence on the instrument performances are presented. The advantages, drawbacks, and developments of this technique are discussed, and, finally, alternative techniques and examples of applications are provided.

This article provides a brief account of glow discharge mass spectrometry (GDMS) for direct determination of trace elements in solid samples and for fast depth profiling in a great variety of innovative materials. It begins by describing the general principles of GDMS. This is followed by a discussion on the various components of a GDMS system as well as commercial GDMS instruments. A description of processes involved in specimen preparation and cleaning in GDMS is then presented. Various problems pertinent to multielemental calibrations in GDMS are discussed along with measures to overcome them. The article further provides information on the processes involved in the analytical setup of parameters in GDMS, covering the steps involved in the analysis of GDMS data. It ends with a section on the application and interpretation of GDMS in the metals industry.

Plasma (ion) nitriding is a method of surface hardening using glow-discharge technology to introduce nascent (elemental) nitrogen to the surface of a metal part for subsequent diffusion into the material. This article describes the procedures and applications of plasma nitriding methods of steel. These methods include direct-current plasma nitriding, pulsed-current plasma nitriding, and active-screen plasma nitriding. The article reviews cold-walled and hot-walled furnaces used for plasma nitriding. It provides information on the importance of controlling three process parameters: atmosphere, pressure, and part temperature. The article includes a discussion on the influence of nitrogen concentration on case structure formation on nitrided steel, and explains the significance of microstructure, hardness, and fatigue strength on nitrided case. It also discusses processing, laboratory studies, and applications of nitrocarburizing of steel.

Radiography is the process or technique of producing images of a solid material on a paper/photographic film or on a fluorescent screen by means of radiation particles or electromagnetic waves of short wavelength. This article reviews the general characteristics and safety principles associated with radiography. There are two main aspects of safety: monitoring radiation dosage and protecting personnel. The article summarizes the major factors involved in both and discusses the operating characteristics of X-ray tubes. It describes the various methods of controlling scattered radiation: use of lead screens; protection against backscatter and scatter from external objects; and use of masks, diaphragms, collimators, and filtration. The article concludes with a discussion on image conversion media, including recording media, lead screens, lead oxide screens, and fluorescent intensifying screens.

Digital radiography is a technique that uses digital detector arrays (linear or area) to capture an X-ray photonic signal and convert it to an electronic signal for display on a computer. This article begins with an overview of real-time radiography and provides a schematic illustration of a typical radioscopic system using an X-ray image intensifier. It discusses the advantages and limitations of real-time radiography. Computed radiography (CR) is one of the radiography techniques that utilizes a reusable detector comprised of photostimuable luminescence (PSL) storage phosphor. The article provides a schematic illustration of a typical storage phosphor imaging plate. It concludes with a discussion on the benefits of digital radiography.

Particle-induced x-ray emission (PIXE) is one of several quantitative analyses based on characteristic x-rays. This article provides a detailed account on the principles of PIXE, discussing the data-reduction codes used to identify, integrate, and reduce x-ray peaks into elemental concentrations. It provides information on the calibration of PIXE analysis, which is mostly performed using gravimetric standards to avoid serious absorption, refluorescence, or ion energy change corrections. A comparative study on PIXE and x-ray fluorescence is also included. Finally, the article discusses the applications of PIXE in three areas, namely, atmospheric physics and chemistry, external proton milliprobes and historical analysis, and PIXE microprobes.