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low-energy electron diffraction
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Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006655
EISBN: 978-1-62708-213-6
... Abstract Low-energy electron diffraction (LEED) is a technique for investigating the crystallography of surfaces and overlayers adsorbed on surfaces. This article provides a brief account of LEED, covering the principles and measurements of diffraction from surfaces. Some of the processes...
Abstract
Low-energy electron diffraction (LEED) is a technique for investigating the crystallography of surfaces and overlayers adsorbed on surfaces. This article provides a brief account of LEED, covering the principles and measurements of diffraction from surfaces. Some of the processes involved in sample preparation are described. In addition, the article discusses the limitations of surface-sensitive electron diffraction and the applications of LEED with examples.
Series: ASM Handbook Archive
Volume: 10
Publisher: ASM International
Published: 01 January 1986
DOI: 10.31399/asm.hb.v10.a0001769
EISBN: 978-1-62708-178-8
... Abstract Low-energy electron diffraction (LEED) is a technique for investigating the crystallography of surfaces and overlayers adsorbed on surfaces. This article describes the principles of diffraction from surfaces, and elucidates the method of sample preparation to achieve diffraction...
Abstract
Low-energy electron diffraction (LEED) is a technique for investigating the crystallography of surfaces and overlayers adsorbed on surfaces. This article describes the principles of diffraction from surfaces, and elucidates the method of sample preparation to achieve diffraction patterns. The article describes the limitations of surface sensitive electron diffraction and discusses the applications of LEED with examples.
Image
Published: 15 December 2019
Fig. 11 Diffraction patterns from GaAs (110). (a) Low-energy electron diffraction pattern near normal incidence, E p = 100 eV. (b) Reflection high-energy electron diffraction pattern, incident beam along [100] azimuth at grazing angle of incidence of 4.5°, E p = 10 keV. The lowest
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Image
Published: 15 December 2019
Fig. 10 Mean free path for inelastic scattering of electrons as a function of kinetic energy of electrons travelling in a solid. Electrons in the low-energy electron diffraction energy range travel only of the order of 0.4 to 2 nm in the crystal before losing energy and thus becoming lost
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Image
Published: 15 December 2019
Fig. 9 Schematic view of low-energy ion-scattering spectroscopy combined with an ultrahigh vacuum chamber. AES, Auger electron spectroscopy; LEED, low-energy electron diffraction; MCP, microchannel plate; TDC, time-to-digital converter; TMP, turbo molecular pump
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Image
Published: 15 December 2019
Fig. 6 Reciprocal lattice and Ewald construction corresponding to low-energy electron diffraction and comparison to real-space picture. (a) Real-space schematic diagram of diffraction from a surface. The electron beam is incident on the sample along the direction given by e − . The five
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Book Chapter
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005647
EISBN: 978-1-62708-174-0
... longitudinal, liter lb pound lbf pound force LBW laser beam welding LCL lower control limit LEED low-energy electron diffraction LEFM linear elastic fracture mechanics LME liquid metal embrittlement LMP Larson-Miller parameter ln natural logarithm (base e ) LNG...
Series: ASM Handbook Archive
Volume: 10
Publisher: ASM International
Published: 01 January 1986
DOI: 10.31399/asm.hb.v10.a0005693
EISBN: 978-1-62708-178-8
... inductively coupled plasma atomic emission spectroscopy ICP-MS inductively coupled plasma mass spectrometry IR infrared (spectroscopy) IRRAS infrared reflection absorption spectroscopy LEED low-energy electron diffraction LEISS low-energy ion-scattering spectroscopy...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006675
EISBN: 978-1-62708-213-6
..., surface chemical reaction, surface contamination, wear, depth profile of each element with ion gun sputtering Low-energy electron diffraction (LEED) Electrons Diffraction electrons Surface crystallography and microstructure 10 μm 0.4–2 nm Adsorption, catalysis, chemical reactions, crystallography...
Abstract
This article is an overview of the division Surface Analysis of this volume. The division covers various developed surface-analysis techniques, such as scanning probe and atomic force microscopy. The division focuses on the analysis of surface layers that are less than 100 nm. A quick reference summary of surface-analysis methods is presented in this article.
Book Chapter
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006678
EISBN: 978-1-62708-213-6
... developed techniques, such as “Introduction to Scanning Probe Microscopy” and “Atomic Force Microscopy,” as well as established methods, such as “Auger Electron Spectroscopy,” “Low-Energy Electron Diffraction,” and “Secondary Ion Mass Spectroscopy.” Quick reference summary of surface analysis...
Abstract
This article briefly discusses popular techniques for metals characterization. It begins with a description of the most common techniques for determining chemical composition of metals, namely X-ray fluorescence, optical emission spectroscopy, inductively coupled plasma optical emission spectroscopy, high-temperature combustion, and inert gas fusion. This is followed by a section on techniques for determining the atomic structure of crystals, namely X-ray diffraction, neutron diffraction, and electron diffraction. Types of electron microscopies most commonly used for microstructural analysis of metals, such as scanning electron microscopy, electron probe microanalysis, and transmission electron microscopy, are then reviewed. The article contains tables listing analytical methods used for characterization of metals and alloys and surface analysis techniques. It ends by discussing the objective of metallography.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0005586
EISBN: 978-1-62708-170-2
... microscope LCT low coiling temperature LDPE low-density polyethylene LEED low-energy electron diffraction ln natural logarithm (base e ) log common logarithm (base 10) LPCVD low-pressure chemical vapor deposition LSI large-scale integrated (circuit...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006628
EISBN: 978-1-62708-213-6
... converter (time resolution 10 ns), (7) pulse generator (100 kHz, 50 V), (8 ) low-energy electron diffraction (LEED) optics and Auger electron spectroscopy (AES) equipment, and (9 ) software to collect data and control the stepping motor. A neutralizer is shown in Fig. 9 . It is not needed for LEIS...
Abstract
This article is a brief account of low-energy ion-scattering spectroscopy (LEIS) for determining the atomic structure of solid surfaces. It begins with a description of the general principles of LEIS. This is followed by a section providing information on the equipment used for LEIS. Various steps involved in the sample preparation, calibration, and data analysis are then discussed. The article concludes with a section on the applications and interpretation of LEIS in material analysis, including discussion on surface structural analysis, layer-by-layer (Frank-van der Merwe) growth, and low-energy atom-scattering spectroscopy.
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006670
EISBN: 978-1-62708-213-6
...; SIMS: secondary ion mass spectroscopy; RBS: Rutherford backscattering spectrometry; XPS: x-ray photoelectron spectroscopy; AFM: atomic force microscopy; EFM: electrostatic force microscopy; SCM: scanning capacitance microscopy; NIM: nanoimpedance microscopy; LEED: low-energy electron diffraction; RHEED...
Abstract
This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0005663
EISBN: 978-1-62708-173-3
... nondestructive evaluation H Henry LBW laser-beam welding NEC National Electric Code H enthalpy; hardness; magnetic field LCL lower control limit NEMA National Electrical Manufacturers As- HAZ heat-affected zone LEED low-energy electron diffraction HB Brinell hardness LEFM linear elastic fracture mechanics...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003252
EISBN: 978-1-62708-199-3
... of atomic number contrast: ∼1 μm X-ray characterization of elemental chemistry: ∼2 μm using typical beam voltages of ∼20 kV (much better resolution, ∼100 nm, can be obtained using low voltage beams) Electron diffraction characterization of crystal structure and orientation: ∼1 μm Elemental...
Abstract
Microstructural analysis is the combined characterization of the morphology, elemental composition, and crystallography of microstructural features through the use of a microscope. This article reviews three types of the most commonly used electron microscopies in metallurgical studies, namely scanning electron microscopy, electron probe microanalysis, and transmission electron microscopy. It briefly describes the operating principles, instrumentation which includes energy dispersive X-ray detectors, spatial resolution, typical use of the techniques, elemental analysis detection threshold and precision, limitations, sample requirements, and the capabilities of related techniques.
Series: ASM Handbook Archive
Volume: 10
Publisher: ASM International
Published: 01 January 1986
DOI: 10.31399/asm.hb.v10.a0001725
EISBN: 978-1-62708-178-8
...” are articles on “Analytical Transmission Electron Microscopy,” “Scanning Electron Microscopy,” “Electron Probe X-Ray Microanalysis,” and “Low-Energy Electron Diffraction.” Each article begins with a summary of general uses, applications, limitations, sample requirements, and capabilities of related...
Book: Powder Metallurgy
Series: ASM Handbook
Volume: 7
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v07.a0006126
EISBN: 978-1-62708-175-7
... approximately one-half the depth of the scattered electron range. Auger electrons are collected from sample depths of 0.5 to 3 nm below the surface, depending on their energy. Because Auger electron energies are relatively low, only those near the sample surface escape without suffering additional energy loss...
Abstract
This article discusses the capabilities and limitations of various material characterization methods that assist in the selection of a proper analytical tool for analyzing particulate materials. Commonly used methods are microanalysis, surface analysis, and bulk analysis. The techniques used for performing microanalysis include scanning electron microscopy and electron probe X-ray microanalysis. The article describes surface analysis techniques, including Auger electron spectroscopy, X-ray photoelectron spectroscopy, and ion-scattering spectroscopy. Bulk analysis techniques, such as X-ray powder diffraction, inductively coupled plasma atomic emission spectroscopy, atomic absorption spectroscopy, and atomic fluorescence spectrometry, are also discussed.
Series: ASM Handbook Archive
Volume: 10
Publisher: ASM International
Published: 01 January 1986
DOI: 10.31399/asm.hb.v10.a0001766
EISBN: 978-1-62708-178-8
... materials at low beam energy. Elastic scattering is responsible for both electron diffraction (thin foils) and the generation of backscattered electrons (bulk specimens and thin foils). Coherent elastic scattering of electrons in the forward direction produces the form of electron diffraction commonly...
Abstract
Analytical transmission electron microscopy (ATEM) is unique among materials characterization techniques as it enables essentially the simultaneous examination of microstructural features through high-resolution imaging and the acquisition of chemical and crystallographic information from small regions of the specimen. This article illustrates the effectiveness of the technique in solving materials problems. The first section of the article provides information on analytical electron microscope (AEM) and its basic operational characteristics as well as on electron optics, electron beam/specimen interactions and the generation of a signal, signal detectors, electron diffraction, imaging, x-ray microanalysis, electron energy loss spectroscopy, and sample preparation. The second section consists of 12 examples, each illustrating a specific type of materials problem that can be solved, at least in part, with AEM.
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006681
EISBN: 978-1-62708-213-6
... scattering is more probable in high-atomic-number materials at low beam energy. Elastic scattering is responsible for both electron diffraction (thin foils) and the generation of BEs (bulk samples in SEM and thin specimens in TEM). Coherent elastic scattering of electrons in the forward direction produces...
Abstract
Transmission electron microscopy (TEM) approach enables essentially simultaneous examination of microstructural features through imaging from lower magnifications to atomic resolution and the acquisition of chemical and crystallographic information from small regions of the thin specimen. This article discusses fundamentals of the technique, especially for solving materials problems. Background information is provided to help understand basic operations and principles, including instrumentation, the physics of signal generation and detection, image formation, electron diffraction, and spectrometry techniques with data analysis.
Book Chapter
Series: ASM Handbook Archive
Volume: 10
Publisher: ASM International
Published: 01 January 1986
DOI: 10.31399/asm.hb.v10.a0005692
EISBN: 978-1-62708-178-8
.... Glossary of Terms / 669 angstrom A unit of length equal to (high atomic number areas appear light, Auger matrix effects. Effects that cause 10 lo m. while low atomic number areas appear changes in the shape of an Auger electron dark). Usually obtained by imaging based energy distribution or in the Auger...
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