Search Results for lock-in thermography

For most nondestructive evaluation (NDE) applications, the term thermography actually refers to surface-excited thermography (SET) that involves thermal mapping of surface temperature as heat flows from, to, or through a test object in response to excitation applied to the sample surface. This article discusses the strategies for implementing thermography for NDE, including the steady-state/whole-body approach and transient heat conduction. It describes the most common signal-processing methods, such as thermographic signal reconstruction, lock-in thermography, and pulsed-phase thermography. The article concludes with a discussion on the use of thermal methods for thermal diffusivity measurement and characterization of multilayer structures.

Thermoelastic stress analysis (TSA) an increasingly popular infrared (IR)-based technique for measuring stress on the surface of a part subjected to time-varying loads. This article begins by providing a theoretical and historical background of thermoelastic stress analysis. It then describes infrared detectors, such as quantum detectors and thermal/nonquantum detectors, for thermoelastic stress analysis. The article discusses the theoretical aspects for producing thermoelastic stress analysis data and the applications amenable to thermoelastic stress analysis. It concludes with information on the qualitative applications of thermoelastic stress analysis.

This article begins with an overview of the various aspects of infrared pulse thermography used to detect disbondments, delaminations, and generalized corrosion. It describes the distinctive phases of the pulse thermographic process and the key components that are required to perform active thermography. The components include an excitation source, a thermographic camera, and a computer with software that controls the instrumentation, acquires data, and displays the results. The article discusses the process and experimental setup of sonic thermography used for crack detection.

In situ process monitoring includes any technologies that monitor or inspect during an additive manufacturing (AM) process. This article presents the types, process considerations, and challenges of in situ monitoring technologies that can be implemented during an AM process. The types include system health monitoring, melt pool monitoring, and layer monitoring. The article discusses data analysis, and provides an overview of the integration of sensors into AM machines.

Additive manufacturing (AM) security is considered an integral part of several broader security fields, including supply chain security and critical infrastructure security. This article presents a general guide to the types of data and locations of data as they may exist in a typical AM-using organization. It discusses the following threat categories: technical data theft, sabotage, illegal part manufacturing, and data infiltration and exfiltration. The article also presents a detailed discussion on countermeasures against threat categories.

The use of additive manufacturing (AM) is increasing for high-value, critical applications across a range of disparate industries. This article presents a discussion of high-valued engineering components predominantly used in the aerospace and medical industries. Applications involving metal AM, including methods to identify pores and voids in AM materials, are the focus. The article reviews flaw formation in laser-based powder-bed fusion, summarizes sensors used for in situ process monitoring, and outlines advances made with in situ process-monitoring data to detect AM process flaws. It reviews investigations of ML-based strategies, identifies challenges and research opportunities, and presents strategies for assessing anomaly detection performance.

This article is a compilation of definitions for terms related to engineering materials, including plastics, elastomers, polymer-matrix composites, adhesives and sealants, ceramics, ceramic-matrix composites, glasses, and carbon-carbon composites.