This article begins with a schematic illustration of a eutectic system in which the two components of the system have the same crystal structure. Eutectic systems form when alloying additions cause a lowering of the liquidus lines from both melting points of the pure elements. The article describes the aluminum-silicon eutectic system and the lead-tin eutectic system. It discusses eutectic morphologies in terms of lamellar and fibrous eutectics, regular and irregular eutectics, and the interpretation of eutectic microstructures. The article examines the solidification of a binary alloy of exactly eutectic composition. It concludes with a discussion on terminal solid solutions.

This article describes the specimen preparation steps for tin and tin alloys, and for harder base metals which are coated with these materials with illustrations. The steps discussed include sectioning, mounting, grinding, polishing, and etching. The article provides information on etchants for tin and tin alloys in tabular form. It presents the procedure recommended for electron microscopy to determine the nature of the intermetallic compound formed by the reaction between tin or tin-lead coatings on various substrates. The article concludes with an illustration of the microstructures of tin-copper, tin-lead, tin-lead-cadmium, tin-antimony, tin-antimony-copper, tin-antimony-copper-lead, tin-silver, tin-indium, tin-zinc, and tin-zinc-copper systems.

This article describes the various specimen preparation procedures for lead, lead alloys, and sleeve bearings, including sectioning, mounting, grinding, polishing, and etching. The microscopic examination and microstructures of lead and lead alloys are discussed. The article also provides information on the microstructures of sleeve bearing materials.

Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most common impurity elements in tin-lead solders. It describes the various processes involved in the successful soldering of joints, including shaping the parts to fit closely together; cleaning and preparing the surfaces to be joined; applying a flux; assembling the parts; and applying the heat and solder.

Before the quality of a soldered joint can be evaluated, the components that are required for the formation of a good soldered joint should be reviewed. These components are solder, applied heat, and solderable surface. This article discusses each of these as well as the end-use requirements and joint configurations required for the formation of a good soldered joint. It focuses on the visual, automatic, and destructive inspection techniques for determining overall joint quality.

Fusible alloys, eutectic and noneutectic, include a group of binary, ternary, quaternary, and quinary alloys containing bismuth, lead, tin, cadmium, and indium that melt at relatively low temperatures. This article describes the composition and mechanical properties of these alloys and lists the values of their composition and melting temperatures.

This article focuses on the use of indium and bismuth in low-melting-temperature solders and fusible alloys. It describes how the two elements typically occur in nature and how they are recovered and processed for commercial use. It also provides information on designations, classification, composition, properties (including temperatures ranges), and some of the other ways in which indium and bismuth alloys are used.

This article focuses on the isothermal fatigue of solder materials. It discusses the effect of strain range, frequency, hold time, temperature, and environment on isothermal fatigue life. The article provides information on various isothermal fatigue testing methods used to assess solder joint reliability. These include the accelerated thermal cycling test and isothermal mechanical deflection system test.

This article discusses the specimen preparation techniques for zinc and its alloys and zinc-coated specimens, namely, sectioning, mounting, grinding and polishing, and etching. It describes the characteristics of lead, cadmium, iron, copper, titanium, aluminum, magnesium, and tin, which are present in the microstructure of zinc alloys. The article also provides information on microexamination that helps to determine the dendrite arm spacing, as well as the grain size, grain boundaries, and grain counts.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

Alloy phase diagrams are useful for the development, fabrication, design and control of heat treatment procedures that will produce the required mechanical, physical, and chemical properties of new alloys. They are also useful in solving problems that arise in their performance in commercial applications, thus improving product predictability. This article describes different equilibrium phase diagrams (unary, binary, and ternary) and microstructures, description terms, and general principles of reading alloy phase diagrams. Further, the article discusses plotting schemes; areas in a phase diagram; and the position and shapes of the points, lines, surfaces, and intersections, which are controlled by thermodynamic principles and properties of all phases that comprise the system. It also illustrates the application of the stated principles with suitable phase diagrams.

A sliding bearing (plain bearing) is a machine element designed to transmit loads or reaction forces to a shaft that rotates relative to the bearing. This article explains the role of wear damage mechanisms in the design and selection of bearing materials, and its relationship with bearing material properties. Sliding bearings are commonly classified by terms that describe their application; they also are classified according to material construction, as single-metal, bimetal, or trimetal sliding bearings. The article further provides detailed tabular data on the designation and composition of the following types of bearing materials: tin-base alloys, lead-base alloys, copper-base alloys, and aluminum-base alloys. It also briefly discusses the following types of bearing materials: zinc-base alloys, silver-base alloys, gray cast irons, cemented carbides, and nonmetallic bearing materials.

Similar to the eutectic group of invariant transformations is a group of peritectic reactions, in which a liquid and solid phase decomposes into a solid phase on cooling through the peritectic isotherm. This article describes the equilibrium freezing and nonequilibrium freezing of peritectic alloys. It informs that peritectic reactions or transformations are very common in the solidification of metals. The article discusses the formation of peritectic structures that can occur by three mechanisms: peritectic reaction, peritectic transformation, and direct precipitation of beta from the melt. It provides a discussion on the peritectic structures in iron-base alloys and concludes with information on multicomponent systems.

This article presents the binary eutectic phase diagram to understand the various structures that evolve in a binary eutectic system during solidification. It describes the various classifications and solidification principles of the eutectic structures. The formation of halos in eutectic microstructures of most alloy systems is also discussed.

A sliding bearing (plain bearing) is a machine element designed to transmit loads or reaction forces to a shaft that rotates relative to the bearing. This article discusses the properties of bearing materials. It provides information on bearing material systems: single-metal systems, bimetal systems, and trimetal systems. The article describes the designations, nominal compositions, mechanical properties, and applications of various sliding bearing alloys: tin-base alloys, lead-base alloys, copper-base alloys, aluminum-base alloys, silver-base alloys, zinc-base alloys, additional metallic materials, nonmetallic materials. It describes casting processes, powder metallurgy processes, and electroplating processes. The article also discusses the selection criteria for bearing materials.

Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters is explored using examples of both structural and electronic applications. The article concludes with a discussion on the environmental, safety, and health issues to be considered during soldering.

Soldering is defined as a joining process by which two substrates are bonded together using a filler metal with a liquidus temperature. This article provides an overview of fundamentals of soldering and presents guidelines for flux selection. Types of fluxes, including rosin-base fluxes, organic fluxes, inorganic fluxes, and synthetically activated fluxes, are reviewed. The article describes the joint design and precleaning and surface preparation for soldering. It addresses some general considerations in the soldering of electronic devices. Soldering process parameters, affecting wetting and spreading phenomena, such as temperature, time, vapor pressure, metallurgical and chemical nature of the surfaces, and surface geometry, are discussed. The article also describes the applications of furnace soldering, resistance soldering, infrared soldering, and ultrasonic soldering. It contains a table that lists tests commonly used to evaluate the solderability properties of selected soldered components.

This article discusses the various heat treating processes, namely, solid-solution hardening, solution treating, solution aging and dispersion hardening, for low-melting-point alloys such as lead alloys, tin-rich alloys, and zinc alloys. Heat treating of tin-rich alloys has been practiced for bearing alloys, pewterware, and organ pipe alloys. The article reviews the principles underlying these applications.

This article describes the microstructure of copper alloys, including copper-zinc (brasses), bronzes, copper-nickel, and copper-nickel-zinc, and examines the effect of oxygen content on alloy phases observed in different product forms. The article also discusses inclusions, etchants, and the effect of composition and processing on grain structure and growth rates.