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lead-base soft solders

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Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003145
EISBN: 978-1-62708-199-3
... creep resistance, and in applications requiring a lead-free solder composition, such as potable-water plumbing. Also, tin solders that contain 5% Sb (or 5% Ag) are suitable for use at higher temperatures than are the tin-lead solders. Electrical and mechanical property data for selected tin-base...
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003818
EISBN: 978-1-62708-183-2
... ) or sodium nitrate (Na 2 NO 3 ) solutions or acidic solutions of copper and arsenic ( Ref 52 , 53 ). Bearing Alloys The most widely used babbitt-bearing alloys are usually classified as tin- or lead-base and have composition ranges within the following limits: Alloy addition Composition...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001076
EISBN: 978-1-62708-162-7
... powders find minor uses in sprayed coatings for food-handling equipment, metallizing of nonconductors, and bearing repairs. Tin particles can also be used in food can lacquers to decrease the dissolution of iron and any exposed lead-base solder by the food product. Additions of 2% tin powder and 3...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003146
EISBN: 978-1-62708-199-3
... and nominal compositions of various lead grades and lead-base alloys Lead alloy type (a) UNS No. Pure leads (UNS L50000–L50099) Zone-refined lead (99.9999% Pb min) L50001 Refined soft lead (99.999% Pb min) L50005 Refined soft lead (99.99% Pb min) L50011, L50012, L50013, L50014...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001078
EISBN: 978-1-62708-162-7
... lead grades and lead-base alloys Lead alloy type (a) UNS designations Pure leads (UNS L50000–L50099) Zone-refined lead (99.9999% Pb min) L50001 Refined soft lead (99.999% Pb min) L50005 Refined soft lead (99.99% Pb min) L50011, L50012, L50013, L50014 Corroding lead (99.94...
Series: ASM Handbook
Volume: 9
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.hb.v09.a0003778
EISBN: 978-1-62708-177-1
...-37wt%Pb eutectic alloy) are shown in Fig. 1 . Discrete areas of tin and lead are distributed as components of a globular eutectic in this alloy, and both the tin and lead phases of the eutectic are clearly delineated. No scratches are discernible in either phase. In another group of tin- or lead-base...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001092
EISBN: 978-1-62708-162-7
... interesting properties of indium is the wide spread between its melting point (156.6 °C, or 313.9 °F) and its boiling point (2080 °C, or 3775 °F) and its ability to wet glass, quartz, and many ceramics. As an additive, indium tends to harden and strengthen tin- and lead-based solders; its most marked effect...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001346
EISBN: 978-1-62708-173-3
... holds them together. When tin-lead solders are used with copper, a widely used base metal, the tin reacts with the copper. Two intermetallics discussed previously in this article can form in this metallurgical system. The compound Cu 6 Sn 5 will primarily form during liquid/solid reactions...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001459
EISBN: 978-1-62708-173-3
... parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters...
Series: ASM Handbook
Volume: 22A
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.hb.v22a.a0005444
EISBN: 978-1-62708-196-2
... (99.73 + % Pb) 0.083 5-95 solder 0.085 20-80 solder 0.089 50-50 solder 0.111 1% antimonial lead 0.080 Hard lead (96Pb-4Sb) 0.073 Hard lead (94Pb-6Sb) 0.069 8% antimonial lead 0.065 9% antimonial lead 0.064 Lead-base babbitt (SAE 14) 0.057 Lead-base babbitt (alloy 8...
Series: ASM Handbook
Volume: 22A
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.hb.v22a.a0005442
EISBN: 978-1-62708-196-2
... HS-21 8.30 0.300 Molybdenum-base alloy Mo-0.5Ti 10.2 0.368 Lead and lead alloys Chemical lead (99.90+% Pb) 11.34 0.4097 Corroding lead (99.73 +% Pb) 11.36 0.4104 Arsenical lead 11.34 0.4097 Calcium lead 11.34 0.4097 5-95 solder 11.0 0.397 20-80 solder...
Series: ASM Handbook
Volume: 9
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.hb.v09.a0003773
EISBN: 978-1-62708-177-1
... done on a 120 rpm wheel using 0.05 μm Al 2 O 3 suspended in water as the abrasive. Etch-polishing is recommended for all lead and lead alloy specimens, especially for the softer lead-base metals such as unalloyed lead and low alloys of tin, bismuth, and antimony. Etch-polishing consists...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001249
EISBN: 978-1-62708-170-2
...-washer-ring-lug terminals for attachment to aluminum capacitors. Indium Electrodeposits Indium electrodeposits provide excellent solderability, low electrical contact resistance, friction resistance, and atmospheric corrosion resistance when plated on aluminum, copper-base alloys, and steel, which...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005841
EISBN: 978-1-62708-167-2
... of the base materials will occur. The oxidation of the assembly will be more pronounced with brazing because of the higher temperatures involved. An advantage of induction brazing is that it allows for fast localized heating that minimizes the amount of oxidation that occurs during the brazing process...
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.9781627081740
EISBN: 978-1-62708-174-0
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001492
EISBN: 978-1-62708-173-3
..., and lead, is limited to 0.010 wt%. Fluxes and Atmospheres Selection The major functions of fluxes in brazing and soldering are to remove oxides from the base metal surface by a reduction and/or dissolution reaction, to protect the clean surface from reoxidation, and to modify the surface tension...
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0006543
EISBN: 978-1-62708-183-2
... alloys S-816 … 8.68 0.314 V-36 … 8.60 0.311 HS-25 … 9.13 0.330 HS-36 … 9.04 0.327 HS-31 … 8.61 0.311 HS-21 … 8.30 0.300 Molybdenum-base alloy Mo-0.5Ti … 10.2 0.368 Lead and lead alloys Chemical lead (99.90+%Pb) … 11.34 0.4097 Corroding lead...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004129
EISBN: 978-1-62708-184-9
...-proof (environmental) connectors can provide a false sense of security, based on the wicking nature of multistrand wire or coaxial leads. Any nick, slit, or hole that penetrates the sheathing and/or insulation allows moisture to enter the cable, wick along the strands, and enter the black box through...
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003819
EISBN: 978-1-62708-183-2
... was arbitrarily placed in this category.) C, 500–1270 μm/yr (20–50 mils/yr): lead may be used where this effect on life can be tolerated. D, >1270 μm/yr (>50 mils/yr): corrosion rate too high to merit any consideration of lead Tin-Lead Solder Alloys Solders were based on the tin-lead system...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001077
EISBN: 978-1-62708-162-7
... or brazing, or by certain welding techniques using zinc-base fillers. Cadmium-, tin-, or lead-base solders are not recommended because they can promote intergranular corrosion problems unless the castings are plated with heavy coatings of nickel or copper prior to soldering. Newer zinc-base solders...