In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article focuses on the key factors contributing to corrosion of electronic components, namely, chemicals (salts containing halides, sulfides, acids, and alkalis), temperature, air (polluted air), moisture, contact between dissimilar metals in a wet condition, applied potential differences, and stress. It discusses the chip corrosion and oxidation of tin and tin-lead alloys (solders) in SIC. The article also addresses the corrosion of the device terminations resulting in lead (termination) tarnishing that are caused by various factors, including galvanic corrosion, chemical residues, base metal migration and plating additives.

This article focuses on the various types of corrosion-related failure mechanisms and their effects on passive electrical components. The types include halide-induced corrosion, organic-acid-induced corrosion, electrochemical metal migration, silver tarnish, fretting, and metal whiskers. The passive electrical components include resistors, capacitors, wound components, sensors, transducers, relays, switches, connectors, printed circuit boards, and hardware.

Although stainless steel is naturally passivated by exposure to air and other oxidizers, additional surface treatments are needed to prevent corrosion. Passivation, pickling, electropolishing, and mechanical cleaning are important surface treatments for the successful performance of stainless steel. This article describes the surface treatment of stainless steels including abrasive blast cleaning, acid pickling, salt bath descaling, passivation treatments, electropolishing, and the necessary coating processes involved. It also describes the surface treatment of heat-resistant alloys including metallic contaminant removal, tarnish removal, oxide and scale removal, finishing, and coating processes.

The selection of surface treatments for copper and copper alloys is generally based on application requirements for appearance and corrosion resistance. This article describes cleaning, finishing, and coating processes for copper and copper alloys. These processes include pickling and bright dipping, abrasive blast cleaning, chemical and electrochemical cleaning, mass finishing, polishing and buffing, electroless plating, immersion plating, electroplating, passivation, coloring, and organic coatings.

This article describes dental alloy compositions and its properties. It discusses the safety and efficacy considerations of dental alloy devices. The article defines and compares interstitial fluid and oral fluid environments. Artificial solutions developed for the testing and evaluation of dental materials are summarized. The article examines the effects of restoration contact on electrochemical parameters and reviews the concentration cells developed by dental alloy-environment electrochemical reactions. The composition and characterization of biofilms, corrosion products, and other debris that deposit on dental material surfaces are discussed. The article evaluates the types of alloys available for dental applications, including direct filling alloys, crown and bridge alloys, partial denture alloys, porcelain fused to metal alloys, wrought wire alloys, soldering alloys, and implant alloys. The effects of composition and microstructure on the corrosion of each alloy group are also discussed. The article concludes with information on the tarnishing and corrosion behavior of these alloys.

Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most common impurity elements in tin-lead solders. It describes the various processes involved in the successful soldering of joints, including shaping the parts to fit closely together; cleaning and preparing the surfaces to be joined; applying a flux; assembling the parts; and applying the heat and solder.

This article describes the methods for removing metallic contaminants, tarnish, and scale resulting from hot-working or heat-treating operations on nickel-, cobalt-, and iron-base heat-resistant alloys. It provides a brief description of applicable finishing and coating processes, including polishing, electroplating, ceramic coatings, diffusion coatings, and shot-peening. The article presents numerous examples that identify cleaning and finishing problems and the procedures used to solve them.

This article discusses the procedures used for pickling nickel and nickel alloys. Nickel alloys can be divided into four groups: high-nickel alloys, nickel-copper alloys, nickel-chromium alloys, and nickel-iron-chromium alloys. Alloys within each composition group that has similar surface conditions are pickled in the same solutions using the same procedures. The article discusses three different surface conditions for pickling these nickel alloys: bright annealed white surface requiring removal of tarnish by flash pickling; bright annealed oxidized surface requiring removal of a layer of reduced oxide, sometimes followed by a flash pickle to brighten; and black or dark-colored surface requiring removal of adherent oxide film or scale. The article also reviews specialized pickling operations of nickel alloys and various cleaning and finishing operations, including grinding, polishing, buffing, brushing, and blasting.

Precious metals include gold, silver, and six platinum-group metals, namely, platinum, palladium, ruthenium, rhodium, osmium, and iridium. This article focuses on the consumption, trade practices, properties, product forms, and applications of these metals and their alloys.

A tin deposit provides sacrificial protection to copper, nickel, and many other nonferrous metals and alloys. Tin also provides good protection to steel. Tin can be deposited from either alkaline or acid electrolytes. This article explains the compositions and operating conditions of these electrolytes.

This article presents a general survey of corrosive agents and processes that exist within what are usually considered the protective environments of museums and historic collections. It reviews the corrosion influencing factors, such as humidity, temperature, and light. The article provides a list of pollutants and their sources in museums and collections. It discusses the sources of corrosion, including plastic and wood, sulfur, and carbonyl compounds. The article describes the preservation steps for materials in museum to eliminate the corrosive sources acting on the objects and to avoid other potentially damaging materials.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

This article characterizes the corrosion resistance of precious metals, namely, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold. It provides a discussion on the general fabricability; atomic, structural, physical, and mechanical properties; oxidation and corrosion resistance; and corrosion applications of these precious metals. The article also tabulates the corrosion rates of these precious metals in corrosive environment, namely, acids, salts, and halogens.

Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters is explored using examples of both structural and electronic applications. The article concludes with a discussion on the environmental, safety, and health issues to be considered during soldering.

This article discusses the chemical composition, fabrication characteristics, applications, mechanical properties, mass characteristics, thermal properties, electrical properties, optical properties, and chemical properties of precious metals, namely, silver, gold, platinum, and palladium and their corresponding alloys.

Precious metals are of inestimable value to modern civilization. This article discusses the resources and consumption, trade practices, and special properties of precious metals and its alloys, including ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold, and tabulates the industrial applications of precious metals. It provides information on the commercial forms (wire, rod, sheet, strip, ribbon, and foil) and uses of precious metals, including semifinished products, precious metal powders, industrial uses, coatings, and jewelry.