Lead has been deposited from a variety of electrolytes, including fluoborates, fluosilicates, sulfamates, and methane sulfonic acid baths. This article provides a discussion on these electrolytic baths and includes information on the process sequence, equipment requirements, and applications of lead plating.

Copper can be electrodeposited from numerous electrolytes. Cyanide and pyrophosphate alkalines, along with sulfate and fluoborate acid baths, are the primary electrolytes used in copper plating. This article provides information on the chemical composition, plating baths, and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating. The article also discusses selective plating, electroforming, and other processes and where they are typically used.

Electrodeposition of tin alloys is used to protect steel against corrosion or wear, to impart resistance to etching, and to facilitate soldering. This article focuses on the compositions, operating conditions, advantages, and limitations of methane sulfonic acid plating solutions and fluoborate plating solutions for tin-lead. It briefly describes the solution compositions and operating conditions of tin-bismuth, tin-nickel, and tin-zinc.

This article focuses on the electrodeposition of indium and its alloys, such as indium-antimony, indium-gallium, and indium-bismuth, in nonaqueous indium plating baths. It also provides information on the stripping of indium plate from plated components and presents an overview of the specifications, standards, and hazards of indium plating.

In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article focuses on the key factors contributing to corrosion of electronic components, namely, chemicals (salts containing halides, sulfides, acids, and alkalis), temperature, air (polluted air), moisture, contact between dissimilar metals in a wet condition, applied potential differences, and stress. It discusses the chip corrosion and oxidation of tin and tin-lead alloys (solders) in SIC. The article also addresses the corrosion of the device terminations resulting in lead (termination) tarnishing that are caused by various factors, including galvanic corrosion, chemical residues, base metal migration and plating additives.

This article discusses the processing, properties, and applications of various grades of lead and lead-base alloys with the aid of several tables and illustrations. It lists the Unified Numbering System (UNS) designations for various pure lead grades and lead-base alloys grouped according to nominal chemical composition. The properties of lead that make it useful in a wide variety of applications are also discussed. The largest usage of lead is in the lead acid storage batteries (in the grid plates, posts, and connector straps). Other applications include ammunition; cable sheathing; cast products such as type metals, terneplates, and foils; and building construction materials. Lead is also used as an alloying element in steel and in copper alloys to improve machinability and other characteristics. In many applications, lead is combined with stronger materials to make structures that have the best qualities of both materials such as the plumbum series.

Mechanical plating is a method for coating ferrous metals, copper alloys, lead, stainless steel, and certain types of castings by tumbling the parts in a mixture of glass beads, metallic dust or powder, promoter or accelerator chemicals, and water. It offers a straightforward alternative method for achieving desired mechanical and galvanic properties with an extremely low risk of hydrogen embrittlement. This article provides a detailed description of the equipment, process steps, process capabilities, applicable parts, specific characteristics, advantages, limitations, post treatments, and waste treatment of mechanical plating.

This article provides information on single-shot and scanning, the two types of induction heat treating processes that are based on whether the induction coil is moving relative to the part during the heating process. It describes the effect of the frequency of induction heating current on the induction coil and process design, and the control of heating in different areas of the inductor part. The article reviews three main tools for adjustment of coil design and fabrication: coupling gap, coil copper profile, and magnetic flux controllers. It examines the method of holding a part and presenting it to the inductor during the initial inductor design. The article provides information on coil leads/busswork and contacts that mechanically and electrically connect the induction coil head to the power supply. It concludes with a discussion on flux and oxide removal, leak and flow checking, silver plating, and electrical parameter measurement.

Film radiography requires the development of the exposed film so that the latent image becomes visible for viewing. It describes the general characteristics of film, including speed, gradient, and graininess, and the factors affecting film selection and exposure time. The article discusses the three major inspection techniques for tubular sections, namely, the double-wall, double-image technique; the double-wall, single-image technique; and the single-wall, single-image technique. It illustrates the arrangements of penetrameters and identification markers for the radiography of plates, cylinders, and flanges. The article discusses various control methods, including the use of lead screens; protection against backscatter and scatter from external objects; and the use of masks, diaphragms, collimators, and filtration. The radiographic appearance of specific types of flaws is also discussed. The article concludes with a discussion on two methods of radiographic film processing: manual and automatic processing.

Most decorative chromium coatings have been applied using hexavalent and trivalent plating processes that are based on chromic anhydride. This article provides a discussion on chromium electrodeposits and their use as microdiscontinuous coating for corrosion protection. It focuses on the operating conditions of various chromium plating parameters: bath composition, temperature, voltage, anode materials, and current density. These parameters need to be considered for obtaining high quality decorative chromium coatings. An overview of plating problems encountered in chromium plating and their corrections is also provided.

The selection of surface treatments for copper and copper alloys is generally based on application requirements for appearance and corrosion resistance. This article describes cleaning, finishing, and coating processes for copper and copper alloys. These processes include pickling and bright dipping, abrasive blast cleaning, chemical and electrochemical cleaning, mass finishing, polishing and buffing, electroless plating, immersion plating, electroplating, passivation, coloring, and organic coatings.

This article focuses on the various types of corrosion-related failure mechanisms and their effects on passive electrical components. The types include halide-induced corrosion, organic-acid-induced corrosion, electrochemical metal migration, silver tarnish, fretting, and metal whiskers. The passive electrical components include resistors, capacitors, wound components, sensors, transducers, relays, switches, connectors, printed circuit boards, and hardware.

Hard chromium plating is produced by electrodeposition from a solution containing chromic acid and a catalytic anion in proper proportion. This article presents the major uses of hard chromium plating, and focuses on the selection factors, plating solutions, solution and process control, equipment, surface preparation, and crack patterns and other characteristics of hard chromium plating. It offers recommendations for the design and use of plating racks, describes the problems encountered in hard chromium plating, and their corrective procedures. The article provides information on the removal of chromium plate from coated metals, recovery and disposal of wastes, and stopoff media for selective plating.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

This article discusses the various factors that affect the corrosion performance of electroplated coatings. It describes the effects of environment and the deposition process on substrate coatings. The article provides a discussion on the electrochemical techniques capable of predicting the corrosion performance of a plated part. It reviews the designs of coating systems for optimal protection of the substrate. The article also discusses controlled weathering tests and accelerated tests used to predict and determine the relative durability of the coating.

Copper alloys are widely used as electroplated coatings. They can also be used with practically any substrate material that is suitable for electroplating. This article focuses on the solution composition and operating conditions for brass and bronze plating solutions. It describes the decorative and engineering applications of brass and bronze plating. The article also provides information on the treatment of waste water from brass and bronze plating operations.

Before the quality of a soldered joint can be evaluated, the components that are required for the formation of a good soldered joint should be reviewed. These components are solder, applied heat, and solderable surface. This article discusses each of these as well as the end-use requirements and joint configurations required for the formation of a good soldered joint. It focuses on the visual, automatic, and destructive inspection techniques for determining overall joint quality.

A sliding bearing (plain bearing) is a machine element designed to transmit loads or reaction forces to a shaft that rotates relative to the bearing. This article discusses the properties of bearing materials. It provides information on bearing material systems: single-metal systems, bimetal systems, and trimetal systems. The article describes the designations, nominal compositions, mechanical properties, and applications of various sliding bearing alloys: tin-base alloys, lead-base alloys, copper-base alloys, aluminum-base alloys, silver-base alloys, zinc-base alloys, additional metallic materials, nonmetallic materials. It describes casting processes, powder metallurgy processes, and electroplating processes. The article also discusses the selection criteria for bearing materials.