Search Results for layer growth

This article reviews the phase diagrams, alloy with third element additions, layer growth, critical current density, and matrix materials of A15 superconductors. It describes the production methods of tape conductors (chloride deposition, and surface diffusion) and multifilamentary wires (rod process, modified jelly roll process, niobium tube process, in-situ process, powder metallurgy process, and jelly roll method). The article focuses on reaction heat treatment, which is required at the end of wire processing to convert the ductile components to the desired, but brittle, superconductor. Finally, it discusses the applications of A15 superconductors in commercial magnets, power generation, power transmission, high-energy physics, and fusion.

Diffusion is the process by which molecules, atoms, ions, point defects, or other particle types migrate from a region of higher concentration to one of lower concentration. This article focuses on the diffusivity data and modeling of lattice diffusion in solid-state materials, presenting their diffusion equations. It discusses different methods for evaluating the diffusivity of a material, including the measurement of diffusion coefficients, composition profiles, and layer growth widths. The article reviews the various types of direct and indirect diffusion experiments to extract tracer, intrinsic, and chemical diffusivities. It provides information on the applications of single-phase and multiphase diffusion.

Aluminum and its alloys are characterized by their low hardness and less satisfactory tribological performance. These limits can be overcome by means of load-specific surface engineering. This article provides information on the structure and properties of nitrided layers, and the technologies and mechanisms used for nitriding aluminum and its alloys. It also describes the nitriding behavior of aluminum alloys. The article concludes by describing how a combination of technologies can be utilized to achieve aluminum nitride with the highest tribological properties.

The thermoreactive deposition and diffusion process is a heat-treatment-based method to form coatings with compacted layers of carbides, nitrides, or carbonitrides, onto some carbon/nitrogen-containing materials, including steels. The amount of active carbide forming elements/nitride forming elements, coating temperatures and time, and thickness of substrates influence the growth rate of coatings. This article lists carbide and nitride coatings that are formed on carbon/nitrogen-containing metallic materials, and describes the coating process and mechanism of coating reagents. It details the growth process and nucleation process of carbide and nitride coatings formed on the metal surface. The article discusses the advantages, disadvantages, and characteristics of the various coating processes, including high-temperature salt bath carbide coating, high-temperature fluidized-bed carbide coating, and low-temperature salt bath nitride coating.

This article focuses on alternatives to chromium in both hard chromium plating and chromate conversion coating. These include electroless nickel plating, nickel-tungsten composite electroplating, spray coating applications, and cobalt/molybdenum-base conversion coating. The article discusses the material and process substitutions that can be used to eliminate the use or emissions of chromium in industrial processes. It describes the physical characteristics of each coating, economics, environmental impacts, advantages, and disadvantages of alternative processes.

Anodizing produces a uniform, continuous, highly ordered network of individual cells comprising a layer whose thickness and cell dimensions, and ultimately engineering properties, depend on the electrochemical parameters of the anodizing process. This article discusses the nucleation and growth of anodic aluminum oxide and the important characteristics of the finished porous anodic aluminum oxide. In industry, anodic oxides and the anodizing processes have been categorized into types that exhibit specific properties to suit specific applications. The article reviews the two most basic types of oxides, namely, barrier-layer anodic oxides and porous anodic oxides. It concludes with a description of postanodizing processes, such as dyeing and sealing.

This article is a brief account of low-energy ion-scattering spectroscopy (LEIS) for determining the atomic structure of solid surfaces. It begins with a description of the general principles of LEIS. This is followed by a section providing information on the equipment used for LEIS. Various steps involved in the sample preparation, calibration, and data analysis are then discussed. The article concludes with a section on the applications and interpretation of LEIS in material analysis, including discussion on surface structural analysis, layer-by-layer (Frank-van der Merwe) growth, and low-energy atom-scattering spectroscopy.

This article focuses on different thin-film deposition techniques used to make superconducting films and discusses the properties and advantages of high-critical-temperature and low-critical-temperature materials in a number of applications, including signal processing and analog electronic devices. The article gives a brief introduction on superconducting materials, substrates and buffer layers and discusses the major deposition techniques such as, electron-beam co-evaporation, sputtering from either a composite target or multiple sources and laser ablation. The article also describes the in-situ film growth techniques for producing atomic oxygen by radio frequency excitation or microwave discharge or with ozone.

The nitriding process typically involves the introduction of nitrogen into the surface-adjacent zone of a component, usually at a temperature between 500 and 580 deg C. This article provides an overview of the essential aspects of the thermodynamics and kinetics of nitriding and nitrocarburizing of iron-base materials with gaseous processes. It describes nitriding potentials and the Lehrer diagram, carburizing potentials, controlled nitriding and nitrocarburizing, and the microstructural evolution of the compound layer and the diffusion zone.

This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.

This article examines the characteristics and behavior of scale produced by various types of oxidation. The basic models, concepts, processes, and open questions for high-temperature gaseous corrosion are presented. The article describes the development of geometrically induced growth stresses, transformation stresses, and thermal stresses in oxide scales. It discusses the ways in which stresses can be relieved. The article provides information on catastrophic oxidation, internal oxidation, sulfidation, alloy oxidation, selective oxidation, and concurrent oxidation. It illustrates the relationships between scale morphologies on binary alloys and concludes with a discussion on metal dusting and chlorine corrosion.

This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition, and postdeposition changes. It also discusses the effects and causes of growth-related properties of films deposited by physical vapor deposition processes, including residual film stress, density, and adhesion.