This article is a detailed account of optical emission spectroscopy (OES) for elemental analysis. It begins with a discussion on the historical background of OES and development trends in OES methods. This is followed by a description of the general principles and optical systems of OES, along with various types of emission sources commonly used for OES. Some of the processes involved in calibration and quantification of OES for direct solids analysis by the ratio method are then described. The article ends with a discussion on the applications of each type of emission sources.

This article begins with an overview of the fundamentals of adhesive technology, including functions, limitations, adhesive joint types, and the key factors in the selection of adhesives, including application, type of joint, process limitation, mechanical requirement, and service conditions. It then focuses on the characteristics, types, and properties of the five groups of adhesives, such as structural, hot melt, pressure sensitive, water based, ultraviolet, and electron beam cured adhesives. The article also discusses the functions and applications of adhesive modifiers, including fillers, adhesion promoters, tackifiers, and tougheners. It gives a short note on functions of primers and primerless bonding. Applications of adhesives in automotive, aerospace, electronics, electrical, medical, sports, and construction sectors are also described. Finally, the article describes the steps in adhesive bonding, including storage and handling of adhesives, bonding preparation, adhesive application, tooling, and curing.

Ceramic materials serve important insulative, capacitive, conductive, resistive, sensor, electrooptic, and magnetic functions in a wide variety of electrical and electronic circuitry. This article focuses on various applications of advanced ceramics in both electric power and electronics industry, namely, dielectric, piezoelectric, ferroelectric, sensing, magnetic and superconducting devices.