Dealloying is a corrosion process in which one or more elements are selectively dissolved, leaving behind a porous residue of the remaining elements. This article describes the dealloying in various systems, namely, dezincification, graphitic corrosion, dealuminification, and noble metal alloys dealloying. The current-potential behavior of a binary alloy undergoing selective dissolution is reviewed. The article highlights the four mechanisms required for the formation of porous metals: ionization-redeposition, surface diffusion, volume diffusion, and percolation model of selective dissolution.

This article begins with a list of the factors that influence the properties of physical vapor deposited films. It describes the steps involved in ion plating, namely, surface preparation, nucleation, interface formation, and film growth. The article discusses the factors influencing the properties of ion-plated films. The sources of potential applied on substrate surface, bombarding species, and depositing species are addressed. The article also provides information on the parameters that influence bombardment. It concludes with a discussion on the advantages, limitations, and applications of ion plating.

This article is intended to provide the reader with a good understanding of the underlying science, technology, and the most common applications of focused ion beam (FIB) instruments. It begins with a survey of the various types of FIB instruments and their configurations, discusses the essential components, and explains their function only to the extent that it helps the operator obtain the desired results. An explanation of how the components of ion optical column shape and steer the ion beam to the desired target locations is then provided. The article also reviews the many diverse accessories and options that enable the instrument to realize its full potential across all of the varied applications. This is followed by a detailed analysis of the physical processes associated with the ion beam interacting with the sample. Finally, a complete survey of the most prominent FIB applications is presented.

Sputtering is a nonthermal vaporization process in which the surface atoms are physically ejected from a surface by momentum transfer from an energetic bombarding species of atomic/molecular size. It uses a glow discharge or an ion beam to generate a flux of ions incident on the target surface. This article provides an overview of the advantages and limitations of sputter deposition. It focuses on the most common sputtering techniques, namely, diode sputtering, radio-frequency sputtering, triode sputtering, magnetron sputtering, and unbalanced magnetron sputtering. The article discusses the fundamentals of plasma formation and the interactions on the target surface. A comparison of reactive and nonreactive sputtering is also provided. The article concludes with a discussion on the several methods of process control and the applications of sputtered films.

This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition, and postdeposition changes. It also discusses the effects and causes of growth-related properties of films deposited by physical vapor deposition processes, including residual film stress, density, and adhesion.

This article introduces thermal spray coatings and describes the various types of coating processes and coating devices, including the flame spray, electric-arc spray, plasma spray, transferred plasma arc, high-velocity oxyfuel, and detonation gun. It provides information on the surface preparation methods and finishing treatments of coated parts. The article also explains the tests to evaluate the coating quality and the effects of coating structures and mechanical properties on coated parts. It concludes with a discussion on the uses of thermal spray coatings.

This article provides an overview of surface-texturing techniques. It describes the texturing parameters, namely, shape, depth, and width of the textured pattern, its aspect ratio (depth over width), texture area density, and orientation. The article explains the effect of these parameters on tribological behavior of textured surfaces. It provides information on various modeling approaches for surface texture. The article also discusses the beneficial effect of surface texturing.

This article addresses the forms of corrosion that contribute directly to the failure of metal parts or that render them susceptible to failure by some other mechanism. It describes the mechanisms of corrosive attack for specific forms of corrosion such as galvanic corrosion, uniform corrosion, pitting and crevice corrosion, intergranular corrosion, and velocity-affected corrosion. The article contains a table that lists combinations of alloys and environments subjected to selective leaching and the elements removed by leaching.

Corrosion is the electrochemical reaction of a material and its environment. This article addresses those forms of corrosion that contribute directly to the failure of metal parts or that render them susceptible to failure by some other mechanism. Various forms of corrosion covered are galvanic corrosion, uniform corrosion, pitting, crevice corrosion, intergranular corrosion, selective leaching, and velocity-affected corrosion. In particular, mechanisms of corrosive attack for specific forms of corrosion, as well as evaluation and factors contributing to these forms, are described. These reviews of corrosion forms and mechanisms are intended to assist the reader in developing an understanding of the underlying principles of corrosion; acquiring such an understanding is the first step in recognizing and analyzing corrosion-related failures and in formulating preventive measures.