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ionization-redeposition

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Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003620
EISBN: 978-1-62708-182-5
..., and noble metal alloys dealloying. The current-potential behavior of a binary alloy undergoing selective dissolution is reviewed. The article highlights the four mechanisms required for the formation of porous metals: ionization-redeposition, surface diffusion, volume diffusion, and percolation model...
Book Chapter

By Donald M. Mattox
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001289
EISBN: 978-1-62708-170-2
... with the depositing material to form a compound film material. In some cases, such as when using low-voltage, high-current electron-beam evaporation or arc vaporization, an appreciable portion of the vaporized source material can be ionized to allow bombardment by “film ions.” Often the term ion plating...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006677
EISBN: 978-1-62708-213-6
... on an aluminum alloy showing key geometric features, including the cross-sectional face, redeposition trench, fiducial marks, and protective pad on the top surface. In (b), a tilted X - Y face is imaged, and the Z -direction is orthogonal to that face. The cross-sectional face has a 120 μm width. Courtesy...
Book Chapter

By S.L. Rohde
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001288
EISBN: 978-1-62708-170-2
..., and occasionally clusters of atoms, to be knocked free from the target surface by impact transfer, or sputtering. Sputtering is used in two principal applications: sputter etching, in which the primary objective is removal of material from the target surface ( Ref 2 ); and sputter deposition, in which redeposition...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001286
EISBN: 978-1-62708-170-2
... that it releases will be greater than thermal. If the depositing species is excited or ionized, it also releases the excitation energy or the ionization energy. In these situations the energy released also includes excess kinetic energy, excitation energy (if an excited species), or ionization energy...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.9781627081702
EISBN: 978-1-62708-170-2
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.9781627082136
EISBN: 978-1-62708-213-6
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001282
EISBN: 978-1-62708-170-2
... a tungsten cathode and a water-cooled copper anode. An electric arc is initiated between the two electrodes using a high-frequency discharge and then sustained using dc power. The arc ionizes the gas, creating a high-pressure gas plasma. The resulting increase in gas temperature, which may exceed 30,000 °C...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006365
EISBN: 978-1-62708-192-4
...-controlled surface characteristics. However, it may result in the creation of disadvantageous burrs or bulges of melted and redeposited material around the dimples, requiring additional polishing of the surface. The easiest way to texture a surface is to simply make it rougher and then remove...
Book Chapter

Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003548
EISBN: 978-1-62708-180-1
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006783
EISBN: 978-1-62708-295-2
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.9781627081993
EISBN: 978-1-62708-199-3