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ionic bond
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Published: 30 September 2015
Image
in Introduction to the Mechanical Behavior of Nonmetallic Materials
> Mechanical Testing and Evaluation
Published: 01 January 2000
Fig. 2 Schematic representation of ionically bonded NaCl. Note that this structure consists of Na + and Cl − ions sitting on interpenetrating fcc Bravais lattices.
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Book Chapter
Book: Corrosion: Materials
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0006545
EISBN: 978-1-62708-183-2
... bonding. This type of atomic bonding is in contrast to ionic bonding and to covalent bonding. In ionic bonding, transfer of valence (outer shell) electrons between dissimilar atoms produces stable outer shells in each and results in positive and negative ions that are mutually attracted by coulombic...
Abstract
This article provides basic information on the chemical elements and their arrangement into a periodic table based on recurring similarities in the fundamental nature of the elements. These elements follow a periodic pattern related to the electron configuration that allows them to be arranged into the convenient periodic table.
Book Chapter
Series: ASM Handbook
Volume: 22A
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.hb.v22a.a0005457
EISBN: 978-1-62708-196-2
... electrons from the outer shells of its atoms, with the resulting positive ions held together in a unique crystal structure by the cloud of these free electrons in a mechanism that has been called metallic bonding. This type of atomic bonding is in contrast to ionic bonding and to covalent bonding. In ionic...
Series: ASM Handbook
Volume: 5B
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v05b.a0006005
EISBN: 978-1-62708-172-6
... Nickelous (2), nickelic (4) 2 or 6 S … 3 or 5 N … P … 2, 3, or 6 Cr Chromous (2), chromic (3) 2, 4, or 7 Mn Manganous (2) Atoms join together in the following manners: covalent bonding, ionic bonding, and polar bonding. Covalent Bonding Covalent bonding is the sharing...
Series: ASM Handbook
Volume: 8
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.hb.v08.a0003255
EISBN: 978-1-62708-176-4
...) bonds. Primary bonds are usually more than an order of magnitude stronger than secondary bonds. As a result, ceramics and glasses , which have strong ionic-covalent chemical bonds, are very strong and stiff (i.e., they have large elastic moduli). They are also resistant to high temperatures...
Abstract
This article reviews the fundamental relationships between microstructure and mechanical properties for major classes of nonmetallic engineering materials: metals, ceramics and glasses, intermetallic compounds, polymers, and composites. It details the structures of inorganic crystalline solids, inorganic noncrystalline solids, and polymers. The article describes the various strengthening mechanisms of crystalline solids, namely, work hardening, solid-solution hardening, particle/precipitation hardening, and grain size hardening. Deformation and strengthening of composite materials, polymers, and glasses are reviewed. The article concludes with information on the two important aspects of the mechanical behavior of any class of engineering material: fatigue response and fracture resistance.
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003711
EISBN: 978-1-62708-182-5
... . Ceramics have a large component of ionic bonds holding atoms together. The basic structural units of ceramics are molecules, which are rigid and can vary from 2 to 10 atoms in size. Organics have a large component of localized covalent bonds between atoms, and their basic structural units, again molecules...
Abstract
This article presents an overview of the science and engineering of materials along with suitable definitions, descriptions, and examples for better understanding for corrosionists with limited field knowledge. It begins with a detailed description of various categories of engineering materials and moves into the discussion of physical properties of materials, such as the phases, strength, conductivity, and wear. The article describes the methods used in the fabrication of engineering materials and summarizes the materials and their properties in a tabular form. The article concludes with information on material design, materials applications, and materials failure analysis.
Image
Published: 30 November 2018
Fig. 11 Schematic of development of ionic nature of the inside pore surface. Following anodizing, the ionic sites remain, providing bonding sites for dyeing and adhesives as well as a reactive surface for sealing. Source: Ref 12
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Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003083
EISBN: 978-1-62708-199-3
... in a unique crystal structure by the cloud of these free electrons in a mechanism that has been called metallic bonding. This type of atomic bonding is in contrast to ionic bonding and to covalent bonding. In ionic bonding, transfer of valence (outer shell) electrons between dissimilar atoms produces...
Abstract
Chemical elements are the basic chemical substances; that is, they cannot be decomposed by chemical change or made by chemical union. These elements follow a periodic pattern related to the atomic mass of each that allows them to be arranged into a convenient table. This article includes a series of tables: the first gives the names and symbols of the elements in alphabetical order and the second lists the elements in order by atomic number and give the atomic weight for each. The periodic table of the elements also is included in the article.
Image
Published: 01 January 2002
Fig. 23 General shifts in fracture mechanism fields for metallic and nonmetallic (ionic or covalent) bonding. (a) fcc metals, cleavage at low temperatures does not occur as in the bcc. (b) Refractory bcc metals. (c) Alkali halides. (d) Refractory oxides. Source: Ref 39
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Image
Published: 12 September 2022
Fig. 5 Schematic representation of process flow involved in dip pen nanolithography. (a) Regular steps. (b) Steps in which there is a weak bonding between the tip and biomaterial. (c) Steps involved in coating ionic molecules. AFM, atomic force microscope; SAM, self-assembled monolayer
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Image
Published: 15 January 2021
Fig. 24 General shifts in fracture mechanism fields for metallic and nonmetallic (ionic or covalent) bonding. (a) Face-centered cubic metals; cleavage at low temperatures does not occur as in the body-centered cubic (bcc). (b) Refractory bcc metals. (c) Alkali halides. (d) Refractory oxides
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Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004172
EISBN: 978-1-62708-184-9
..., metal lines provide local interconnection to join a collection of circuit elements globally to various areas of the chips, and they also provide input/output signals. Aluminum is currently the most commonly used metal for integrated circuits (metallization and bonding pads), but copper is increasingly...
Abstract
In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article focuses on the key factors contributing to corrosion of electronic components, namely, chemicals (salts containing halides, sulfides, acids, and alkalis), temperature, air (polluted air), moisture, contact between dissimilar metals in a wet condition, applied potential differences, and stress. It discusses the chip corrosion and oxidation of tin and tin-lead alloys (solders) in SIC. The article also addresses the corrosion of the device terminations resulting in lead (termination) tarnishing that are caused by various factors, including galvanic corrosion, chemical residues, base metal migration and plating additives.
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002460
EISBN: 978-1-62708-194-8
... and alloys. Ceramics Chemical bonding in ceramics is different than in metals. When elements from the left side of the periodic table (i.e., electropositive elements such as sodium) combine with elements from the right side of the table (electronegative elements such as chlorine), an ionic bond...
Abstract
This article focuses on the relationships among material properties and material structure. It summarizes the fundamental characteristics of metals, ceramics, and polymers. The article provides information on the crystal structure, the atomic coordination, and crystalline defects. It discusses the relevance of the properties to design. The article describes the common means for increasing low-temperature strength and presents an example that shows structure-property relationships in nickel-base superalloys for high-temperature applications. The relationships of microstructure with low-temperature fracture, high-temperature fracture, and fatigue failure are also discussed.
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003589
EISBN: 978-1-62708-182-5
... that provides the additional electrons needed for ionic bonding and electrical neutrality by donating electrons from the 3 d subshells of a fraction of the nickel ions (i.e., forms electron holes as electronic defects). The reaction of defects in NiO can be written as 1 2 O 2 (g) = O O + V Ni...
Abstract
This article describes the Schottky defect and the Frenkel defect in oxides. It provides information on the p-type metal-deficit oxides and n-type semiconductor oxides. The article discusses diffusion mechanisms and laws of diffusion proposed by Fick. It explains the oxide texture of amorphous and epitaxy oxide layers and presents equations for various oxidation reaction rates. The article reviews different theories to describe the oxidation mechanism. These include the Cabrera-Mott, Hauffe-IIschner, Grimley-Trapnell, Uhlig, and Wagner theories.
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002452
EISBN: 978-1-62708-194-8
... stiffness, and the density of bonds per unit area. An interatomic bond is like a spring: it has a spring constant, S (units: N/m). Young's modulus, E , is roughly (Eq 1) E = S r o where r o is the “atom size” ( r o 3 is the mean atomic or ionic volume). The wide range...
Abstract
Properties of an engineering material have a characteristic range of values that are conveniently displayed on materials selection charts. This article describes the plotting of data on these charts. It discusses the features of various types of material property charts, namely, modulus-density, strength-density, fracture toughness-density, modulus-strength, specific stiffness-specific strength, fracture toughness-modulus, fracture toughness-strength, loss coefficient-modulus, thermal conductivity-thermal diffusivity, thermal expansion-thermal conductivity, thermal expansion-modulus, and normalized strength-thermal expansion charts. The article examines the use of material property charts in presenting information in a compact and easily accessible manner.
Book: Corrosion: Materials
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003844
EISBN: 978-1-62708-183-2
... of the bonding that takes place. Chemical bonding generally consists of the transfer of electrons from a donor to an acceptor atom (ionic bonding), a sharing of electrons between two atoms (covalent bonding), or a continuum between transfer and sharing (coordinate covalent bonding). Ionic bonding occurs...
Abstract
Paints and protective coatings are the most common means of protecting materials from deterioration. This article focuses on coating degradation that results from the environmental interaction with the coatings. The major environmental influences of the degradation include energy (solar radiation, heat and temperature variation, and nuclear radiation), permeation (moisture, solvent retention, chemical, and oxygen), stress (drying and curing, vibration, and impact and abrasion), and biological influences (microbiological and macrobiological).
Series: ASM Handbook
Volume: 11B
Publisher: ASM International
Published: 15 May 2022
DOI: 10.31399/asm.hb.v11B.a0006915
EISBN: 978-1-62708-395-9
...-shear processes produce little orientation. Intermolecular Attractions Intermolecular attractions include London dispersion forces, dipole forces, hydrogen bonding, ionic bonding, and cross linking. London Dispersion Forces London dispersion forces are the weakest of the secondary bonds...
Abstract
This article provides practical information and data on property development in engineering plastics. It discusses the effects of composition on submolecular and higher-order structure and the influence of plasticizers, additives, and blowing agents. It examines stress-strain curves corresponding to soft-and-weak, soft-and-tough, hard-and-brittle, and hard-and-tough plastics and temperature-modulus plots representative of polymers with different degrees of crystallinity, cross-linking, and polarity. It explains how viscosity varies with shear rate in polymer melts and how processes align with various regions of the viscosity curve. It discusses the concept of shear sensitivity, the nature of viscoelastic properties, and the electrical, chemical, and optical properties of different plastics. It also reviews plastic processing operations, including extrusion, injection molding, and thermoforming, and addresses related considerations such as melt viscosity and melt strength, crystallization, orientation, die swell, melt fracture, shrinkage, molded-in stress, and polymer degradation.
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002464
EISBN: 978-1-62708-194-8
... Attractions Secondary intermolecular attractive forces that promote crystallinity include London dispersion forces, dipole forces (either induced or permanent), hydrogen bonding, and ionic bonding. These secondary bonds do not actually connect two atoms through equally shared electrons the way...
Abstract
This article discusses the most fundamental building-block level, atomic level, molecular considerations, intermolecular structures, and supermolecular issues. It contains a table that shows the structures and lists the properties of selected commodity and engineering plastics. The article describes the effects of structure on thermal and mechanical properties. It reviews the chemical, optical, and electrical properties of engineering plastics and commodity plastics. An explanation of important physical properties, many of which are unique to polymers, is also included. The factors that must be considered when processing engineering thermoplastics are discussed. These include melt viscosity and melt strength; crystallization; orientation, die swell, shrinkage, and molded-in stress; polymer degradation; and polymer blends.
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006366
EISBN: 978-1-62708-192-4
... Abstract This article introduces the structure, tribological properties, advantages, and applications of ionic liquids (ILs) as lubricating media. It discusses the mechanisms of IL lubrication for different contacts. The advances in studies focusing on tribological properties of a wide range...
Abstract
This article introduces the structure, tribological properties, advantages, and applications of ionic liquids (ILs) as lubricating media. It discusses the mechanisms of IL lubrication for different contacts. The advances in studies focusing on tribological properties of a wide range of ILs are reviewed. The article concludes with the challenges that limit the applications of ILs in tribology engineering.