Low-energy ion-scattering spectroscopy (LEISS) is used extensively to analyze solid surfaces. The LEISS process relies on binary elastic collisions between an incident ion beam and the atoms in a sample to obtain information on the surface atoms. The velocity of the scattered ions is used to determine the mass of the atoms that are struck. This article introduces LEISS and its principles. It describes the use of LEISS spectra in qualitative and quantitative analyses, and reviews the instrumentation and applications of LEISS.

In secondary ion mass spectroscopy (SIMS), an energetic beam of focused ions is directed at the sample surface in a high or ultrahigh vacuum (UHV) environment. The transfer of momentum from the impinging primary ions to the sample surface causes sputtering of surface atoms and molecules. This article focuses on the principles and applications of high sputter rate dynamic SIMS for depth profiling and bulk impurity analysis. It provides information on broad-beam instruments, ion microprobes, and ion microscopes, detailing their system components with illustrations. The article graphically illustrates the SIMS spectra and depth profiles of various materials. The quantitative analysis of ion-implantation profiles, instrumental features required for secondary ion imaging, the analysis of nonmetallic samples, detection sensitivity, and the applications of SIMS are also discussed.

Field ion microscopy (FIM) can be used to study the three-dimensional structure of materials, such as metals and semiconductors, because successive atom layers can be ionized and removed from the surface by field evaporation. The ions removed from the surface by field evaporation can be analyzed chemically by coupling to the microscope a time-of-flight mass spectrometer of single-particle sensitivity, known as the atom probe (AP). This article describes the principles, sample preparation, and quantitative analysis of FIM. It also provides information on the principles, instrument design and operation, mass spectra and their interpretation, and applications of AP microanalysis.

Ion chromatography (IC) is an analytical technique that uses columns packed with ion exchange resins to separate ions in aqueous solutions and dynamically elute them to a detector. This article provides information on the different modes of detection, namely, eluent-suppressed conductivity detection, single-column ion chromatography with conductivity detection, ion chromatography with spectrophotometric detection, and amperometric electrochemical detection. It describes the modes of separation techniques in IC and reversed-phase IC. The article discusses the detection capabilities of IC, the procedures for preparing solid and liquid samples, as well as the applications of IC.

Ion-beam-assisted deposition (IBAD) refers to the process wherein evaporated atoms produced by physical vapor deposition are simultaneously struck by an independently generated flux of ions. This article discusses the energy utilization of this process. It describes the physical and chemical processes occurring at the film-vacuum interface during IBAD and dual-ion-beam sputtering with illustrations. The article also reviews the methods used for large-area, high-volume implementation of IBAD and the modes of film formation for IBAD. It contains a table that presents information on deposition and synthesis of inorganic compounds by IBAD and concludes with a discussion on the improved coating properties, advantages, limitations, and applications of IBAD.

Ion implantation involves the bombardment of a solid material with medium-to-high-energy ionized atoms and offers the ability to alloy virtually any elemental species into the near-surface region of any substrate. This article describes the fundamentals of the ion implantation process and discusses the advantages, limitations, and applications of ion implantation. It also reviews a typical medium current semiconductor implanter adapted for implantation of metals with the aid of illustrations.

This article begins with a list of the factors that influence the properties of physical vapor deposited films. It describes the steps involved in ion plating, namely, surface preparation, nucleation, interface formation, and film growth. The article discusses the factors influencing the properties of ion-plated films. The sources of potential applied on substrate surface, bombarding species, and depositing species are addressed. The article also provides information on the parameters that influence bombardment. It concludes with a discussion on the advantages, limitations, and applications of ion plating.

This article is a brief account of low-energy ion-scattering spectroscopy (LEIS) for determining the atomic structure of solid surfaces. It begins with a description of the general principles of LEIS. This is followed by a section providing information on the equipment used for LEIS. Various steps involved in the sample preparation, calibration, and data analysis are then discussed. The article concludes with a section on the applications and interpretation of LEIS in material analysis, including discussion on surface structural analysis, layer-by-layer (Frank-van der Merwe) growth, and low-energy atom-scattering spectroscopy.

This article presents a detailed account of ion chromatography (IC). It begins by describing the principles of common separation modes in IC. This is followed by a section on the different modes of detection, namely suppressed conductivity detection, nonsuppressed conductivity detection, spectrophotometric detection, and electrochemical detection. Various separation modes in IC are then described. The article further provides information on various eluents species, analyte range, and sample preparation techniques in IC. It ends by providing information on the instrumentation and applications and future directions of IC.

This article is intended to provide the reader with a good understanding of the underlying science, technology, and the most common applications of focused ion beam (FIB) instruments. It begins with a survey of the various types of FIB instruments and their configurations, discusses the essential components, and explains their function only to the extent that it helps the operator obtain the desired results. An explanation of how the components of ion optical column shape and steer the ion beam to the desired target locations is then provided. The article also reviews the many diverse accessories and options that enable the instrument to realize its full potential across all of the varied applications. This is followed by a detailed analysis of the physical processes associated with the ion beam interacting with the sample. Finally, a complete survey of the most prominent FIB applications is presented.

This article focuses on the principles and applications of high-sputter-rate dynamic secondary ion mass spectroscopy (SIMS) for depth profiling and bulk impurity analysis. It begins with an overview of various factors pertinent to sputtering. This is followed by a discussion on the effects of ion implantation and electronic excitation on the charge of the sputtered species. The design and operation of the various instrumental components of SIMS is then reviewed. Details on a depth-profiling analysis of SIMS, the quantitative analysis of SIMS data, and the static mode of operation of time-of-flight SIMS are covered. Instrumental features required for secondary ion imaging are presented and the differences between quadrupole and high-resolution magnetic mass filters are described. The article also reviews the optimum method for analysis of nonmetallic samples and high detection sensitivity of SIMS. It ends with a discussion on a variety of examples of SIMS applications.

Plasma (ion) nitriding is a method of surface hardening using glow-discharge technology to introduce nascent (elemental) nitrogen to the surface of a metal part for subsequent diffusion into the material. This article describes the procedures and applications of plasma nitriding methods of steel. These methods include direct-current plasma nitriding, pulsed-current plasma nitriding, and active-screen plasma nitriding. The article reviews cold-walled and hot-walled furnaces used for plasma nitriding. It provides information on the importance of controlling three process parameters: atmosphere, pressure, and part temperature. The article includes a discussion on the influence of nitrogen concentration on case structure formation on nitrided steel, and explains the significance of microstructure, hardness, and fatigue strength on nitrided case. It also discusses processing, laboratory studies, and applications of nitrocarburizing of steel.