Search Results for interposer

Rolling-element bearings use rolling elements interposed between two raceways, and relative motion is permitted by the rotation of these elements. This article presents an overview of bearing materials, bearing-load ratings, and an examination of failed bearings. Rolling-element bearings are designed on the principle of rolling contact rather than sliding contact; frictional effects, although low, are not negligible, and lubrication is essential. The article lists the typical characteristics and causes of several types of failures. It describes failure by wear, failure by fretting, failure by corrosion, failure by plastic flow, failure by rolling-contact fatigue, and failure by damage. The article discusses the effects of fabrication practices, heat treatment and hardness of bearing components, and lubrication of rolling-element bearings with a few examples.

Total joint replacement in orthopedic surgery can be achieved by excision, interposition, and replacement arthroplasty. This article details the most common materials used in total replacement synovial joints: metals, ceramics, and ultrahigh molecular weight polyethylene (UHMWPE). The principal physical properties and tribological characteristics of these materials are summarized. The article discusses pin-on-disk experiments and pin-on-plate experiments for determining friction and wear characteristics. It explains the use of various types of joint simulators, such as hip joint simulators and knee joint simulators, to evaluate the performance of engineering tribological components in machine simulators. The article concludes with a section on the in vivo assessment of total joint replacement performance.

Welding and joining processes are essential for the development of virtually every manufactured product. This article discusses the fundamentals of fusion welding processes, with an emphasis on the underlying scientific principles. It reviews the role of energy-source intensity and the width of the heat-affected zone in fusion welding processes. The article contains figures from which the properties of any heat source can be estimated readily.

The article discusses the fundamentals of fusion welding processes with an emphasis on the underlying scientific principles. It describes how surface temperature varies on steel with surface power densities that range from 400 to 8000 W/cm2. The article illustrates the spectrum of practical heat intensities used for fusion welding. It contains tables that present information on the thermal diffusivities of common elements and alloys from 20 to 100 °C.

X-ray topography is a technique that comprises topography and x-ray diffraction. This article provides a description of the kinematical theory and the dynamical theory of diffraction. It provides useful information on the configurations of reflection and transmission topography. The article explains various topographic methods, namely, divergent beam method, polycrystal rocking curve analysis, line broadening analysis, microbeam method, and polycrystal scattering topography, as well as their instrumentation. It also describes the applications of x-ray topography.

The purpose of fractography is to analyze fracture features and attempt to relate the topography of the fracture surface to the causes and/or basic mechanisms of fracture. This article reviews the historical development of fractography, from the early studies of fracture appearance dating back to the sixteenth century to the state-of-the-art work in electron fractography and quantitative fractography. It also describes the applications and limitations of scanning electron microscope and transmission electron microscope.

This article reviews the historical development of fractography, from the early studies of fracture appearance dating back to the sixteenth century, and including the development of microfractography in the middle of the 20th century, to the current state-of-the-art work in electron fractography and quantitative fractography.

In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article focuses on the key factors contributing to corrosion of electronic components, namely, chemicals (salts containing halides, sulfides, acids, and alkalis), temperature, air (polluted air), moisture, contact between dissimilar metals in a wet condition, applied potential differences, and stress. It discusses the chip corrosion and oxidation of tin and tin-lead alloys (solders) in SIC. The article also addresses the corrosion of the device terminations resulting in lead (termination) tarnishing that are caused by various factors, including galvanic corrosion, chemical residues, base metal migration and plating additives.

Both hot and cold forgings are batch-type processes in which steady-state conditions are never fully achieved and the initial lubricant supply must perform adequately for the duration of the operation. This article discusses methods to measure lubricant effectiveness and wear. It describes the mixed-film lubrication and solid film lubrication in cold forging, as well as solid film lubrication and thick film lubrication in hot forging. The article reviews the factors affecting abrasive wear: die hardness, workpiece temperature, and lubrication and die temperature. It concludes with information on ways to improve resistance to abrasive wear.

This article provides an overview of the interfacial interactions with a lubricant film between a die and a metal, lubricant mechanisms, chemistry, qualification testing, application methods, and property test methods. It focuses on sheet metal-forming operations, although the discussions are relevant to metal-forming operations in general. The article also deals with lubricant selection as influenced by the metal to be formed and particular sheet-metal forming operations. The article also discusses some aspects of microbiology and toxicity in lubricants.

This article provides information on metals that can be cast in permanent molds. It describes the advantages, disadvantages, applications, and design of permanent castings. Following a discussion on the factors considered in mold design and material selection, the article details the application of mold coatings and examines the effects of major processing variables on mold life. The variables that determine mold temperature and measures for controlling it are reviewed, and the effects of short-term and long-term variables on the dimensional accuracy of permanent mold castings are explained. The article concludes with a discussion on the factors influencing the surface finish on permanent mold castings.

This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform corrosion, galvanic corrosion, pitting corrosion, creep corrosion, dendrite growth, fretting, stress-corrosion cracking, and whisker growth. The article presents effective measures for minimizing the moisture retention in hermetic packages and/or moisture ingress in plastic packages. It concludes with information corrosion tests.

This article discusses two basic forms of extrusion: cold and hot. It provides information on three types of extrusion processes, namely, direct extrusion, reverse extrusion, and hydrostatic extrusion. The article also discusses the mechanics, analysis, tooling and die design of extrusion as well as thermodynamics. The finite-element method suitable for simulation of metal forming processes is explained. The article examines the extrusion defects that are divided into three different categories including surface, subsurface, and internal type. It includes information on friction and lubrication modeling of extrusion processes. The article also discusses the fundamentals of extrusion technology of titanium alloys and aluminum. It concludes with information on two forms of wear in extrusion, namely, adhesive and abrasive wear.

Wear is the damage to a solid surface as a result of relative motion between it and another surface or substance. This article discusses the four general ways by which a material can wear, namely, adhesive wear, abrasive wear, fatigue or fatigue-like wear, and corrosive wear. It tabulates the operational classification of wear situations and describes the relationship between wear or wear rate and design parameters. The article reviews the effect of lubrication on wear behavior and the types of lubricants. It illustrates some fundamental criteria that can be applied in the selection of a material for wear applications. The article explains four elements of wear design, such as system analysis, modeling, data gathering, and verification. It concludes with a discussion on the design approach for low-wear computer peripherals.

This article is a compilation of definitions of terms related to metallography and microstructures.

Ultrasonic inspection is a family of nondestructive methods in which beams of high-frequency mechanical waves are introduced into materials, using transducers, for the detection and characterization of both surface and subsurface anomalies and flaws in the material. This article describes the basic equipment in ultrasonic inspection systems, and lists the advantages and disadvantages of these systems. It discusses the applications of ultrasonic inspection and also the general characteristics of ultrasonic waves in terms of wave propagation, longitudinal waves, transverse waves, surface waves, and lamb waves. The article reviews the major variables in ultrasonic inspection, including frequency, acoustic impedance, angle of incidence, and beam intensity. It discusses the attenuation of ultrasonic beams and provides information on the pulse-echo and transmission methods for implementing ultrasonic inspection.

Field ion microscopy (FIM) can be used to study the three-dimensional structure of materials, such as metals and semiconductors, because successive atom layers can be ionized and removed from the surface by field evaporation. The ions removed from the surface by field evaporation can be analyzed chemically by coupling to the microscope a time-of-flight mass spectrometer of single-particle sensitivity, known as the atom probe (AP). This article describes the principles, sample preparation, and quantitative analysis of FIM. It also provides information on the principles, instrument design and operation, mass spectra and their interpretation, and applications of AP microanalysis.