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intermetallic gold compounds

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Series: ASM Handbook
Volume: 9
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.hb.v09.a0003776
EISBN: 978-1-62708-177-1
... Backscattered electron image of the AuAl 2 + 5 wt% Cr alloy. In the matrix (76.5Au-20.5Al-3Cr), the chromium has replaced some of the gold in the previous purple AuAl 2 phase. The secondary white phase appears to be a mixture of gold-rich intermetallic compounds (AuAl, Au 2 Al, Au 4 Al). A relatively large...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
...), AWS , 1991 14. Unsworth D. and Mackay C. , A Preliminary Report on Growth of Compound Layers on Various Metal Bases Plated with Tin and Its Alloys , Trans. Inst. Met. , Vol 51 , 1973 , p 85 15. Kay P. and Mackay C. , The Growth of Intermetallic Compounds...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004129
EISBN: 978-1-62708-184-9
... compared the fungus resistance of vinyl polymer insulating cable coverings ( Ref 4 ). A 1963 Bell Telephone Labs report described a procedure for reducing the embrittlement of gold-plated solder joint ( Ref 5 ). A gold-tin intermetallic compound was formed during soldering, and the thickness of the gold...
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003834
EISBN: 978-1-62708-183-2
... of the process and required equipment. Some of the properties that affect the bonding process include ductility, nature and stability of oxide films (for example, the ratio of hardness between the film and the metal itself), and the tendency to form intermetallic compounds. Because bonding processes commonly use...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001286
EISBN: 978-1-62708-170-2
... crystallographic orientation density film growth growth-related properties interface formation intermetallic materials lattice defects nucleation nuclei growth physical vapor deposition reactive deposition residual film stress surface area surface coverage transport vaporization voids...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001346
EISBN: 978-1-62708-173-3
... an angle, θ, of less than 90°, then the solder is said to wet the metal. If the angle is greater than 90°, the solder is nonwetting. This is one method used to qualitatively assess solderability. The formation of intermetallic compounds can affect Young's equation because it alters the value of γ sl...
Book Chapter

Series: ASM Handbook
Volume: 3
Publisher: ASM International
Published: 27 April 2016
DOI: 10.31399/asm.hb.v03.a0006229
EISBN: 978-1-62708-163-4
... intermetallic compounds, when, like Mg 2 Pb, they have a fixed simple ratio of the two kinds of atoms. Other intermediate phases exist over a range of compositions that are considered intermediate or secondary solid solutions. Intermediate phases can be classified based on their melting behavior, either...
Series: ASM Handbook
Volume: 9
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.hb.v09.a0003782
EISBN: 978-1-62708-177-1
...) Improves grain structure contrast under polarized lighting and prevents specimens for staining and oxidizing 2 110–115 V anodization layer (purple-blue color in zirconium) Reveals intermetallic compounds, inclusions, and lighter element contamination in zirconium (bright field) 3 180 V anodization...
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003831
EISBN: 978-1-62708-183-2
... Fig. 1 Nickel phosphide intermetallic in the braze joint under scanning electron microscopy. Original magnification 400×. Courtesy of HI TecMetal Group Fig. 2 UNS N06617 (Inconel 617) brazed with UNS N99620 (AMS 4777) under vacuum at 1038 °C (1900 °F). The structure shows borides...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001459
EISBN: 978-1-62708-173-3
... intermetallic compounds, which can severely impact the fluidity of the molten solder or reduce the ductility of the solidified joint. The ASTM designation for antimony levels in the solders are: Class A (alloys with tin content greater than 35 wt%), maximum of 0.12 wt%; Class B, 0.2 to 0.5 wt%; and Class C (tin...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003211
EISBN: 978-1-62708-199-3
... of the solder (the solubility limit of antimony in tin) in order to prevent the formation of tin-antimony intermetallic compounds, which can severely impact the fluidity of the molten solder or reduce the ductility of the solidified joint. Arsenic A progressive deterioration in the quality of the solder...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003211
EISBN: 978-1-62708-199-3
... to prevent the formation of tin-antimony intermetallic compounds, which can severely impact the fluidity of the molten solder or reduce the ductility of the solidified joint. A progressive deterioration in the quality of the solder is observed with increases in arsenic content. As little as 0.005...
Series: ASM Handbook
Volume: 4E
Publisher: ASM International
Published: 01 June 2016
DOI: 10.31399/asm.hb.v04e.a0006274
EISBN: 978-1-62708-169-6
... ( Ref 6 ). Precipitation Hardening of Al-Mg-Si and Al-Si-Mg Alloys Aluminum alloys with an appropriate ratio of silicon and magnesium are precipitation hardening, where the intermetallic compound Mg 2 Si provides the strengthening. Appreciable strengthening in these alloys occurs over an extended...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001492
EISBN: 978-1-62708-173-3
... is silver brazed to the copper tubing. Aluminum-silicon filler metals are unsuitable for brazing aluminum to uncoated titanium because of the formation of brittle intermetallic compounds (titanium-aluminum and titanium-silicon). Titanium can be hot dip coated with aluminum, however, and then brazed...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001275
EISBN: 978-1-62708-170-2
... supplied by chromate coatings. The article also discusses the development of replacement technologies in response to environmental constraints that have developed around the use of chromium-base compounds. chromate conversion coatings coating deposits coating performance environmental constraints...
Series: ASM Handbook Archive
Volume: 10
Publisher: ASM International
Published: 01 January 1986
DOI: 10.31399/asm.hb.v10.a0001768
EISBN: 978-1-62708-178-8
...). (b) The silicon (5 wt%) map shows the location of the silicate. (c) The iron (5 wt%) map reveals the metallic alloys. (d) The palladium (10 wt%) map indicates the intermetallic compound. The remaining titanate phases can be distinguished as pyrochlore by the uranium (10 wt%) map (e), hollandite...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001446
EISBN: 978-1-62708-173-3
... to 900 °C (1830 to 1650 °F). Many combinations have been studied within this category, but the most common one uses aluminum as one of the parent materials ( Ref 27 , 28 , 29 ). The diffusion welding of aluminum to copper and titanium results in the formation of intermetallic compounds...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001449
EISBN: 978-1-62708-173-3
... is particularly important when explosion welding dissimilar or metallurgically incompatible metals. Metallurgically incompatible combinations, such as titanium and steel, aluminum and steel, and zirconium and steel, will form brittle intermetallic compounds at the explosion weld interface if excessive energies...
Series: ASM Handbook
Volume: 3
Publisher: ASM International
Published: 27 April 2016
DOI: 10.31399/asm.hb.v03.a0006177
EISBN: 978-1-62708-163-4
... binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase. References References 1. Brewer L. and Lamoreaux R.H. , Molybdenum: Physico-Chemical Properties of Its Compounds and Alloys , Atom...
Series: ASM Handbook
Volume: 23
Publisher: ASM International
Published: 01 June 2012
DOI: 10.31399/asm.hb.v23.a0005658
EISBN: 978-1-62708-198-6
... application (as of 2010). The term Nitinol refers to the equiatomic, intermetallic nickel-titanium compound ( Fig. 1 ). (This article disregards Nitinol-60, a highly nickel-rich composition with scattered applications as corrosion-resistant tools but not exhibiting useful shape memory properties...