This article explains how to prepare precious metal test samples for metallographic examination. It discusses cutting, mounting, grinding, polishing, and etching and addresses some of the challenges of working with small, relatively soft specimens. It includes dozens of example micrographs, comparing and contrasting the microstructural features of gold, platinum, iridium, palladium, and ruthenium-base alloys. It examines pure gold, intermetallic gold compounds, gold and platinum jewelry alloys, platinum-containing shape memory alloys, and alloys consisting of platinum, aluminum, and copper.

This article provides a historical review of corrosion problems in military electronic equipment. It describes the importance of design for corrosion control of an electronic black box used to contain electrical equipment that provides various functions. The article illustrates corrosion control aspects, such as the position of printed circuit boards (PCBs) and proper location of connectors for insertion of the PCBs. It discusses various materials and alloys considered for connectors, PCB contacts, and circuits. The article concludes with a discussion on the effects of contaminants on the electronic black box.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

Solder cracking is one of the dominant failure modes of the electronic assembly system. Experience shows that solder joints can fail due to processing defects during solder joint formation or due to excessive loading in various applications. This article introduces major fractography techniques to demonstrate typical solder joint failure and background failure mechanisms. These techniques may be helpful to readers in recognizing failure modes and in preventing further failures during product development and process implementation.

This article describes the principal cladding processes and methods for calculating properties of clad metals. It reviews the designing processes of clad metals to achieve specific requirements. The article discusses six categories of clad metal systems designed for corrosion control: noble metal clad systems, corrosion barrier systems, sacrificial metal systems, transition metal systems, complex multilayer systems, and clad diffusion alloys.

This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition, and postdeposition changes. It also discusses the effects and causes of growth-related properties of films deposited by physical vapor deposition processes, including residual film stress, density, and adhesion.

Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis are also presented. The article introduces several frequently used methods for solder joint failure detection, prevention, and isolation (identification for the failed location).

In some phase diagrams, the appearance of several reactions is the result of the presence of intermediate phases. These are phases whose chemical compositions are intermediate between two pure metals, and whose crystalline structures are different from those of the pure metals. This article describes the order-disorder transformation that typically occurs on cooling from a disordered solid solution to an ordered phase. It provides a table that lists selected superlattice structures and alloy phases that order according to each superlattice. The article informs that spinodal decomposition has been particularly useful in the production of permanent magnet materials, because the morphologies favor high magnetic coercivities. It also describes the theory of spinodal decomposition with a simple binary phase diagram.

Soldering is defined as a joining process by which two substrates are bonded together using a filler metal with a liquidus temperature. This article provides an overview of fundamentals of soldering and presents guidelines for flux selection. Types of fluxes, including rosin-base fluxes, organic fluxes, inorganic fluxes, and synthetically activated fluxes, are reviewed. The article describes the joint design and precleaning and surface preparation for soldering. It addresses some general considerations in the soldering of electronic devices. Soldering process parameters, affecting wetting and spreading phenomena, such as temperature, time, vapor pressure, metallurgical and chemical nature of the surfaces, and surface geometry, are discussed. The article also describes the applications of furnace soldering, resistance soldering, infrared soldering, and ultrasonic soldering. It contains a table that lists tests commonly used to evaluate the solderability properties of selected soldered components.

Zirconium, hafnium, and their alloys are reactive metals used in a variety of nuclear and chemical processing applications. This article describes various specimen preparation procedures for these materials, including sectioning, mounting, grinding, polishing, and etching. It reviews some examples of the microstructure and examination for zircaloy alloys, hafnium, zirconium, and bimetallic forms.

The various methods of furnace, torch, induction, resistance, dip, and laser brazing are used to produce a wide range of highly reliable brazed assemblies. However, imperfections that can lead to braze failure may result if proper attention is not paid to the physical properties of the material, joint design, prebraze cleaning, brazing procedures, postbraze cleaning, and quality control. Factors that must be considered include brazeability of the base metals; joint design and fit-up; filler-metal selection; prebraze cleaning; brazing temperature, time, atmosphere, or flux; conditions of the faying surfaces; postbraze cleaning; and service conditions. This article focuses on the advantages, limitations, sources of failure, and anomalies resulting from the brazing process. It discusses the processes involved in the testing and inspection required of the braze joint or assembly.

Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most common impurity elements in tin-lead solders. It describes the various processes involved in the successful soldering of joints, including shaping the parts to fit closely together; cleaning and preparing the surfaces to be joined; applying a flux; assembling the parts; and applying the heat and solder.

Corrosion is often thought of as rusting, the process of deterioration undergone by a metal when it is exposed to air or water. This article provides the fundamentals of joints corrosion and primarily addresses the various forms of corrosion observed in brazed and soldered joints and their causes. It describes the role of proper brazing procedures in controlling corrosion. The article concludes with information on the corrosion resistance of various brazing alloy systems.

This article is a compilation of binary alloy phase diagrams for which manganese (Mn) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

This article reviews the corrosion behavior of intermetallics for the modeling of the corrosion processes and for devising a strategy to create corrosion protective systems through alloy and coating design. Thermodynamic principles in the context of high-temperature corrosion and information on oxidation; sulfidation; hot corrosion of NiAl-, FeAl-, and TiAl-based intermetallics; and silicides are included. The article explores the thermodynamic consideration, ordering influencing kinetics, stress-cracking corrosion, and hydrogen embrittlement of aqueous corrosion. It also explains the practical issues dealing with the corrosion problems.

This article characterizes the corrosion resistance of precious metals, namely, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold. It provides a discussion on the general fabricability; atomic, structural, physical, and mechanical properties; oxidation and corrosion resistance; and corrosion applications of these precious metals. The article also tabulates the corrosion rates of these precious metals in corrosive environment, namely, acids, salts, and halogens.

This article briefly describes the basic attributes of chromate conversion coatings and the processes for applying them. It provides information on the influence of substrate microstructure on the performance of coating deposits and on the mechanism of substrate protection supplied by chromate coatings. The article also discusses the development of replacement technologies in response to environmental constraints that have developed around the use of chromium-base compounds.