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Published: 31 October 2011
Fig. 10 Composition of intermetallic compounds in the interface layer. (a) SPCC-A1050 at 1.5 kW, 150 MPa (22 ksi). (b) SPCC- A5052 at 1.5 kW, 150 MPa (22 ksi) More
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Published: 30 August 2021
Fig. 14 Impact fracture energy of copper-tin intermetallic compounds. Source: Ref 26 . © 2013 IEEE. Reprinted, with permission, from IEEE Proceedings More
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Published: 01 January 1996
Fig. 10 The effect on toughness of elements that form intermetallic compounds More
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Published: 31 October 2011
Fig. 6 Process parameter for laser roll welding. IMC, intermetallic compound More
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Published: 30 August 2021
Fig. 4 Copper-tin (Cu 6 Sn 5 ) and silver-tin (Ag 3 Sn) intermetallic compound morphology in a solder ball More
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Published: 30 August 2021
Fig. 13 Typical growth kinetics of a copper-tin-base intermetallic compound. Source: Ref 31 . Courtesy of Springer Nature More
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Published: 30 August 2021
Fig. 18 Intermetallic compound brittle failure of a solder joint. PCB, printed circuit board More
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Published: 30 August 2021
Fig. 21 Typical intermetallic compound brittle fracture caused by impact More
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Published: 30 November 2018
Fig. 12 Process parameters for laser roll welding. IMC, intermetallic compound More
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Published: 01 January 1993
Fig. 5 Effect of intermetallic compound thickness on room-temperature tensile strength of solder joints (copper/copper base metals) More
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Published: 01 June 2024
Fig. 3 Effect of thermal aging on growth of copper-tin intermetallic compound layer. Cross section and top view at (a) 0 h aging. Original magnification: 3000×. (b) Original magnification: 6000×. (c) 600 h aging. Original magnification: 3000×. (d) Original magnification: 6000×. (e) 1000 h More
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Published: 01 June 2024
Fig. 7 Intermetallic compound and morphology changes subject to thermal aging at 125 °C (255 °F). (a) Electroless nickel immersion gold (ENIG), 0 h. Original magnification: 6000×. (b) Organic solderability preservative (OSP), 0 h. Original magnification: 6000×. (c) ENIG, 500 h. Original More
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Published: 01 June 2024
Fig. 9 Excessive growth of Ag 3 Sn intermetallic compound in solder joint. Source: Ref 12 More
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Published: 01 June 2024
Fig. 12 Dominant solder joint failure modes. IMC, intermetallic compound; PCB, printed circuit board. Source: Ref 4 More
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Published: 01 June 2024
Fig. 16 Intermetallic compound (IMC) brittle failure during drop test and high-speed (HS) ball shear/pull tests. (a) IMC failure during drop test. PCB, printed circuit board. (b) IMC fracture failure during HS ball shear (500 mm/s, or 20 in./s). (c) IMC fracture failure during HS ball pull (50 More
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003164
EISBN: 978-1-62708-199-3
... Abstract Alloys based on ordered intermetallic compounds constitute a unique class of metallic material that form long-range ordered crystal structures below a critical temperature. Aluminides, a unique class of ordered intermetallic materials, possesses many attributes like low densities, high...
Series: ASM Handbook
Volume: 14A
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v14a.a0004007
EISBN: 978-1-62708-185-6
... the hydrostatic extrusion of structural alloys, composites, brittle materials, and intermetallics or intermetallic compounds, with examples. It concludes with a discussion on the attempts made to extend the hydrostatic extrusion to higher temperatures. brittle materials composites hot hydrostatic...
Series: ASM Handbook
Volume: 1
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v01.a0001043
EISBN: 978-1-62708-161-0
... Abstract Maraging steels comprise a special class of high-strength steels that differ from conventional steels in that they are hardened by a metallurgical reaction that does not involve carbon. Instead, these steels are strengthened by the precipitation of intermetallic compounds...
Series: ASM Handbook
Volume: 9
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.hb.v09.a0003778
EISBN: 978-1-62708-177-1
... on etchants for tin and tin alloys in tabular form. It presents the procedure recommended for electron microscopy to determine the nature of the intermetallic compound formed by the reaction between tin or tin-lead coatings on various substrates. The article concludes with an illustration...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003632
EISBN: 978-1-62708-182-5
... and intermetallic compounds as a result of exposure to their environment. environmentally induced cracking corrosion intermetallic compound THIS SUBSECTION was developed to introduce the fundamental aspects of environmentally induced cracking. It provides theoretical basis for further discussions...