This article provides a qualitative summary of the theory of diffusion bonding, as distinguished from the mechanisms of other solid-state welding processes. Diffusion bonding can be achieved for materials with adherent surface oxides, but the resultant interface strengths of these materials are considerably less than that measured for the parent material. The article describes three stages of diffusion bonding: microasperity deformation, diffusion-controlled mass transport, and interface migration. It concludes with information on diffusion bonding with interface aids.

Diffusion bonding is only one of many solid-state joining processes wherein joining is accomplished without the need for a liquid interface (brazing) or the creation of a cast product via melting and resolidification. This article offers a qualitative summary of the theory of diffusion bonding. It discusses factors that affect the relative difficulty of diffusion bonding oxide-bearing surfaces. These include surface roughness prior to welding, mechanical properties of the oxide, relative hardness of the metal and its oxide film, and prestraining or work hardening of the material. The article describes the mechanism of diffusion bonding in terms of microasperity deformation, diffusion-controlled mass transport, and interface migration. It concludes with a discussion on diffusion bonding with interface aids.

This article examines how cellular automaton (CA) can be applied to the simulation of static and dynamic recrystallization. It describes the steps involved in the CA simulation of recrystallization. These include defining the CA framework, generating the initial microstructure, distributing nuclei of recrystallized grains, growing the recrystallized grains, and updating the dislocation density. The article concludes with information on the developments in CA simulations.

Grain boundaries are interfaces between crystallites of the same phase but different crystallographic orientation. They can be characterized as being low angle or high angle. This article discusses the measurements of grain-boundary energy with a brief summary of different schemes for measuring grain-boundary surface tension. The atomistic simulations of grain-boundary energy, measurement of grain-boundary migration and the techniques used to monitor grain-boundary migration are reviewed. Several considerations and effects influencing the computation of grain-boundary mobility are also discussed.

This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.

Spinodal transformation is a phase-separation reaction that occurs from kinetic behavior. This article discusses the theory of spinodal decomposition, and outlines the methods used in the characterization of spinodal structures in metal matrices.

The goals of modeling diffusion bonding can be regarded as twofold: to optimize the selection of the process variables for a given material and to provide an understanding of the mechanisms by which bonding is achieved. This article describes the existing models of diffusion bonding with an assumption that the surfaces to be joined are free of contaminants and oxide, that bonding occurs between similar materials, and that the materials are single-phase metals. It discusses the mechanisms considered for diffusion bonding and limitations of existing models.

This article describes the Schottky defect and the Frenkel defect in oxides. It provides information on the p-type metal-deficit oxides and n-type semiconductor oxides. The article discusses diffusion mechanisms and laws of diffusion proposed by Fick. It explains the oxide texture of amorphous and epitaxy oxide layers and presents equations for various oxidation reaction rates. The article reviews different theories to describe the oxidation mechanism. These include the Cabrera-Mott, Hauffe-IIschner, Grimley-Trapnell, Uhlig, and Wagner theories.

This article reviews network models and their applications for the simulation of various physical phenomena related to grain-boundary migration. It discusses the steps involved in the implementation of two and three-dimensional network models, namely, acquisition and discretization of the microstructure, formulation of the equation of motion, and implementation of the topological transformations. The article presents examples that illustrate the simulation of physical phenomena to demonstrate the predictive power and flexibility of network models.

This article describes the mechanism, advantages and disadvantages, fundamentals, capabilities, variations, equipment used, and weldability of metals in solid-state welding processes, including diffusion bonding, explosion welding, friction welding, ultrasonic welding, upset welding, and deformation welding.

This article discusses the fundamentals of electroplating processes, including pre-electroplating and surface-preparation processes. It illustrates the four layers of a plating system, namely, top or finish coat, undercoat, strike or flash, and base material layers. The article describes various plating methods, such as pulse electroplating, electroless plating, brush plating, and jet plating. It reviews the types of electrodeposited coatings, including hard coatings and soft coatings. The article also details the materials available for electroplating, including electroplated chromium, electroplated nickel, electroless (autocatalytic) nickel, electroless nickel composite coatings, electroplated gold, and platinum group coatings. These are specifically tailored toward plated coatings for friction, lubrication, and wear technology. The article concludes with a discussion on the common issues encountered with electroplating.

In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article focuses on the key factors contributing to corrosion of electronic components, namely, chemicals (salts containing halides, sulfides, acids, and alkalis), temperature, air (polluted air), moisture, contact between dissimilar metals in a wet condition, applied potential differences, and stress. It discusses the chip corrosion and oxidation of tin and tin-lead alloys (solders) in SIC. The article also addresses the corrosion of the device terminations resulting in lead (termination) tarnishing that are caused by various factors, including galvanic corrosion, chemical residues, base metal migration and plating additives.

Anodizing produces a uniform, continuous, highly ordered network of individual cells comprising a layer whose thickness and cell dimensions, and ultimately engineering properties, depend on the electrochemical parameters of the anodizing process. This article discusses the nucleation and growth of anodic aluminum oxide and the important characteristics of the finished porous anodic aluminum oxide. In industry, anodic oxides and the anodizing processes have been categorized into types that exhibit specific properties to suit specific applications. The article reviews the two most basic types of oxides, namely, barrier-layer anodic oxides and porous anodic oxides. It concludes with a description of postanodizing processes, such as dyeing and sealing.

The misorientation of a boundary of a growing grain is defined not only by its crystallography but also by the crystallography of the grain into which it is growing. This article focuses on the Monte Carlo Potts model that is typically used to model grain growth, Zener-Smith pinning, abnormal grain growth, and recrystallization. It introduces the basics of the model, providing details of the dynamics, simulation variables, boundary energy, boundary mobility, pinning systems, and stored energy. The article explains how to incorporate experimental parameters and how to validate the model by comparing the observed behavior quantitatively with theory. The industrial applications of the model are also discussed. The article also provides a wide selection of the algorithms for implementing the Potts model, such as boundary-site models, n -fold way models, and parallel models, which are needed to simulate large-scale industrial applications.

This article introduces the mechanism of diffusion and the common types of heat treatments such as annealing and precipitation hardening, which are applicable to most ferrous and nonferrous systems. Three distinct processes occur during annealing: recovery, recrystallization, and grain growth. The article also describes the various types of solid-state transformations such as isothermal transformation and athermal transformation, resulting from the heat treatment of nonferrous alloys. It provides information on the homogenization of chemical composition within a cast structure.

This article provides a background of the complex relationship between titanium and its alloys with aqueous environments, which is dictated by the presence of a passivating oxide film. It describes the corrosion vulnerability of titanium and titanium oxides by the classification of oxide failure mechanisms. The mechanisms are spatially localized oxide film breakdown by the ingress of aggressive anions; spatially local or homogenous chemical dissolution of the oxide in a strong reducing-acid environment; and mechanical disruptions or depassivation such as scratching, abrading, or fretting. Titanium alloys can be classified into three primary groups such as titanium alloys with hexagonal close-packed crystallographic structure; beta titanium alloys with body-centered cubic crystallographic structures; and alpha + beta titanium alloys including near-alpha and near-beta titanium alloys. The article also illustrates the effects of alloying on active anodic corrosion of titanium and repassivation behavior of titanium and titanium-base alloys.

In some phase diagrams, the appearance of several reactions is the result of the presence of intermediate phases. These are phases whose chemical compositions are intermediate between two pure metals, and whose crystalline structures are different from those of the pure metals. This article describes the order-disorder transformation that typically occurs on cooling from a disordered solid solution to an ordered phase. It provides a table that lists selected superlattice structures and alloy phases that order according to each superlattice. The article informs that spinodal decomposition has been particularly useful in the production of permanent magnet materials, because the morphologies favor high magnetic coercivities. It also describes the theory of spinodal decomposition with a simple binary phase diagram.

This article includes a collection of color images that aid in the identification and classification of forms of corrosion in industries and environments. It emphasizes the negative aspects of corrosion and examines the cost and the effort to test, evaluate, simulate, and prevent corrosion. The ability of corrosion to undo the best complex engineered systems has been documented.