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Published: 31 December 2017
Fig. 18 Formation of low-shear-strength layers at the asperity interface More
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001286
EISBN: 978-1-62708-170-2
... Abstract This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition...
Book Chapter

By Donald M. Mattox
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001289
EISBN: 978-1-62708-170-2
... Abstract This article begins with a list of the factors that influence the properties of physical vapor deposited films. It describes the steps involved in ion plating, namely, surface preparation, nucleation, interface formation, and film growth. The article discusses the factors influencing...
Series: ASM Handbook
Volume: 22A
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.hb.v22a.a0005458
EISBN: 978-1-62708-196-2
... Abstract Any model that describes the early stage of cavitation must therefore address experimental observations of continuous nucleation, cracklike interface cavities, cavity growth from nanometer-scale sizes, and debonding at particle interfaces and formation of large-faceted cavities...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003187
EISBN: 978-1-62708-199-3
... Abstract Fundamental to the machining process, is the metal-cutting operation, which involves extensive plastic deformation of the work piece ahead of the tool tip, high temperatures, and severe frictional conditions at the interfaces of the tool, chip, and work piece. This article explains...
Book Chapter

By Christian E. Fischer
Series: ASM Handbook
Volume: 22B
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.hb.v22b.a0005519
EISBN: 978-1-62708-197-9
... Abstract This article begins with information on the fundamentals of chip formation process and general considerations for the modeling and simulation of machining processes. It focuses on smaller-scale models that seek to characterize the workpiece/tool/chip interface and behaviors closely...
Book Chapter

By W.J. Boettinger
Book: Casting
Series: ASM Handbook
Volume: 15
Publisher: ASM International
Published: 01 December 2008
DOI: 10.31399/asm.hb.v15.a0005226
EISBN: 978-1-62708-187-0
..., and the formation of noncrystalline phases. It considers three factors to understand the fundamentals of these changes: heat flow, thermodynamic constraints/conditions at the liquid-solid interfaces, and diffusional kinetics/microsegregation. These factors are described in detail. casting microsegregation...
Book Chapter

By Jonathan A. Dantzig
Book: Casting
Series: ASM Handbook
Volume: 15
Publisher: ASM International
Published: 01 December 2008
DOI: 10.31399/asm.hb.v15.a0005208
EISBN: 978-1-62708-187-0
..., and the microstructure formation. interface normal vector is n*. (The subscripts s Sv and L are used throughout to refer to the solid Balance Equations and liquid, respectively, and the superscript Áwhere f = s n is the external traction force indicates quantities on the liquid-solid interface.) The derivation...
Book Chapter

By Graham K. Hubler, James K. Hirvonen
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001290
EISBN: 978-1-62708-170-2
... and chemical processes occurring at the film-vacuum interface during IBAD and dual-ion-beam sputtering with illustrations. The article also reviews the methods used for large-area, high-volume implementation of IBAD and the modes of film formation for IBAD. It contains a table that presents information...
Series: ASM Handbook
Volume: 1A
Publisher: ASM International
Published: 31 August 2017
DOI: 10.31399/asm.hb.v01a.a0006313
EISBN: 978-1-62708-179-5
... attributed this phenomenon to interaction between the casting surface layer and moisture in the mold, resulting in the formation of carbon dioxide and hydrocarbon gases at the metal-mold interface. However, a direct reaction between carbon and hydrogen to form C x H y is less probable than a reaction...
Book Chapter

By R. Alan Patterson
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001351
EISBN: 978-1-62708-173-3
... was separated into two regimes: At intermediate collision-point velocities, the flow was described by vortice formation into a von Karman vortex street and the production of a wavy bond interface At high collision-point velocities, the flow was disturbed by a disordering of the jet wake, which led...
Book Chapter

By Rohit Trivedi, Erin Sunseri
Book: Casting
Series: ASM Handbook
Volume: 15
Publisher: ASM International
Published: 01 December 2008
DOI: 10.31399/asm.hb.v15.a0005210
EISBN: 978-1-62708-187-0
... common nonplanar interfaces form cellular or dendritic microstructures, which lead to microsegregation and possible second-phase formation that control the properties and reliability of the solidified product. Since microstructures form a key link between properties and processing conditions...
Image
Published: 01 December 2009
Fig. 11 Interface growth. (a) Coherent. (b) Semicoherent or coherent interface with formation of islands (so-called self-organization). (c) Noncoherent interface as the stored elastic energy caused by misfit increases. Source: Ref 2 More
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006574
EISBN: 978-1-62708-290-7
... ). Consequently, if two pure metallic surfaces are placed in contact under a normal load, the asperities at the interface yield, leading to the formation of a joint ( Ref 39 ). This joint, however, is weak and fails at loads lower than one-fourth of the initial load ( Ref 39 ). However, when a tangential force...
Book Chapter

By J.W. Elmer, D.D. Kautz
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001349
EISBN: 978-1-62708-173-3
..., the oxide on the faying surfaces again contain contaminants such as water and hydrocarbons. The contaminants in this case are likely to alloy into the finished weldment. This alloying causes a reduction of structural integrity through the formation of low-melting or brittle phases at the weld interface...
Book Chapter

By Stephen Liu, John Banker, Curtis Prothe
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005602
EISBN: 978-1-62708-174-0
... flow was separated into two regimes: At intermediate collision-point velocities, the flow was described by vortice formation into a von Karman vortex street and the production of a wavy bond interface. At high collision-point velocities, the flow was disturbed by a disordering of the jet wake...
Image
Published: 01 January 1996
Fig. 11 Model by Essmann et al. ( Ref 46 ) for formation of extrusions. (a) Arrangement of interface dislocations corresponding to an interstitial-type dislocation-dipole layer. (b) Extrusions formed by emergence of interface dislocations. b, Burgers vector; M, matrix; PSB, persistent slip More
Image
Published: 31 October 2011
Fig. 14 Schematic illustration showing (a) solute enrichment in liquid during solidification, (b) formation of a solute boundary layer in the liquid, and (c) variation in liquidus temperature near the solid/liquid interface due to formation of the solute boundary layer More
Book Chapter

By D.D. Kautz
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005575
EISBN: 978-1-62708-174-0
... such as water and hydrocarbons. The contaminants in this case are likely to alloy into the finished weldment. This alloying causes a reduction of structural integrity through the formation of low-melting or brittle phases at the weld interface. Surface-treated interfaces frequently cause problems during FRW...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001449
EISBN: 978-1-62708-173-3
..., the explosion weld interface will have a wave morphology that is exclusively characteristic of the process. A typical, wavy explosion weld interface between copper and niobium is shown in Fig. 6 . This wave formation, which has been the subject of considerable investigation ( Ref 3 , 4 ), results from...