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Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001285
EISBN: 978-1-62708-170-2
... of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication. amorphous silicon films dielectric films integrated circuit fabrication microelectronic device fabrication...
Book: Casting
Series: ASM Handbook
Volume: 15
Publisher: ASM International
Published: 01 December 2008
DOI: 10.31399/asm.hb.v15.a0005209
EISBN: 978-1-62708-187-0
... Abstract One impressive example of plane front solidification (PFS) is the industrial production of large silicon single crystals, used mainly as substrates for integrated circuits. This article explores the PFS of a single phase, without taking convection into account. It discusses the solute...
Series: ASM Handbook
Volume: 12
Publisher: ASM International
Published: 01 January 1987
DOI: 10.31399/asm.hb.v12.a0000631
EISBN: 978-1-62708-181-8
... oxygen environment exposure effect, solar cell interconnect, integrated circuit defects, and fatigue failure of these materials. electronic materials fatigue failure fractograph integrated circuits ultrasonic cleaning Effect of exposure to the atomic oxygen environment found in low earth...
Series: ASM Handbook
Volume: 23
Publisher: ASM International
Published: 01 June 2012
DOI: 10.31399/asm.hb.v23.a0005660
EISBN: 978-1-62708-198-6
... Abstract The biocompatibility of a material relates to its immunological response, toxicity profile, and ability to integrate with surrounding tissue without undesirable local or systemic effects on a patient. This article underscores the transformation of the medical device design ecosystem...
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006454
EISBN: 978-1-62708-190-0
... inspection of integrated circuits. For example, in the early 1970s, a satellite launch mission failed because of a loose particle inside the cavity of a single integrated circuit. As a result, integrated circuits for critical applications are now routinely tested by particle impact noise-detection technology...
Series: ASM Handbook
Volume: 4B
Publisher: ASM International
Published: 30 September 2014
DOI: 10.31399/asm.hb.v04b.a0005931
EISBN: 978-1-62708-166-5
... Abstract Heat treating furnaces require different control systems and integration for achieving optimum technical results and enabling safe operation. This article focuses on atmosphere furnaces, with some coverage on controls for vacuum furnaces. Heat treating operations require reliable...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003005
EISBN: 978-1-62708-200-6
... Abstract The selection of engineered materials is an integrated process that requires an understanding of the interaction between materials properties, manufacturing characteristics, design considerations, and the total life cycle of the product. This article classifies various engineered...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006788
EISBN: 978-1-62708-295-2
... opportunities to improve operating processes and procedures related to the management of system integrity. Industry experience with corrosion-resistant alloys of steel, copper, and aluminum is reviewed. The article ends with a discussion on monitoring and preventing microbiologically influenced corrosion...
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006443
EISBN: 978-1-62708-190-0
... concludes with an example that illustrates the integration of an ultrasonic reliability model with a CAD system. non-destructive evaluation process control reliability ultrasonic inspection model eddy current inspection model radiographic inspection model ultrasonic reliability model CAD system...
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006457
EISBN: 978-1-62708-190-0
... Abstract Adhesive-bonded joints are extensively used in aircraft components and assemblies where structural integrity is critical. This article addresses the problem of how to inspect bonded assemblies so that all discrepancies are identified. It describes several inspection techniques and...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001256
EISBN: 978-1-62708-170-2
... a gray powder on the surface, also called tin disease ). These properties make it a valuable coating for integrated-circuit leads, surface-mount (small outline transistor) components, and circuit board connections. Tin-bismuth processes have been developed in recent years as a substitute for tin...
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006466
EISBN: 978-1-62708-190-0
... applications with C-scan applications, based on transducer frequency and wavelength. C-SAM, C-mode scanning acoustic microscopy; SLAM, scanning laser acoustic microscopy; SAM, scanning acoustic microscopy; NDT, nondestructive testing; IC, integrated circuit The most popular application of SLAM and C-SAM...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003161
EISBN: 978-1-62708-199-3
... mounting, where the integrated circuit packages would be vulnerable to thermal damage at the temperatures required for conventional tin-lead soldering Assembly operations using injection-molded circuit boards where the glass transition temperature is too low for the use in tin-lead alloys. ...
Series: ASM Handbook
Volume: 7
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v07.9781627081757
EISBN: 978-1-62708-175-7
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0005586
EISBN: 978-1-62708-170-2
...; bias current IBAD ion-beam-assisted deposition IC integrated circuit ICB ionized cluster beam (deposition) ID inside diameter in. inch IP conventional ion plating IR infrared ISCC intergranular stress-corrosion cracking ISO International...
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0006540
EISBN: 978-1-62708-183-2
... density I appl applied current I corr corrosion current IC integrated circuit ICCP impressed current cathodic protection ID inside diameter IGA intergranular attack IGC intergranular corrosion in. inch ipy inches per year...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.9781627081733
EISBN: 978-1-62708-173-3
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003229
EISBN: 978-1-62708-199-3
... such as integrated circuits, relays, and transistors. In this method, the test unit is placed in a pressurized container filled with a tracer gas and is kept there for a time to allow tracer gas to flow into the unit through any leaks that exist. In using back pressuring, care must be taken to...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003062
EISBN: 978-1-62708-200-6
... expansion coefficient relatively close to that of silicon and, in consequence, is being rapidly developed for substrate use. Thin-film insulators (including SiO 2 and other oxides, glasses, and Si 3 N 4 ) have been developed as interlayer dielectric and as thin-film passivation for integrated circuit...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0006515
EISBN: 978-1-62708-200-6
... HVTR high-voltage track rate Hz hertz i current (measure of number of electrons) I current; emergent intensity IBAD ion-beam-assisted deposition IC integrated circuit ICF inertial confinement fusion ICI International Commission on Illumination...