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integrated circuit packaging

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Published: 01 August 2018
Fig. 27 Typical ceramic-packaged integrated circuit showing the silicon die, which is bonded to the metallized surface More
Image
Published: 01 August 2018
Fig. 31 Schematic illustrating use of the C-mode scanning acoustic microscopy reflection technique to evaluate the die-attach bond between the silicon die and the ceramic package of a ceramic dual in-line package integrated circuit. With this technique, the ultrasound access to the bond layer More
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
...Abstract Abstract Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003161
EISBN: 978-1-62708-199-3
...-pressure contact is too variable or inconsistent for assembly operation. Soldering low-temperature alloys such as pewter Machine-soldering operations for through-hole soldering of very thick multilayer printed circuit boards. Assembly operations, such as surface mounting, where the integrated...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001459
EISBN: 978-1-62708-173-3
...Abstract Abstract Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering...
Book Chapter

By Paul T. Vianco
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001401
EISBN: 978-1-62708-173-3
.... 2 Schematic of preferred device orientation for wave-soldered assemblies. SOIC, small-out-line integrated circuit (surface-mount); DIP, dual-inline package (through-hole) Through-Hole Technology In the case of through-hole assemblies, the leads on the side of a through-hole 16-pin dual...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002475
EISBN: 978-1-62708-194-8
... films. An alternative is the use of Peltier-junction based ( Ref 13 ) thermoelectric coolers. Fig. 3 Temperature versus power density. Source: Ref 5 Most electronic structures, whether integrated circuit (IC) interconnections or packaging, are multilayer structures, with conducting...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004172
EISBN: 978-1-62708-184-9
...Abstract Abstract In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion...
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
... between the bulk soldering area and printed circuit board (PCB) Conductive layer on the PCB Nonconductive part at the PCB Figure 5 shows a schematic diagram and failure modes for the solder joint system defined by the Interconnection and Packaging Circuits (IPC) 9708 standard. Fig. 5...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
..., and discontinuous thermally conductive carbon-fiber-reinforced polymers. Microelectronic packaging components include carriers, complex hermetic microwave packages (modules), power semiconductor packages, solid and flow-through liquid-cooled PCB cold plates (thermal planes), heat sinks for integrated circuit...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
... are not hermetically sealed. Instead, the isolation from the environment arises from the use of primarily epoxy-based molding compounds, underfills, and so forth. Therefore, although the integrated circuits (ICs) in the electronic packages are relatively safe from moisture ingress, most portable electronic devices...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002445
EISBN: 978-1-62708-194-8
... design steps, thus reducing error, but will require more detail and precision in the behavioral and nonbehavioral requirements. The limitations of the languages and the lack of synthesis tools (except for digital integrated circuits) has limited the automation of this phase. It is appropriate...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006558
EISBN: 978-1-62708-290-7
... Conductive Solution Inks in Continuous Inkjet Printing of 3-D Electric Circuits , IEEE Trans. Electron. Packag. Manuf. , Vol 28 , 2005 , p 265 – 273 10.1109/TEPM.2005.852542 15. Smith P.J. , Shin D.Y. , Stringer J.E. , Derby B. , and Reis N. , Direct Ink-Jet Printing...
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006466
EISBN: 978-1-62708-190-0
... package is used to house the die and to serve as an interconnection vehicle. Figure 27 shows a typical ceramic IC package containing a die bonded to a gold-plated surface. The die bond also is referred to as a die-attach. Fig. 27 Typical ceramic-packaged integrated circuit showing the silicon die...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004170
EISBN: 978-1-62708-184-9
... been made in the microelectronics industry. From industrial control and telecommunications equipment to consumer digital electronics, the industry is driven by ever-increasing demands for performance, miniaturization, and low-cost reliability. The continued shrinkage of integrated circuit (IC) design...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003062
EISBN: 978-1-62708-200-6
.... This leads to an extremely low level of surface defects, which results in even higher yields than the standard 99.5% alumina material. Multilayer Packages Integrated circuit packages from high-alumina ceramics is one of the most important applications of ceramics in the electronics industry. Ceramic...
Series: ASM Handbook
Volume: 22B
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.hb.v22b.a0005544
EISBN: 978-1-62708-197-9
...-dielectric media. Vector Fields Ltd. www.vectorfields.comhttp://www.vectorfields.com/opera.php PAM-STAMP 2G PAM-STAMP 2G is an integrated, scalable, and streamlined stamping simulation package. It covers the entire tooling process from quotation and die design through formability and validation...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005843
EISBN: 978-1-62708-167-2
... integrated magnetic transformers were developed and patented by the Jackson Transformer Company to combine a transformer and inductor into a single package using a common core. The product often is referred to as a Transinductor® and can be designed to provide a fixed inductance in either the primary...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005876
EISBN: 978-1-62708-167-2
..., homogeneous, and isotropic material properties. In the early 1960s, the finite-difference method (FDM) started to be applied to solve eddy current problems for designing induction heating systems. Only some years later was the integral method based on the equivalence with mutually coupled circuits also...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001256
EISBN: 978-1-62708-170-2
...: Ref 1 Experimental modified MSA tin-lead plating solutions are being evaluated for semiautomatic plating of leaded-glass sealed integrated-circuit packages, with excellent results. A minimum of 2% Pb in a tin deposit is reported to prevent whiskering, eliminating the need for reflow...