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integrated circuit fabrication

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Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001285
EISBN: 978-1-62708-170-2
... process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication. References References 1. Gorowitz B. , Gorczyca T.B. , and Saia R.J. , in Solid State Technology , Vol...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001091
EISBN: 978-1-62708-162-7
... facilities are in Europe. Complex processing techniques are used to produce single crystals of gallium and GaAs ( Fig. 1 ); complex techniques also are required for the fabrication of gallium and GaAs optoelectronic devices and integrated circuits (ICs). Japan and the United States lead the world in GaAs...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001459
EISBN: 978-1-62708-173-3
...Abstract Abstract Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004171
EISBN: 978-1-62708-184-9
.... At the heart of the industry is the ability at the wafer-fabrication plant to implement the complicated processes needed to deposit, pattern, and etch circuits in semiconductor materials. One key to the fabrication of integrated circuits is the method of removing selected areas of a conductive-deposited...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006558
EISBN: 978-1-62708-290-7
... Fabricator Kit , Rapid Prototyping Journal , Vol 13 , 2007 , p 245 – 255 10.1108/13552540710776197 8. Navarrete M. , Lopes A. , Acuna J. , and Estrada R. , Integrated Layered Manufacturing of a Novel Wireless Motion Sensor System with GPS , Proceedings of 18th Annual Solid...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002475
EISBN: 978-1-62708-194-8
... Science: For Integrated Circuits in Si and GaAs , Macmillan , 1990 23. Humenik J.N. , Oberschmidt J.M. , Wu L.L. , and Paul S.G. , Low-Inductance Decoupling Capacitor for the Thermal Conduction Modules of the IBM Enterprise System/9000 Processors , IBM J. Res. Dev. , Vol 36...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006547
EISBN: 978-1-62708-290-7
.... and Williams C.B. , Combining Additive Manufacturing and Direct Write for Integrated Electronics—A Review , 24th International Solid Freeform Fabrication Symposium—An Additive Manufacturing Conference , University of Texas at Austin , 2013 , p 962 – 979 , http://sffsymposium.engr.utexas.edu...
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005594
EISBN: 978-1-62708-174-0
... Manually Operated and Robotic Welding Cells Maintenance Electrode Shapes Electrode Coolant Parameters Effect of Oil Coatings Effect of Rust, Scale, or Oxide Surface Preparation Welding Behavior Evaluation Weld Integrity Spot Welding of Uncoated Steels Spot Welding of Zinc...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006641
EISBN: 978-1-62708-213-6
... to bringing them into fabrication plants is also effective in detecting possible contaminants before they impact manufacturing processes ( Ref 20 ). Silicon is the most important semiconductor material for the semiconductor industry, with increasingly sophisticated integrated circuits built almost...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001265
EISBN: 978-1-62708-170-2
... of the appearance of the final product. Since about the late 1970s, microscopy has been widely used to detect minute defects in PTH, due to increasing demands on circuit integrity. Typically a panel is sliced so that half the plated hole is visible for microscopic examination. Rather than incident light...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003353
EISBN: 978-1-62708-195-5
... Milled Fibers Fiberglass Paper Textile Yarns Fiberglass Fabric Texturized Yarn Carded Glass Fibers General-purpose glass fibers (E-glass variants) are discussed in the following section of this article, which provides an in-depth discussion of compositions, melt properties, fiber...
Book: Machining
Series: ASM Handbook
Volume: 16
Publisher: ASM International
Published: 01 January 1989
DOI: 10.31399/asm.hb.v16.a0002165
EISBN: 978-1-62708-188-7
... electrode for electrical discharge machining (EDM). It describes the operational methodology of the EDM. Topography, metallurgical and chemical effects, and surface integrity of the EDM surface are reviewed. The article provides information on the characteristics of electrodes and the process features...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003418
EISBN: 978-1-62708-195-5
... and removing shrink tape on automated tape wrapping machines with consistent tape-tension control. Fabrics, as noted earlier, offer a simple and extremely rapid method of rolling tubes that have a 0/90° fiber orientation. Patterns are sized to the tube length, and an integral number of circumferential...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003062
EISBN: 978-1-62708-200-6
... with an expansion coefficient relatively close to that of silicon and, in consequence, is being rapidly developed for substrate use. Thin-film insulators (including SiO 2 and other oxides, glasses, and Si 3 N 4 ) have been developed as interlayer dielectric and as thin-film passivation for integrated circuit...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003680
EISBN: 978-1-62708-182-5
... support Electromagnetic Insulating properties Printed circuit board, integrated circuit board, electric cable Dielectric properties Electrolytic capacitor, humidity sensor, gas sensor, printing roller Magnetism Magnetic recording device, rotary encoder Optical Luminescence...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003413
EISBN: 978-1-62708-195-5
... in-plane shear behavior. 800 g/m 2 glass fiber fabrics. Source: Ref 9 Fig. 11 Cross section through a foam-cored RTM component showing evidence of core shifting. Although specified with uniform skin thickness, the rigid polyurethane core has shifted under fluid pressure to produce...
Series: ASM Handbook
Volume: 5A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v05a.a0005736
EISBN: 978-1-62708-171-9
... silicates such as mullite (Al 2 O 3 ·SiO 2 ), forsterite (2MgO·SiO 2 ), steatite (MgO·SiO 2 ), and cordierite (2MgO·2Al 2 O 3 ·5SiO 2 ) that have low dielectric constants (5 to 15) and excellent chemical durability. These materials have been considered potential materials for integrated circuits...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006565
EISBN: 978-1-62708-290-7
... in that one laser can be used in multiple modes of operation (i.e., subtractive and additive) to create a fully integrated, functional circuit ( Fig. 9 ) ( Ref 39 ). Receiving substrates can be micromachined to create pockets where the device will be transferred ( Fig. 9a , b ). Once in place, a second LIFT...
Book Chapter

Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003364
EISBN: 978-1-62708-195-5
... solvents such as N-methylpyrrolidone, dimethylformamide, and the like, and therefore can be processed via solution techniques to prepreg. Kerimide 601 was mainly used in glass fabric laminates for electrical applications and became the industry standard for polyimide-based printed circuit boards. Recently...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.9781627081955
EISBN: 978-1-62708-195-5