Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

Design and analysis of electrical/electronic systems and components tends to be different from the corresponding process for most mechanical and hydraulic systems. This article provides an overview of three overlapping phases followed in electrical design: functional, electrical, and physical. It also presents information on the simulation and testing carried out to evaluate the design behavior.

This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information on process parameters, which can be divided into three groups: the fluxing operation, solder wave properties, and process schedule. It provides information on various solder defects.

This article discusses the functions of the major components of a waterjet machining system. These include hydraulic unit, intensifier, accumulator, filters, water transmission lines, on/off valve, waterjet nozzles, abrasive waterjet nozzle, waterjet catchers, and fluid additives. The article reviews several variables that influence the WJM process, such as pressure, flow and nozzle diameter, stand-off distance, traverse rate, and type and size of abrasive. Advantages and disadvantages of waterjet and abrasive waterjet cutting are also discussed. The article describes the applications of waterjet and abrasive waterjet machining.

Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis are also presented. The article introduces several frequently used methods for solder joint failure detection, prevention, and isolation (identification for the failed location).

This article provides a historical review of corrosion problems in military electronic equipment. It describes the importance of design for corrosion control of an electronic black box used to contain electrical equipment that provides various functions. The article illustrates corrosion control aspects, such as the position of printed circuit boards (PCBs) and proper location of connectors for insertion of the PCBs. It discusses various materials and alloys considered for connectors, PCB contacts, and circuits. The article concludes with a discussion on the effects of contaminants on the electronic black box.

Electroless, or autocatalytic, metal plating is a nonelectrolytic method of deposition from solution that can be plated uniformly over all surfaces, regardless of size and shape. The plating's ability to plate onto nonconductors is an advantage that contributes to the choice of electroless copper in various applications. This article provides information on the bath chemistry and deposit properties of electroless copper and discusses the applications of electroless copper plating, such as printed wiring boards, decorative plating-on-plastic, electromagnetic interference shielding, and hybrid and other advanced applications. It describes two commercial processes, pretreatment and post-treatment. The article reviews the solutions used, controls and control equipment, and performance criteria of electroless copper plating. It concludes with information on the environmental and safety issues associated with electroless copper plating.

Anodizing is one of the most common surface treatments of aluminum and is performed for corrosion protection. This article describes the structure and growth characteristics of the types of anodic oxide films such as a barrier-type oxide film and a porous-type anodic oxide film. It discusses each step involved in the anodizing process of an aluminum or aluminum alloy specimen. The anodizing process includes pretreatments (degreasing, etching, and polishing), anodizing, coloring, and sealing. The article provides an observation of the morphology of the anodic oxide films by transmission electron microscopy and the scanning electron microscopy for testing properties of anodic oxide films.

In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article focuses on the key factors contributing to corrosion of electronic components, namely, chemicals (salts containing halides, sulfides, acids, and alkalis), temperature, air (polluted air), moisture, contact between dissimilar metals in a wet condition, applied potential differences, and stress. It discusses the chip corrosion and oxidation of tin and tin-lead alloys (solders) in SIC. The article also addresses the corrosion of the device terminations resulting in lead (termination) tarnishing that are caused by various factors, including galvanic corrosion, chemical residues, base metal migration and plating additives.

Electrodeposition of tin alloys is used to protect steel against corrosion or wear, to impart resistance to etching, and to facilitate soldering. This article focuses on the compositions, operating conditions, advantages, and limitations of methane sulfonic acid plating solutions and fluoborate plating solutions for tin-lead. It briefly describes the solution compositions and operating conditions of tin-bismuth, tin-nickel, and tin-zinc.

Fusible alloys, eutectic and noneutectic, include a group of binary, ternary, quaternary, and quinary alloys containing bismuth, lead, tin, cadmium, and indium that melt at relatively low temperatures. This article describes the composition and mechanical properties of these alloys and lists the values of their composition and melting temperatures.

Induction heating system control is straightforward after the design and application of the coil and power supply required for the job. This article provides an overview of the basic components of an induction heating system, including a machine controller (computer or programmable logic controller), interface wiring, an operator interface, and safety controls. It also provides information on programming devices and temperature controllers, such as manual, auto, and auto-manual temperature controllers.

This article provides an overview of the implementation of wire embedding with ultrasonic energy and thermal embedding for polymer additive manufacturing, discussing the applications and advantages of the technique. The mechanical and electrical performance of the embedded wires is compared with that of other conductive ink processes in terms of electrical conductivity and mechanical strength.

This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.

This article provides a brief description of load conditions for single-shot heat treating, vertical scanning, and brazing and soldering. It discusses the various power components used in power supplies. These include capacitors, integrated power module, transformers, and various switching devices, namely, silicon-controlled rectifiers, insulated-gate bipolar transistors, and metal-oxide semiconductor field-effect transistors. The article also provides information on frequency-multiplication harmonic-induction power supplies, namely, push-pull and half-bridge inverters and full-bridge inverters. Series resonant and parallel resonant circuits and their tuning calculations associated with output networks are also discussed. The article describes the frequency range of simultaneous dual-frequency induction heating power supply, and discusses the advantages, applications, and technical background of independently controlled frequency and power (IFP) induction heating power supply. It concludes with a description of the developments in control systems for modern induction power supplies.

This article presents an overview of the electric and magnetic parameters and discusses the significance of these parameters for electronic applications. It describes the components of analog and digital electronic circuits. The article reviews the augmenting technologies: magnetic and special technologies such as electrooptical.

Heat treating furnaces require different control systems and integration for achieving optimum technical results and enabling safe operation. This article focuses on atmosphere furnaces, with some coverage on controls for vacuum furnaces. Heat treating operations require reliable monitoring and control of motion and position of various mechanical components with the help of mechanical limit switches, proximity sensors, and distance- and position-measuring devices. Using inputs from both flow meters and sensors, such as thermocouples and oxygen sensors, flow measurement control systems must be able to adjust the flow of gases for process optimization. The operator interface of a furnace-control system displays critical information such as the furnace temperature, atmosphere status, alarms, electronic chart recorders, recipe, and maintenance. A supervisory control and data-acquisition (SCADA) system is used to monitor, collect, and store data from multiple pieces of equipment.

Nondestructive testing (NDT), also known as nondestructive evaluation (NDE), includes various techniques to characterize materials without damage. This article focuses on the typical NDE techniques that may be considered when conducting a failure investigation. The article begins with discussion about the concept of the probability of detection (POD), on which the statistical reliability of crack detection is based. The coverage includes the various methods of surface inspection, including visual-examination tools, scanning technology in dimensional metrology, and the common methods of detecting surface discontinuities by magnetic-particle inspection, liquid penetrant inspection, and eddy-current testing. The major NDE methods for internal (volumetric) inspection in failure analysis also are described.