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integrated circuit boards

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Published: 01 August 2018
Fig. 6 Different gray-scale images of an integrated circuit (IC) module on a printed circuit board. (a) Binary. (b) 8-level gray scale. (c) 64-level gray scale. Courtesy of Cognex Cooperation More
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
...Abstract Abstract Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002445
EISBN: 978-1-62708-194-8
... must provide a geometrical arrangement of conductors (e.g., wires, circuit board traces, silicon metallization), functional elements (e.g., motors, integrated circuit chips, registers), and appropriate physical/geometrical relationships. Many details of the process, the design tools...
Book Chapter

By Paul T. Vianco
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001401
EISBN: 978-1-62708-173-3
...Abstract Abstract This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents...
Book: Machining
Series: ASM Handbook
Volume: 16
Publisher: ASM International
Published: 01 January 1989
DOI: 10.31399/asm.hb.v16.a0002158
EISBN: 978-1-62708-188-7
... lower strength materials are involved. Applications include the following: Cutting of printed circuit boards Cutting of board materials Cutting of lightweight fiber-reinforced plastics Integration into robotic systems Wire stripping Crosscutting Cutting foods Cutting web...
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
... between the bulk soldering area and printed circuit board (PCB) Conductive layer on the PCB Nonconductive part at the PCB Figure 5 shows a schematic diagram and failure modes for the solder joint system defined by the Interconnection and Packaging Circuits (IPC) 9708 standard. Fig. 5...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004129
EISBN: 978-1-62708-184-9
... illustrates corrosion control aspects, such as the position of printed circuit boards (PCBs) and proper location of connectors for insertion of the PCBs. It discusses various materials and alloys considered for connectors, PCB contacts, and circuits. The article concludes with a discussion on the effects...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001265
EISBN: 978-1-62708-170-2
.... Fig. 4 A process flow chart for deposition of a multichip module on a conventional printed wiring board. Courtesy of Shipley Co. Silicon Devices Recently some interest has arisen in employing electroless copper for integrated circuit manufacture ( Ref 49 , 50 , 51 ). It is felt...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003680
EISBN: 978-1-62708-182-5
... support Electromagnetic Insulating properties Printed circuit board, integrated circuit board, electric cable Dielectric properties Electrolytic capacitor, humidity sensor, gas sensor, printing roller Magnetism Magnetic recording device, rotary encoder Optical Luminescence...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004172
EISBN: 978-1-62708-184-9
...Abstract Abstract In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001256
EISBN: 978-1-62708-170-2
... (formation of a gray powder on the surface, also called tin disease ). These properties make it a valuable coating for integrated-circuit leads, surface-mount (small outline transistor) components, and circuit board connections. Tin-Bismuth Tin-bismuth processes have been developed in recent years...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003161
EISBN: 978-1-62708-199-3
...-pressure contact is too variable or inconsistent for assembly operation. Soldering low-temperature alloys such as pewter Machine-soldering operations for through-hole soldering of very thick multilayer printed circuit boards. Assembly operations, such as surface mounting, where the integrated...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005854
EISBN: 978-1-62708-167-2
... for the interface of the power supply controller board to the PLC. The power supply is made up of power semiconductor devices. The power supply is usually a self-supported component in the system with safeguards and internal monitoring of parameters such as power, current, temperature, water flow (cooling), door...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006558
EISBN: 978-1-62708-290-7
... disappoints in comparison with bulk plated copper used in traditional electronics, and they provide only about half of the conductivity. In traditional printed circuit boards (PCBs), these solders are used ubiquitously but only at the point of contact between a component and the board, thus minimizing...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
... are not hermetically sealed. Instead, the isolation from the environment arises from the use of primarily epoxy-based molding compounds, underfills, and so forth. Therefore, although the integrated circuits (ICs) in the electronic packages are relatively safe from moisture ingress, most portable electronic devices...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005838
EISBN: 978-1-62708-167-2
...Abstract Abstract This article provides a brief description of load conditions for single-shot heat treating, vertical scanning, and brazing and soldering. It discusses the various power components used in power supplies. These include capacitors, integrated power module, transformers...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002475
EISBN: 978-1-62708-194-8
... films. An alternative is the use of Peltier-junction based ( Ref 13 ) thermoelectric coolers. Fig. 3 Temperature versus power density. Source: Ref 5 Most electronic structures, whether integrated circuit (IC) interconnections or packaging, are multilayer structures, with conducting...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.9781627081801
EISBN: 978-1-62708-180-1
Series: ASM Handbook
Volume: 4B
Publisher: ASM International
Published: 30 September 2014
DOI: 10.31399/asm.hb.v04b.a0005931
EISBN: 978-1-62708-166-5
... to withstand harsh industrial environments such as those found in a heat treating shop. They have a sufficient resistance to dirt, dust, and heat to perform reliably in an industrial environment. The PLCs come in a wide array of formats, from an integrated processor with on-board input/output to a configurable...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006764
EISBN: 978-1-62708-295-2
... precise control of environment, heat input, and high-resolution instrument. IR systems are sensitive to surface emissivity. Rapid examination of large areas. Can be adapted to production inspections Circuit board solder joints, solar cells, heat-transfer equipment, metals, composites, concrete Sonic...