Search Results for infrared technique

This article describes the test techniques that are available for monitoring crack initiation and crack growth and for obtaining information on fatigue damage in test specimens. These techniques include optical methods, the compliance method, electric potential measurement, and gel electrode imaging methods. The article discusses the magnetic techniques that are primarily used as inspection techniques for detecting fatigue cracks in structural components. It details the principles and operation procedures of the liquid penetrant methods, positron annihilation techniques, acoustic emission techniques, ultrasonic methods, eddy current techniques, infrared techniques, exoelectron methods, and gamma radiography. The article explains the microscopy methods used to determine fatigue crack initiation and propagation. These include electron microscopy, scanning tunneling microscopy, atomic force microscopy, and scanning acoustic microscopy. The article also reviews the X-ray diffraction technique used for determining the compositional changes, strain changes, and residual stress evaluation during the fatigue process.

Infrared (IR) spectra have been produced by transmission, that is, transmitting light through the sample, measuring the light intensity at the detector, and comparing it to the intensity obtained with no sample in the beam, all as a function of the infrared wavelength. This article discusses the sampling techniques and applications of IR spectra as well as the molecular structure information it can provide. The discussion begins with a description of the general principle of IR spectroscopy. This is followed by a section on commercial IR instruments. Sampling techniques and accessories necessary in obtaining the infrared spectrum of a material are then discussed. The article presents various techniques and methods involved in IR qualitative analysis and quantitative analysis. It ends with a few examples of the applications of IR spectroscopy.

Infrared (IR) spectroscopy is a useful technique for characterizing materials and providing information on the molecular structure, dynamics, and environment of a compound. This article provides the basic principles and instrumentation of IR spectroscopy. It discusses the sampling techniques of IR spectroscopy, namely, attenuated total reflectance spectroscopy, diffuse reflectance spectroscopy, infrared reflection-absorption spectroscopy, emission spectroscopy, and photoacoustic spectroscopy, and chromatographic techniques. Explaining the qualitative analysis of IR spectroscopy, the article provides information on spectral absorbance-subtraction, analysis of components in spectral matrix mixture, and determination of exact peak location of broad profiles. It discusses the quantitative analysis that mainly includes Beer's law for single compound in single wave number. The article also exemplifies the applications of IR spectroscopy.

Thermal inspection comprises all methods in which heat-sensing devices or substances are used to detect irregular temperatures. Inspection of workpieces can be used to detect flaws and undesirable distribution of heat during service. Though there are several methods of thermal inspection and many types of temperature-measuring devices and substances, this article focuses only on thermography, which is the mapping of isotherms, or contours of equal temperature, over a test surface, and on thermometry, which is the measurement of temperature. Thermography techniques can be classified as contact thermographic methods using cholesteric liquid crystals, thermally quenched phosphors, and heat-sensitive paints, and noncontact techniques using hand-held infrared scanners, high-resolution infrared imaging systems, and thermal wave interferometer systems. Contact thermometric inspection devices include bolometers, thermocouples, thermopiles, and meltable substances, whereas radiometers and pyrometers come under the noncontact category.

Vibrothermography, also known as sonic thermography, sonic infrared (IR), thermosonics, and vibroacoustic thermography, is a nondestructive evaluation (NDE) technique for finding cracks and delaminations through vibration-induced heating. This article describes the four parts of the vibrothermography process: vibration of the specimen by a transducer; conversion of vibrational energy into heat by a crack, delamination, and other contacting surfaces; conduction of the heat to an external surface; and infrared detection of the heat with a thermal camera.

Thermoelastic stress analysis (TSA) an increasingly popular infrared (IR)-based technique for measuring stress on the surface of a part subjected to time-varying loads. This article begins by providing a theoretical and historical background of thermoelastic stress analysis. It then describes infrared detectors, such as quantum detectors and thermal/nonquantum detectors, for thermoelastic stress analysis. The article discusses the theoretical aspects for producing thermoelastic stress analysis data and the applications amenable to thermoelastic stress analysis. It concludes with information on the qualitative applications of thermoelastic stress analysis.

Polymeric materials that possess similar solubility parameters can be joined using a variety of polymer joining techniques. This article describes commonly available fusion-welding techniques such as joining methods, key joining parameters, and the application areas of each joining method. The techniques are hot-tool, hot-gas, extrusion, focused infrared, laser, friction, vibration, spin, ultrasonic, and electromagnetic welding techniques (resistance, induction, dielectric, and microwave welding). The article concludes with a discussion on welding evaluation methods.

Furnace soldering (FS) encompasses a group of reflow soldering techniques in which the parts to be joined and preplaced filler metal are put in a furnace and then heated to the soldering temperature. This article describes three reflow soldering techniques in surface-mount technology, namely, vapor-phase reflow, area conduction, and infrared heating. These three techniques are considered as mass reflow techniques, because all of the solderable interconnections on the surface of a printed wiring board (PWB) assembly are brought through the reflow heating cycle simultaneously. The article explains four regions of reflow profile, namely, preheat (prebake), preflow (soak), reflow, and cooldown. It concludes with a description on the bare copper assembly process, which is carried out in the inert atmosphere.

This article reviews analytical techniques that are most often used in plastic component failure analysis. The description of the techniques is intended to familiarize the reader with the general principles and benefits of the methodologies, namely Fourier transform infrared spectroscopy, energy-dispersive x-ray spectroscopy, differential scanning calorimetry, thermogravimetric analysis, and dynamic mechanical analysis. The article describes the methods for molecular weight assessment and mechanical testing to evaluate plastics and polymers. The descriptions of the analytical techniques are supplemented by a series of case studies to illustrate the significance of each method. The case studies also include pertinent visual examination results and the corresponding images that aided in the characterization of the failures.

This article describes the analytical methods for analyzing surfaces for corrosion and corrosion inhibition processes as well as failure analysis based on surface structure and chemical identity and composition. The principles and applications of the surface-structure analysis techniques, namely, optical microscopy, scanning electron microscopy, scanning tunneling microscopy, and atomic force microscopy, are reviewed. The article discusses the principles and applications of chemical identity and composition analysis techniques. These techniques include the energy dispersive X-ray spectroscopy, Auger electron spectroscopy, X-ray photoelectron spectroscopy, ion scattering spectroscopy, reflectance Fourier transform infrared absorption spectroscopy, Raman and surface enhanced Raman spectroscopy, and extended X-ray absorption fine structure analysis.

This article reviews the analytical techniques most commonly used in plastic component failure analysis. These include the Fourier transform infrared spectroscopy, differential scanning calorimetry, thermogravimetric analysis, thermomechanical analysis, and dynamic mechanical analysis. The descriptions of the analytical techniques are supplemented by a series of case studies that include pertinent visual examination results and the corresponding images that aid in the characterization of the failures. The article describes the methods used for determining the molecular weight of a plastic resin. It explains the use of mechanical testing in failure analysis and also describes the considerations in the selection and use of test methods.

This article presents tools, techniques, and procedures that engineers and material scientists can use to investigate plastic part failures. It also provides a brief survey of polymer systems and the key properties that need to be measured during failure analysis. It describes the characterization of plastics by infrared and nuclear magnetic resonance spectroscopy, differential scanning calorimetry, differential thermal analysis, thermogravimetric analysis, thermomechanical analysis, and dynamic mechanical analysis. The article also discusses the use of X-ray diffraction for analyzing crystal phases and structures in solid materials.

This article discusses the classification of the attachment and joining methods in plastics, including mechanical fastening, adhesive bonding, solvent bonding, and welding. It describes the mechanical fastening techniques used to join both similar and dissimilar materials with machine screws or bolts, nuts and washers, molded-in threads, self-threading screws, rivets, spring-steel fasteners, press fits, and snap fits. The article explains solvent bonding used for thermoplastic parts, and tabulates the solvent types used with various plastics. It also describes the surface preparation of plastics, chemical treatment for adhesion, and tabulates the adhesive types for bonding plastics to plastics and plastics to nonplastics. The article briefly describes the welding processes of thermoplastics, including fusion welding (hot-tool, hot gas, extrusion, and focused infrared), friction welding (vibration, spin, and ultrasonic), and electromagnetic welding (resistance, induction, dielectric, and microwave). It concludes with the evaluation of welds using destructive and nondestructive testing.

This article begins with an overview of the various aspects of infrared pulse thermography used to detect disbondments, delaminations, and generalized corrosion. It describes the distinctive phases of the pulse thermographic process and the key components that are required to perform active thermography. The components include an excitation source, a thermographic camera, and a computer with software that controls the instrumentation, acquires data, and displays the results. The article discusses the process and experimental setup of sonic thermography used for crack detection.

This article introduces various analytical techniques commonly used in the characterization of organic solids and liquids and discusses the challenges in performing the analysis, with examples. Some general advice in approaching a material analysis is also provided.

This article describes the failure analysis procedures for composites and the techniques to be used in these analyses. These procedures include a review of the available in-service records, materials and processing methods, print requirements, and manufacturing records; visual analysis and nondestructive part evaluation; and verification of materials and processing methods. The article discusses the determination of fiber, matrix, and void volume fractions and verification of ply lay-up and orientation. A review of composites processing parameters; fractography and surface analysis; and mechanical testing and stress analysis is also presented.