Furnace soldering (FS) encompasses a group of reflow soldering techniques in which the parts to be joined and preplaced filler metal are put in a furnace and then heated to the soldering temperature. This article describes three reflow soldering techniques in surface-mount technology, namely, vapor-phase reflow, area conduction, and infrared heating. These three techniques are considered as mass reflow techniques, because all of the solderable interconnections on the surface of a printed wiring board (PWB) assembly are brought through the reflow heating cycle simultaneously. The article explains four regions of reflow profile, namely, preheat (prebake), preflow (soak), reflow, and cooldown. It concludes with a description on the bare copper assembly process, which is carried out in the inert atmosphere.

Soldering is defined as a joining process by which two substrates are bonded together using a filler metal with a liquidus temperature. This article provides an overview of fundamentals of soldering and presents guidelines for flux selection. Types of fluxes, including rosin-base fluxes, organic fluxes, inorganic fluxes, and synthetically activated fluxes, are reviewed. The article describes the joint design and precleaning and surface preparation for soldering. It addresses some general considerations in the soldering of electronic devices. Soldering process parameters, affecting wetting and spreading phenomena, such as temperature, time, vapor pressure, metallurgical and chemical nature of the surfaces, and surface geometry, are discussed. The article also describes the applications of furnace soldering, resistance soldering, infrared soldering, and ultrasonic soldering. It contains a table that lists tests commonly used to evaluate the solderability properties of selected soldered components.

Laser soldering uses a well-focused, highly controlled beam to deliver energy to a desired location for a precisely measured length of time. This article focuses on two types of laser soldering operations, namely, blind laser soldering and intelligent laser soldering. It discusses the function of the blind laser soldering and provides a brief description on key attributes of the blind laser soldering, including repeatability, speed, quality, safety, and flexibility. The article explores the function of the intelligent laser soldering and concludes with a section on key attributes of the intelligent laser soldering. The key attributes of the intelligent laser soldering include repeatability, speed, quality, safety, cost, and flexibility.

This article presents an introduction to brazing, including information on its mechanics, advantages, and limitations. It reviews soldering with emphasis on chronology, solder metals, and flux technology. The article also provides useful information on mass, wave, and drag soldering. It presents a table which contains information on the comparison of soldering, brazing, and welding.

Vapor-phase soldering is a process of condensation heating in which the product prepared for soldering is passed through or into a layer of saturated vapor. This article provides an overview of the soldering process with emphasis on its applications and the equipment used.

Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most common impurity elements in tin-lead solders. It describes the various processes involved in the successful soldering of joints, including shaping the parts to fit closely together; cleaning and preparing the surfaces to be joined; applying a flux; assembling the parts; and applying the heat and solder.

Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters is explored using examples of both structural and electronic applications. The article concludes with a discussion on the environmental, safety, and health issues to be considered during soldering.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

This article focuses on the use of indium and bismuth in low-melting-temperature solders and fusible alloys. It describes how the two elements typically occur in nature and how they are recovered and processed for commercial use. It also provides information on designations, classification, composition, properties (including temperatures ranges), and some of the other ways in which indium and bismuth alloys are used.

This article is a compilation of definitions for terms related to welding fundamentals and all welding processes. The processes include arc and resistance welding, friction stir welding, laser beam welding, explosive welding, and ultrasonic welding.

This article overviews the classification of welding processes and the key process embodiments for joining by various fusion welding processes: fusion welding with chemical sources for heating; fusion welding with electrical energy sources, such as arc welding or resistance welding; and fusion welding with directed energy sources, such as laser welding, electron beam welding. The article reviews the different types of nonfusion welding processes, regardless of the particular energy source, which is usually mechanical but can be chemical, and related subprocesses of brazing and soldering.

Fabrication of wrought stainless steels requires use of greater power, more frequent repair or replacement of processing equipment, and application of procedures to minimize or correct surface contamination because of its greater strength, hardness, ductility, work hardenability and corrosion resistance. This article provides a detailed account of such difficulties encountered in the fabrication of wrought stainless steel by forming, forging, cold working, machining, heat treating, and joining processes. Stainless steels are subjected to various heat treatments such as annealing, hardening, and stress relieving. Stainless steels are commonly joined by welding, brazing, and soldering. The article lists the procedures and precautions that should be instituted during welding to ensure optimum corrosion resistance and mechanical properties in the completed assembly.

Precious metals are of inestimable value to modern civilization. This article discusses the resources and consumption, trade practices, and special properties of precious metals and its alloys, including ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold, and tabulates the industrial applications of precious metals. It provides information on the commercial forms (wire, rod, sheet, strip, ribbon, and foil) and uses of precious metals, including semifinished products, precious metal powders, industrial uses, coatings, and jewelry.

Brazing and soldering are done at temperatures below the solidus temperature of the base material but high enough to melt the filler metal and allow the liquid filler metal to wet the surface and spread into the joint gap by capillary action. This article discusses the common advantages of both brazing and soldering. It describes the brazing and soldering of cast irons, as well as the selection of brazing filler material. The article discusses various brazing methods: torch brazing, induction brazing, salt-bath brazing, and furnace brazing. It concludes with information on the application examples of brazing of cast iron.

This article provides an overview of the types, properties, and applications of traditional and advanced ceramics and glasses. Principal product areas for traditional ceramics include whitewares, glazes, porcelain enamels, structural clay products, cements, and refractories. Advanced ceramics include electronic ceramics, optical ceramics, magnetic ceramics, and structural ceramics.

This article describes the factors considered in the analysis of brazeability and solderability of engineering materials. These are the wetting and spreading behavior, joint mechanical properties, corrosion resistance, metallurgical considerations, and residual stress levels. It discusses the application of brazed and soldered joints in sophisticated mechanical assemblies, such as aerospace equipment, chemical reactors, electronic packaging, nuclear applications, and heat exchangers. The article also provides a detailed discussion on the joining process characteristics of different types of engineering materials considered in the selection of a brazing process. The engineering materials include low-carbon steels, low-alloy steels, and tool steels; cast irons; aluminum alloys; copper and copper alloys; nickel-base alloys; heat-resistant alloys; titanium and titanium alloys; refractory metals; cobalt-base alloys; and ceramic materials.