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indium plating
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Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001249
EISBN: 978-1-62708-170-2
...Abstract Abstract This article focuses on the electrodeposition of indium and its alloys, such as indium-antimony, indium-gallium, and indium-bismuth, in nonaqueous indium plating baths. It also provides information on the stripping of indium plate from plated components and presents...
Abstract
This article focuses on the electrodeposition of indium and its alloys, such as indium-antimony, indium-gallium, and indium-bismuth, in nonaqueous indium plating baths. It also provides information on the stripping of indium plate from plated components and presents an overview of the specifications, standards, and hazards of indium plating.
Book Chapter
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003215
EISBN: 978-1-62708-199-3
..., and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating...
Abstract
Copper can be electrodeposited from numerous electrolytes. Cyanide and pyrophosphate alkalines, along with sulfate and fluoborate acid baths, are the primary electrolytes used in copper plating. This article provides information on the chemical composition, plating baths, and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating. The article also discusses selective plating, electroforming, and other processes and where they are typically used.
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001092
EISBN: 978-1-62708-162-7
... as an oxygen scavenger, resulting in alloys with improved tensile strength, ductility, and resistance to discoloration. Indium is still used in dental alloys. Dr. Murray originally was interested in using indium as an addition to silver-plated flatware. During the period from 1926 to 1934, he and his...
Abstract
This article focuses on the use of indium and bismuth in low-melting-temperature solders and fusible alloys. It describes how the two elements typically occur in nature and how they are recovered and processed for commercial use. It also provides information on designations, classification, composition, properties (including temperatures ranges), and some of the other ways in which indium and bismuth alloys are used.
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003636
EISBN: 978-1-62708-182-5
... of the embrittling species similar to that proposed for LMIE controls crack propagation. Investigations of SMIE The first investigations of delayed failure were reported in cadmium-, zinc-, and indium-plated tensile specimens of 4340, 4130, 4140, and 18% Ni maraging steel in the temperature range of 200...
Abstract
Embrittlement that occurs below the melting point of the embrittling species is known as solid metal induced embrittlement (SMIE) of metals. This article provides a discussion on the characteristics and investigations of SMIE, liquid metal induced embrittlement, and delayed failure. It also describes the mechanism of SMIE.
Book Chapter
Book: Corrosion: Materials
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0006541
EISBN: 978-1-62708-183-2
... (Cu) G Lead Paint H Tin, indium, Sn-Pb Paint I Stainless steel, martensitic and ferritic Paint or resin J Chromium, molybdenum, tungsten Metallic coating K Stainless steel, austenitic, precipitation hardened, heat resistant Metallic coating L Brass, leaded bronze Metallic...
Abstract
This guide rates the compatibility of dissimilar structural materials joined together for service in seawater, marine atmosphere, or industrial atmosphere. It contains a table that indicates the material code and most generally effective surface treatment typically used to reduce corrosion of bare metals.
Book Chapter
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001261
EISBN: 978-1-62708-170-2
...-speed alkaline for heavy buildup) Copper (neutral) Iron Lead (alkaline) Lead (for alloying) Tin (alkaline) Zinc (acid) Zinc (alkaline) Zinc (bright) Zinc (neutral) Plating solutions for precious metals Gallium Gold (acid) Gold (alkaline) Gold (neutral) Indium...
Abstract
Selective plating, also known as brush plating, differs from traditional tank or bath plating in that the workpiece is not immersed in a plating solution (electrolyte). Instead, the electrolyte is brought to the part and applied by a handheld anode or stylus, which incorporates an absorbent wrapping for applying the solution to the workpiece (cathode). This article focuses on the selective plating systems that include a power pack, plating tools, anode covers, specially formulated plating solutions, and any auxiliary equipment required for the particular application. It provides a detailed account of the applications of selective plating, with examples. The article describes the advantages, limitations, key process elements, and health and safety considerations of selective plating. It also includes the most important industrial, government, and military specifications.
Book Chapter
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003211
EISBN: 978-1-62708-199-3
... sensitivity of the substrate material, the temperature conditions that are expected during service, and the pasty range of the alloy. The melting characteristics of solders are expressed as the solidus and the liquidus temperatures for the alloy. Solders composed of one metallic element, such as tin or indium...
Abstract
Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most common impurity elements in tin-lead solders. It describes the various processes involved in the successful soldering of joints, including shaping the parts to fit closely together; cleaning and preparing the surfaces to be joined; applying a flux; assembling the parts; and applying the heat and solder.
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003635
EISBN: 978-1-62708-182-5
... are not embrittled by mercury. However, indium dissolved in mercury embrittles both polycrystalline and single-crystal cadmium ( Fig. 3 ). The embrittlement of titanium and its alloys by both liquid and solid cadmium is well recognized by the aircraft industry. Cadmium-plated fasteners of both titanium and steel...
Abstract
Liquid metal induced embrittlement (LMIE) is the reduction of the fracture resistance of a solid material during exposure to a liquid metal. This article discusses the mechanisms and occurrence condition of LMIE and describes the effects of metallurgical factors, such as grain size, temperature and strain rate, stress, inert carriers, and fatigue, on LMIE. It provides a detailed discussion on LMIE in ferrous and nonferrous metals and their alloys. In addition, the article highlights the ways of preventing embrittlement in metals and alloys.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
..., when compared with tin-lead alloys. Tin plate is sometimes used as a protective finish on device leads and terminations, although a solder dip coating is the preferred finish. Tin-base tin-lead solders represent the most widely used solders for electronic assembly: eutectic 63Sn-37Pb, near-eutectic...
Abstract
Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001284
EISBN: 978-1-62708-170-2
... and kinetic processes responsible for epitaxial growth also are presented. Technique Principles Vapor-Phase Epitaxy Tietjen and Amick ( Ref 1 ) demonstrated the growth of gallium arsenide phosphide (GaAsP) by VPE in 1966. The growth of materials based on indium phosphide (InP) can be achieved...
Abstract
This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.
Book Chapter
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003219
EISBN: 978-1-62708-199-3
...Abstract Abstract Physical vapor deposition (PVD) coatings are harder than any metal and are used in applications that cannot tolerate even microscopic wear losses. This article describes the three most common PVD processes: thermal evaporation, sputtering, and ion plating. It also discusses...
Abstract
Physical vapor deposition (PVD) coatings are harder than any metal and are used in applications that cannot tolerate even microscopic wear losses. This article describes the three most common PVD processes: thermal evaporation, sputtering, and ion plating. It also discusses ion implantation in the context of research and development applications.
Series: ASM Handbook
Volume: 9
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.hb.v09.a0003778
EISBN: 978-1-62708-177-1
... of the microstructures of tin-copper, tin-lead, tin-lead-cadmium, tin-antimony, tin-antimony-copper, tin-antimony-copper-lead, tin-silver, tin-indium, tin-zinc, and tin-zinc-copper systems. electron microscopy etchants etching grinding metallography microstructure mounting polishing sectioning specimen...
Abstract
This article describes the specimen preparation steps for tin and tin alloys, and for harder base metals which are coated with these materials with illustrations. The steps discussed include sectioning, mounting, grinding, polishing, and etching. The article provides information on etchants for tin and tin alloys in tabular form. It presents the procedure recommended for electron microscopy to determine the nature of the intermetallic compound formed by the reaction between tin or tin-lead coatings on various substrates. The article concludes with an illustration of the microstructures of tin-copper, tin-lead, tin-lead-cadmium, tin-antimony, tin-antimony-copper, tin-antimony-copper-lead, tin-silver, tin-indium, tin-zinc, and tin-zinc-copper systems.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001253
EISBN: 978-1-62708-170-2
...Abstract Abstract Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative...
Abstract
Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative and industrial applications of gold plating. The article reviews factors affecting the dragout of gold solution.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001289
EISBN: 978-1-62708-170-2
... and ZrO 2 ) Deposition of optically clear, electrically conducting layers (indium-tin-oxide) ( Ref 112 ) Deposition of permeation barriers on webs ( Ref 113 , 114 , 115 ) Ion plating has also been used to coat very large structural parts with aluminum for corrosion protection (replacing...
Abstract
This article begins with a list of the factors that influence the properties of physical vapor deposited films. It describes the steps involved in ion plating, namely, surface preparation, nucleation, interface formation, and film growth. The article discusses the factors influencing the properties of ion-plated films. The sources of potential applied on substrate surface, bombarding species, and depositing species are addressed. The article also provides information on the parameters that influence bombardment. It concludes with a discussion on the advantages, limitations, and applications of ion plating.
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001078
EISBN: 978-1-62708-162-7
... grouped according to nominal chemical composition. The properties of lead that make it useful in a wide variety of applications are also discussed. The largest usage of lead is in the lead acid storage batteries (in the grid plates, posts, and connector straps). Other applications include ammunition...
Abstract
This article discusses the processing, properties, and applications of various grades of lead and lead-base alloys with the aid of several tables and illustrations. It lists the Unified Numbering System (UNS) designations for various pure lead grades and lead-base alloys grouped according to nominal chemical composition. The properties of lead that make it useful in a wide variety of applications are also discussed. The largest usage of lead is in the lead acid storage batteries (in the grid plates, posts, and connector straps). Other applications include ammunition; cable sheathing; cast products such as type metals, terneplates, and foils; and building construction materials. Lead is also used as an alloying element in steel and in copper alloys to improve machinability and other characteristics. In many applications, lead is combined with stronger materials to make structures that have the best qualities of both materials such as the plumbum series.
Book Chapter
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006412
EISBN: 978-1-62708-192-4
... surfaces are all b-sub-group metals, with effective atomic radii substantially greater than that of iron. Only seven of these metals are commercially significant: silver, cadmium, indium, tin, antimony, lead, and bismuth. Of these, tin and lead offer the most attractive combinations of cost, availability...
Abstract
A sliding bearing (plain bearing) is a machine element designed to transmit loads or reaction forces to a shaft that rotates relative to the bearing. This article discusses the properties of bearing materials. It provides information on bearing material systems: single-metal systems, bimetal systems, and trimetal systems. The article describes the designations, nominal compositions, mechanical properties, and applications of various sliding bearing alloys: tin-base alloys, lead-base alloys, copper-base alloys, aluminum-base alloys, silver-base alloys, zinc-base alloys, additional metallic materials, nonmetallic materials. It describes casting processes, powder metallurgy processes, and electroplating processes. The article also discusses the selection criteria for bearing materials.
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006639
EISBN: 978-1-62708-213-6
... generating the signal for a spectral line. A detector is generally a channel plate or an electron multiplier. Fig. 8 Schematic presentation of a spherical-sector analyzer with a monochromatized x-ray source, reprinted with permission from Elsevier ( Ref 10 ) Modern machines employ...
Abstract
This article focuses on the principles and applications of X-ray photoelectron spectroscopy (XPS) for the analysis of elemental and chemical composition. The discussion covers the nomenclature, instruments, and specimen preparation process of XPS. Some of the factors pertinent to the calibration of materials for accurate measurements using XPS are provided, along with some aspects of the accuracy in quantitative analysis by XPS. In addition, the article presents examples of how XPS data can be used to solve problems with surface interactions.
Series: ASM Handbook
Volume: 5B
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v05b.a0006027
EISBN: 978-1-62708-172-6
... commonly plated are copper, chromium, nickel, iron, cadmium, zinc, indium, tin, lead, silver, and gold. Brass, bronze, zinc-iron, and zinc-nickel alloys also are plated. Each of these metals requires a different bath and different bath operating parameters (temperature, cathode current density, voltage, pH...
Abstract
This article provides a brief discussion on the common types of overlayers that can be used on a metal surface to protect it from corrosion. These overlayers include phosphate, chromate, and chromate-free conversion coatings; hot dip galvanizing; cementitious linings; glass and porcelain enamels; electroplating; thermal spray coatings; and rubber linings.
Book Chapter
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003167
EISBN: 978-1-62708-199-3
... corrosion resistance. Tin also increases wear resistance. Both copper and indium enhance fatigue resistance. Plated overlays generally range in thickness from 0.013 to 0.05 mm (0.0005 to 0.002 in.), with fatigue life increasing markedly as overlay thickness decreases. Copper-Base Alloys Copper-base...
Abstract
A sliding bearing (plain bearing) is a machine element designed to transmit loads or reaction forces to a shaft that rotates relative to the bearing. This article explains the role of wear damage mechanisms in the design and selection of bearing materials, and its relationship with bearing material properties. Sliding bearings are commonly classified by terms that describe their application; they also are classified according to material construction, as single-metal, bimetal, or trimetal sliding bearings. The article further provides detailed tabular data on the designation and composition of the following types of bearing materials: tin-base alloys, lead-base alloys, copper-base alloys, and aluminum-base alloys. It also briefly discusses the following types of bearing materials: zinc-base alloys, silver-base alloys, gray cast irons, cemented carbides, and nonmetallic bearing materials.
Series: ASM Handbook
Volume: 2A
Publisher: ASM International
Published: 30 November 2018
DOI: 10.31399/asm.hb.v02a.a0006491
EISBN: 978-1-62708-207-5
...Abstract Abstract Aluminum components are often plated with other metals to mitigate the effects of corrosion and wear, improve application performance, and extend service life. This article discusses some of the more common aluminum plating processes, including electroplating, immersion...
Abstract
Aluminum components are often plated with other metals to mitigate the effects of corrosion and wear, improve application performance, and extend service life. This article discusses some of the more common aluminum plating processes, including electroplating, immersion plating, and electroless plating, and describes various plating materials and the types of applications in which they are used. It provides critical processing details such as temperatures, ratios, ranges, times, and rates. The article explains how to prepare aluminum components for electroplating, discussing surface roughening, anodizing, and immersion procedures along with expected results.