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indium plating

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Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001249
EISBN: 978-1-62708-170-2
...Abstract Abstract This article focuses on the electrodeposition of indium and its alloys, such as indium-antimony, indium-gallium, and indium-bismuth, in nonaqueous indium plating baths. It also provides information on the stripping of indium plate from plated components and presents...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003215
EISBN: 978-1-62708-199-3
..., and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001092
EISBN: 978-1-62708-162-7
... as an oxygen scavenger, resulting in alloys with improved tensile strength, ductility, and resistance to discoloration. Indium is still used in dental alloys. Dr. Murray originally was interested in using indium as an addition to silver-plated flatware. During the period from 1926 to 1934, he and his...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003636
EISBN: 978-1-62708-182-5
... of the embrittling species similar to that proposed for LMIE controls crack propagation. Investigations of SMIE The first investigations of delayed failure were reported in cadmium-, zinc-, and indium-plated tensile specimens of 4340, 4130, 4140, and 18% Ni maraging steel in the temperature range of 200...
Book Chapter

Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0006541
EISBN: 978-1-62708-183-2
... (Cu) G Lead Paint H Tin, indium, Sn-Pb Paint I Stainless steel, martensitic and ferritic Paint or resin J Chromium, molybdenum, tungsten Metallic coating K Stainless steel, austenitic, precipitation hardened, heat resistant Metallic coating L Brass, leaded bronze Metallic...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001261
EISBN: 978-1-62708-170-2
...-speed alkaline for heavy buildup) Copper (neutral) Iron Lead (alkaline) Lead (for alloying) Tin (alkaline) Zinc (acid) Zinc (alkaline) Zinc (bright) Zinc (neutral) Plating solutions for precious metals Gallium Gold (acid) Gold (alkaline) Gold (neutral) Indium...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003211
EISBN: 978-1-62708-199-3
... sensitivity of the substrate material, the temperature conditions that are expected during service, and the pasty range of the alloy. The melting characteristics of solders are expressed as the solidus and the liquidus temperatures for the alloy. Solders composed of one metallic element, such as tin or indium...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003635
EISBN: 978-1-62708-182-5
... are not embrittled by mercury. However, indium dissolved in mercury embrittles both polycrystalline and single-crystal cadmium ( Fig. 3 ). The embrittlement of titanium and its alloys by both liquid and solid cadmium is well recognized by the aircraft industry. Cadmium-plated fasteners of both titanium and steel...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
..., when compared with tin-lead alloys. Tin plate is sometimes used as a protective finish on device leads and terminations, although a solder dip coating is the preferred finish. Tin-base tin-lead solders represent the most widely used solders for electronic assembly: eutectic 63Sn-37Pb, near-eutectic...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001284
EISBN: 978-1-62708-170-2
... and kinetic processes responsible for epitaxial growth also are presented. Technique Principles Vapor-Phase Epitaxy Tietjen and Amick ( Ref 1 ) demonstrated the growth of gallium arsenide phosphide (GaAsP) by VPE in 1966. The growth of materials based on indium phosphide (InP) can be achieved...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003219
EISBN: 978-1-62708-199-3
...Abstract Abstract Physical vapor deposition (PVD) coatings are harder than any metal and are used in applications that cannot tolerate even microscopic wear losses. This article describes the three most common PVD processes: thermal evaporation, sputtering, and ion plating. It also discusses...
Series: ASM Handbook
Volume: 9
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.hb.v09.a0003778
EISBN: 978-1-62708-177-1
... of the microstructures of tin-copper, tin-lead, tin-lead-cadmium, tin-antimony, tin-antimony-copper, tin-antimony-copper-lead, tin-silver, tin-indium, tin-zinc, and tin-zinc-copper systems. electron microscopy etchants etching grinding metallography microstructure mounting polishing sectioning specimen...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001253
EISBN: 978-1-62708-170-2
...Abstract Abstract Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative...
Book Chapter

By Donald M. Mattox
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001289
EISBN: 978-1-62708-170-2
... and ZrO 2 ) Deposition of optically clear, electrically conducting layers (indium-tin-oxide) ( Ref 112 ) Deposition of permeation barriers on webs ( Ref 113 , 114 , 115 ) Ion plating has also been used to coat very large structural parts with aluminum for corrosion protection (replacing...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001078
EISBN: 978-1-62708-162-7
... grouped according to nominal chemical composition. The properties of lead that make it useful in a wide variety of applications are also discussed. The largest usage of lead is in the lead acid storage batteries (in the grid plates, posts, and connector straps). Other applications include ammunition...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006412
EISBN: 978-1-62708-192-4
... surfaces are all b-sub-group metals, with effective atomic radii substantially greater than that of iron. Only seven of these metals are commercially significant: silver, cadmium, indium, tin, antimony, lead, and bismuth. Of these, tin and lead offer the most attractive combinations of cost, availability...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006639
EISBN: 978-1-62708-213-6
... generating the signal for a spectral line. A detector is generally a channel plate or an electron multiplier. Fig. 8 Schematic presentation of a spherical-sector analyzer with a monochromatized x-ray source, reprinted with permission from Elsevier ( Ref 10 ) Modern machines employ...
Series: ASM Handbook
Volume: 5B
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v05b.a0006027
EISBN: 978-1-62708-172-6
... commonly plated are copper, chromium, nickel, iron, cadmium, zinc, indium, tin, lead, silver, and gold. Brass, bronze, zinc-iron, and zinc-nickel alloys also are plated. Each of these metals requires a different bath and different bath operating parameters (temperature, cathode current density, voltage, pH...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003167
EISBN: 978-1-62708-199-3
... corrosion resistance. Tin also increases wear resistance. Both copper and indium enhance fatigue resistance. Plated overlays generally range in thickness from 0.013 to 0.05 mm (0.0005 to 0.002 in.), with fatigue life increasing markedly as overlay thickness decreases. Copper-Base Alloys Copper-base...
Series: ASM Handbook
Volume: 2A
Publisher: ASM International
Published: 30 November 2018
DOI: 10.31399/asm.hb.v02a.a0006491
EISBN: 978-1-62708-207-5
...Abstract Abstract Aluminum components are often plated with other metals to mitigate the effects of corrosion and wear, improve application performance, and extend service life. This article discusses some of the more common aluminum plating processes, including electroplating, immersion...