Search Results for in-situ film growth

This article focuses on different thin-film deposition techniques used to make superconducting films and discusses the properties and advantages of high-critical-temperature and low-critical-temperature materials in a number of applications, including signal processing and analog electronic devices. The article gives a brief introduction on superconducting materials, substrates and buffer layers and discusses the major deposition techniques such as, electron-beam co-evaporation, sputtering from either a composite target or multiple sources and laser ablation. The article also describes the in-situ film growth techniques for producing atomic oxygen by radio frequency excitation or microwave discharge or with ozone.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

This article reviews the types of passivity and presents tactics that employ passivity to control corrosion. Thermodynamics provides a guide to the conditions under which passivation becomes possible. A valuable guide to thermodynamics is the potential-pH diagram and the Pourbaix diagram. The article presents a potential-pH diagram for the iron-water system and an illustration of an idealized anodic polarization curve for a metal surface, which serves as a basis for describing the kinetics of passivation. It discusses five properties of passive films: thickness, composition, structure, electronic properties, and mechanical properties. The article outlines three possible processes that can form passive films: direct film formation, dissolution precipitation, and anodic oxidation of metal ions in solution. It describes the breakdown of the passive film using various models and highlighting the effect of alloy composition and structure.

This article describes measurement techniques for the three basic types of adhesion: fundamental adhesion, thermodynamic adhesion, and practical adhesion. It discusses common measurement methods for each type of adhesion with the main focus on practical adhesion testing of coatings and thin films. The article provides an insight into the mechanisms of environmentally induced interfacial degradation by discussing the fundamental aspects of adhesion between two dissimilar materials. It examines the use of adhesion tests in the evaluation of stress-corrosion cracking within bimaterial interfaces. Testing techniques for <i>in situ</i> environmental testing of thin-film adhesion are also reviewed.

This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition, and postdeposition changes. It also discusses the effects and causes of growth-related properties of films deposited by physical vapor deposition processes, including residual film stress, density, and adhesion.

This article presents a general description of pulsed-laser deposition. It describes the components of pulsed-laser deposition equipment. The article also discusses the effects of angular distribution of materials. Finally, the article reviews the characteristics of high-temperature superconductors and ferroelectric materials.

Low-energy electron diffraction (LEED) is a technique for investigating the crystallography of surfaces and overlayers adsorbed on surfaces. This article describes the principles of diffraction from surfaces, and elucidates the method of sample preparation to achieve diffraction patterns. The article describes the limitations of surface sensitive electron diffraction and discusses the applications of LEED with examples.

This article begins with a list of the factors that influence the properties of physical vapor deposited films. It describes the steps involved in ion plating, namely, surface preparation, nucleation, interface formation, and film growth. The article discusses the factors influencing the properties of ion-plated films. The sources of potential applied on substrate surface, bombarding species, and depositing species are addressed. The article also provides information on the parameters that influence bombardment. It concludes with a discussion on the advantages, limitations, and applications of ion plating.

For a wide range of new or better products, solidification processing of metallic materials from the melt is a step of uppermost importance in the industrial production chain. This article discusses the casting and solidification of molten metallic alloy along with the application of low-gravity platforms and facilities for solidification processing. It provides a description of dendritic growth studies and electromagnetic levitation. The article concludes with information on the in situ and real-time monitoring of solidification processing.

This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.

Low-energy electron diffraction (LEED) is a technique for investigating the crystallography of surfaces and overlayers adsorbed on surfaces. This article provides a brief account of LEED, covering the principles and measurements of diffraction from surfaces. Some of the processes involved in sample preparation are described. In addition, the article discusses the limitations of surface-sensitive electron diffraction and the applications of LEED with examples.

Diffusion brazing (DFB) is a process that coalesces, or joins, metals by heating them to a suitable brazing temperature at which either a preplaced filler metal will melt and flow by capillary attraction or a liquid phase will form in situ between one faying surface and another. This article discusses the two critical aspects of DFB, namely, a liquid filler metal must be formed and become active in the joint area and extensive diffusion of filler metal elements into the base metal must occur. It schematically illustrates a diffusion process that results in the loss of identity of original brazed joint. The article also discusses the advantages of DFB.

X-ray topography is a technique that comprises topography and x-ray diffraction. This article provides a description of the kinematical theory and the dynamical theory of diffraction. It provides useful information on the configurations of reflection and transmission topography. The article explains various topographic methods, namely, divergent beam method, polycrystal rocking curve analysis, line broadening analysis, microbeam method, and polycrystal scattering topography, as well as their instrumentation. It also describes the applications of x-ray topography.

This article discusses the fundamentals of thermal vaporization and condensation and provides information on the various vaporization sources and methods of vacuum deposition. It offers an overview of reactive evaporation and its deposition techniques. The article also explains the advantages, limitations, and applications of vacuum deposition processes. Finally, it provides information on the gas evaporation process, its processing chamber, and related systems.

This article describes two variations of carbon-base coatings: diamondlike carbon (DLC) coatings and polycrystalline diamond (PCD) coatings. It discusses the basics of a few deposition methods as they apply to industrially relevant coatings. The methods include deposition of tungsten-containing hydrogenated amorphous carbon films, deposition of tetrahedral amorphous carbon films, and deposition of silicon-incorporated hydrogenated amorphous carbon films. The most common deposition technologies for diamond films are also discussed. The article provides information on surface preparation for DLC and diamond deposition. It also provides a discussion on the coating composition and structure, mechanical and tribological properties, and applications of DLC and diamond coatings. The quality control techniques for DLC and diamond coatings are specified to meet customer requirements and ensure repeatable quality.

Polymer materials are key building blocks of the modern world, commonly used in packaging, automobiles, building materials, electronics, telecommunications, and many other industries. These commercial applications of polymeric materials would not be possible without the use of additives. This article is divided into five sections: mechanical property modifiers, physical property modifiers, biological function modifiers, processing aids, and colorants. It describes three classes of additives that are used to inhibit biological activity, six classes of mechanical property modifiers, three classes of physical property modifiers, and two classes of both colorants and processing aids.

X-ray topography is the general term for a family of x-ray diffraction imaging techniques capable of providing information on the nature and distribution of imperfections. This article provides a detailed account of x-ray topography techniques, providing information on the historical background and development trends in x-ray diffraction topography. The discussion covers the general principles, components of systems, and applications of x-ray topography techniques, namely conventional X-ray topographic techniques and synchrotron x-ray topographic techniques.

This article describes the types, mechanism, and typical test methods along with their configurations for the evaluation of hydrogen embrittlement, stress-corrosion cracking, and corrosion fatigue with an emphasis on fracture mechanics methodologies for metals. An overview on the environmentally assisted crack growth of polymers is also included. The article details the evaluation of nanoscale environmental effects and indentation-induced cohesive cracking. It also provides information on scanning probe microscopy.

This article summarizes the understanding of the mechanisms and mechanical effects of fatigue processes in highly brittle materials, with particular emphasis on ceramics. It provides a discussion on room-temperature fatigue crack growth in monolithic ceramics, transformation-toughened ceramics, and ceramic composites under cyclic compression. The cyclic damage zones ahead of tensile fatigue cracks, crack propagation under cyclic tension or tension-compression loads, and elevated-temperature fatigue crack growth in monotonic and composite ceramics, are discussed. The article presents ceramic fatigue data for fatigue crack growth testing and concludes with a discussion on life prediction for ceramics or ceramic-matrix composites.

Scanning electron microscopy (SEM) has unique capabilities for analyzing fracture surfaces. This article discusses the basic principles and practice of SEM, with an emphasis on its applications in fractography. The topics include an introduction to SEM instrumentation, imaging and analytical capabilities, specimen preparation, and the interpretation of fracture features. SEM can be subdivided into four systems, namely, illuminating/imaging, information, display, and vacuum systems. The article also describes the major criteria and techniques of SEM specimen preparation, and the general features of ductile and brittle fracture modes.