Aluminum or aluminum alloy products have various types of finishes applied to their surfaces to enhance appearance or improve functional properties. This article discusses the procedures, considerations, and applications of various methods employed in the cleaning, finishing, and coating of aluminum. These include abrasive blast cleaning, barrel finishing, polishing, buffing, satin finishing, chemical cleaning, chemical brightening, electrolytic brightening, chemical etching, alkaline etching, acid etching, chemical conversion coating, electroplating, immersion plating, electroless plating, porcelain enameling, and shot peening.

The selection of surface treatments for copper and copper alloys is generally based on application requirements for appearance and corrosion resistance. This article describes cleaning, finishing, and coating processes for copper and copper alloys. These processes include pickling and bright dipping, abrasive blast cleaning, chemical and electrochemical cleaning, mass finishing, polishing and buffing, electroless plating, immersion plating, electroplating, passivation, coloring, and organic coatings.

Selective plating, also known as brush plating, differs from traditional tank or bath plating in that the workpiece is not immersed in a plating solution (electrolyte). Instead, the electrolyte is brought to the part and applied by a handheld anode or stylus, which incorporates an absorbent wrapping for applying the solution to the workpiece (cathode). This article focuses on the selective plating systems that include a power pack, plating tools, anode covers, specially formulated plating solutions, and any auxiliary equipment required for the particular application. It provides a detailed account of the applications of selective plating, with examples. The article describes the advantages, limitations, key process elements, and health and safety considerations of selective plating. It also includes the most important industrial, government, and military specifications.

This article focuses on the electroless gold plating technique, describing the advantages and limitations, applications, and properties of plated deposits. It also reviews process variables of the technique, including gold concentration, reducing agent, agitation, and contaminants.

Electroless nickel plating is used to deposit nickel without the use of an electric current. This article provides an overview of the solution composition and characteristics of the electroless nickel bath. It focuses on the metallurgical, mechanical and physical properties of electroless nickel-phosphorus coatings and electroless nickel-boron coatings. The effect of electroless nickel coatings on the fatigue strength of steel is also described. The article includes information on the recommended pretreatment procedures for different ferrous alloys, aluminum alloys, and copper alloys. It presents a detailed account of the equipment and various processes—including bulk and barrel plating—involved in electroless nickel plating, and discusses hydrogen relief methods. The article includes a comprehensive table on nickel plating applications, and concludes with information on electroless nickel coatings on composites and plastics.

Electroless, or autocatalytic, metal plating is a nonelectrolytic method of deposition from solution that can be plated uniformly over all surfaces, regardless of size and shape. The plating's ability to plate onto nonconductors is an advantage that contributes to the choice of electroless copper in various applications. This article provides information on the bath chemistry and deposit properties of electroless copper and discusses the applications of electroless copper plating, such as printed wiring boards, decorative plating-on-plastic, electromagnetic interference shielding, and hybrid and other advanced applications. It describes two commercial processes, pretreatment and post-treatment. The article reviews the solutions used, controls and control equipment, and performance criteria of electroless copper plating. It concludes with information on the environmental and safety issues associated with electroless copper plating.

Electroplated silver is used in both decorative and functional applications, such as engineering and electrical/electronic applications. This article explains the solution formulations and specifications of electrolytes used in silver plating.

Electrodeposits of cadmium are used to protect steel and cast iron against corrosion. This article provides an overview of the surface preparation of, and brighteners used in, cyanide baths. It focuses on the anode system, current density, deposition rates, and bath temperature of cadmium plating with attention to the materials of construction and equipment used. The article provides a description of the selection of plating method with examples, applications, and several postplating processes of cadmium plating.

Lead has been deposited from a variety of electrolytes, including fluoborates, fluosilicates, sulfamates, and methane sulfonic acid baths. This article provides a discussion on these electrolytic baths and includes information on the process sequence, equipment requirements, and applications of lead plating.

This article focuses on the electrodeposition of indium and its alloys, such as indium-antimony, indium-gallium, and indium-bismuth, in nonaqueous indium plating baths. It also provides information on the stripping of indium plate from plated components and presents an overview of the specifications, standards, and hazards of indium plating.

This article provides a detailed account of the various alkaline and acid plating baths used for electrolytic copper plating. Dilute cyanide and Rochelle cyanide baths, high-efficiency sodium and potassium cyanide baths, alkaline noncyanide copper plating baths, and alkaline copper pyrophosphate baths, are discussed. The article reviews acid plating baths such as copper sulfate bath and copper fluoborate bath. It also presents information on the surface preparation considerations, bath composition, and operating variables of copper plating as well as the equipment used.

Hard chromium plating is produced by electrodeposition from a solution containing chromic acid and a catalytic anion in proper proportion. This article presents the major uses of hard chromium plating, and focuses on the selection factors, plating solutions, solution and process control, equipment, surface preparation, and crack patterns and other characteristics of hard chromium plating. It offers recommendations for the design and use of plating racks, describes the problems encountered in hard chromium plating, and their corrective procedures. The article provides information on the removal of chromium plate from coated metals, recovery and disposal of wastes, and stopoff media for selective plating.

This article discusses the process considerations and deposit properties of nickel plating. It describes the Watts solution and the anode materials used. The article focuses on the nickel plating processes used for decorative, engineering, and electroforming purposes. It provides information on the quality control of nickel plating. It concludes with a review of the environmental, health, and safety considerations associated with nickel plating.

Most decorative chromium coatings have been applied using hexavalent and trivalent plating processes that are based on chromic anhydride. This article provides a discussion on chromium electrodeposits and their use as microdiscontinuous coating for corrosion protection. It focuses on the operating conditions of various chromium plating parameters: bath composition, temperature, voltage, anode materials, and current density. These parameters need to be considered for obtaining high quality decorative chromium coatings. An overview of plating problems encountered in chromium plating and their corrections is also provided.

Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative and industrial applications of gold plating. The article reviews factors affecting the dragout of gold solution.

A tin deposit provides sacrificial protection to copper, nickel, and many other nonferrous metals and alloys. Tin also provides good protection to steel. Tin can be deposited from either alkaline or acid electrolytes. This article explains the compositions and operating conditions of these electrolytes.

Electrodeposition of tin alloys is used to protect steel against corrosion or wear, to impart resistance to etching, and to facilitate soldering. This article focuses on the compositions, operating conditions, advantages, and limitations of methane sulfonic acid plating solutions and fluoborate plating solutions for tin-lead. It briefly describes the solution compositions and operating conditions of tin-bismuth, tin-nickel, and tin-zinc.

Commercial zinc plating is accomplished by a number of distinctively different systems: cyanide baths, alkaline noncyanide baths, and acid chloride baths. This article focuses on the composition, advantages, disadvantages, operating parameters, and applications of each of the baths. It provides information on the control of thicknesses of zinc specified for service in various indoor and outdoor atmospheres and on the similarities between cadmium and zinc plating.

Copper can be electrodeposited from numerous electrolytes. Cyanide and pyrophosphate alkalines, along with sulfate and fluoborate acid baths, are the primary electrolytes used in copper plating. This article provides information on the chemical composition, plating baths, and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating. The article also discusses selective plating, electroforming, and other processes and where they are typically used.

This article discusses the advantages, disadvantages, applications, and selection criteria of various technologies and transduction modalities that can generate and detect ultrasonic waves. These include piezoelectric transducers, electromagnetic acoustic transducers (EMATs), laser ultrasound phased array transducers, magnetostriction transducers, and couplants. The article discusses four basic types of search units with piezoelectric transducers. These include the straight-beam contact type, the angle-beam contact type, the dual-element contact type, and the immersion type. The article concludes with information on immersion or contact type focused search units.